Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

• US 20060003673A1
• Filed: 08/18/2005
• Published: 01/05/2006
• Est. Priority Date: 08/31/1999
• Status: Active Grant

• Current Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Original Assignee: NEC Electronics Corporation (Renesas Electronics Corporation)
• Inventors: Moore, Scott E.
• Granted Patent: US 7,172,491 B2
• Time in Patent Office: Days
• US Class Current: 451/5
• CPC Class Codes: B24B 49/006 taking regard of the speed
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24B 53/12 Dressing tools; Holders therefor

Abstract

A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Claims

1-66. -66. (canceled)

67. A method for controlling conditioning of a planarizing medium used for planarizing a microelectronic substrate, the method comprising:

engaging a conditioning body with the planarizing medium and moving at least one of the conditioning body and the planarizing medium relative to the other of the conditioning body and the planarizing medium while the conditioning body engages the planarizing medium;

detecting a frictional force between the conditioning body and the planarizing medium; and

controlling at least one of a force between the conditioning body and the planarizing medium and a speed of the conditioning body relative to the planarizing medium in response to detecting the frictional force between the conditioning body and the planarizing medium.

68. The method of claim 67 wherein controlling a force between the conditioning body and the planarizing medium includes receiving a force signal from a force sensor and transmitting a command signal to an actuator coupled to the conditioning body.

69. The method of claim 68 wherein receiving the force signal includes receiving the force signal with a microprocessor and transmitting a command signal includes transmitting the command signal from the microprocessor.

70. The method of claim 67 wherein controlling a force includes adjusting a force on the conditioning body that is approximately normal to a planarizing surface of the planarizing medium.

72. The method of claim 67 wherein controlling a speed of the conditioning body relative to the planarizing medium includes moving the conditioning body radially relative to the planarizing medium.

73. The method of claim 68 wherein controlling a speed of the conditioning body includes rotating at least one of the conditioning body and the planarizing medium relative to the other about an axis generally normal to the planarizing medium.

71. (canceled)

74. A method for monitoring a polishing pad used for planarizing a microelectronic substrate, the method comprising:

engaging a conditioning body with a planarizing surface of the polishing pad;

applying a force to the polishing pad via the conditioning body;

moving at least one of the polishing pad and the conditioning body relative to the other of the polishing pad and the conditioning body; and

detecting a frictional force of the polishing pad on the conditioning body in a plane of the planarizing surface.

75. The method of claim 74 wherein applying a force includes applying a force to the conditioning body different than a weight of the conditioning body.

76. The method of claim 74 wherein the force is a first force, further comprising conditioning the polishing pad by applying a second force to the conditioner greater than the first force to remove material from the planarizing surface of the polishing pad.

77. The method of claim 74 wherein the polishing pad is a first polishing pad and the frictional force is a first frictional force, further comprising:

applying a force to a second polishing pad via the conditioning body;

moving at least one of the second polishing pad and the conditioning body relative to the other of the second polishing pad and the conditioning body;

detecting a second frictional force of the second polishing pad on the conditioning body in a plane of the planarizing surface; and

comparing the first and second frictional forces.