Design mechanism for semiconductor fab-wide data warehouse application

• US 20060004786A1
• Filed: 06/07/2004
• Published: 01/05/2006
• Est. Priority Date: 06/07/2004
• Status: Abandoned Application

• Current Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Original Assignee: Taiwan Semiconductor Manufacturing Company Limited
• Inventors: Chen, Shun-An, Wang, Shinn-Chih
• Application Number:
  US10/862,207
• Publication Number:
  US 20060004786A1
• Time in Patent Office: Days
• US Class Current: 1/1
• CPC Class Codes: G06Q 10/06 Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
• CPC Class Codes: G06Q 50/04 Manufacturing
• CPC Class Codes: Y02P 90/30 Computing systems specially adapted for manufacturing

Abstract

A method and system for collecting, storing and accessing semiconductor manufacturing data in a storage entity are provided. The semiconductor manufacturing data is collected from at least one process tool and stored in a first predefined area of the storage entity until the data storing in the first predefined area is complete, at which time additional semiconductor manufacturing data may be stored in a second predefined area of the storage entity. After the storing of data in the first predefined area is complete, it may be accessed.

Claims

1. A method for collecting, storing and accessing semiconductor manufacturing data in a storage entity, the method comprising:

collecting the semiconductor manufacturing data from at least one process tool;

storing the semiconductor manufacturing data in a first predefined area of the storage entity until the storing of semiconductor manufacturing data in the first predefined area is complete;

accessing subsequently the semiconductor manufacturing data in the first predefined area of the storage entity; and

storing additional semiconductor manufacturing data in a second predefined area of the storage entity after the storing of semiconductor manufacturing data in the first predefined area is complete.

2. The method of claim 1, wherein the storage entity is a database.

3. The method of claim 1, additionally comprising the step of:

collecting the semiconductor manufacturing data from at least one process tool for a predetermined period prior to storing.

4. The method of claim 3, wherein the predetermined period represents a period for processing a single lot of wafers by the process tool.

5. The method of claim 1, further comprising the step of:

normalizing the semiconductor manufacturing data from the at least one process tool prior to storing it in the storage entity.

6. The method of claim 1, further comprising the step of:

storing the semiconductor manufacturing data from the at least one process tool in a data collector utilizing bind variables prior to storing it in the storage entity.

7. The method of claim 1, wherein the first predefined area and the second predefined area are data tables.

8. The method of claim 7, further comprising the step of:

organizing the data tables into data groups.

9. The method of claim 8, further comprising the step of:

determining a data group associated with data stored for a predetermined date; and

accessing data from the data group associated with data stored for the predetermined date.

10. A computer-readable medium having stored thereon sequences of instructions for responding to a request for collecting, storing and accessing semiconductor manufacturing data in a storage entity, the sequence of instructions including instructions for performing the steps of:

collecting the semiconductor manufacturing data from at least one process tool;

storing the semiconductor manufacturing data in a first predefined area of the storage entity until the storing of semiconductor manufacturing data in the first predefined area is complete;

accessing subsequently the semiconductor manufacturing data in the first predefined area of the storage entity; and

storing additional semiconductor manufacturing data in a second predefined area of the storage entity after the storing of semiconductor manufacturing data in the first predefined area is complete.

11. The computer-readable medium of claim 10, wherein the storage entity is a database.

12. The computer-readable medium of claim 10, further comprising the step of:

collecting the semiconductor manufacturing data from at least one process tool for a predetermined period prior to storing.

13. The computer-readable medium of claim 12, wherein the predetermined period represents a period for processing a single lot of wafers by the process tool.

14. The computer-readable medium of claim 10, further comprising the step of:

normalizing the semiconductor manufacturing data from the at least one process tool prior to storing it in the storage entity.

15. The computer-readable medium of claim 10, further comprising the step of:

storing the semiconductor manufacturing data from the at least one process tool in a data collector utilizing bind variables prior to storing it in the storage entity.

16. The computer-readable medium of claim 10, wherein the first predefined area and the second predefined area are data tables.

17. The computer-readable medium of claim 16, further comprising the step of:

organizing the data tables into data groups.

18. The computer-readable medium of claim 17, further comprising the step of:

determining data group associated with data stored for a predetermined date; and

accessing data from the data group associated with data stored for the predetermined date.

19. A system for collecting, storing and accessing semiconductor manufacturing data from at least one process tool in a storage entity, the system comprising:

a storage entity having at least two predetermined areas for storing data;

a data collector configured to receive semiconductor manufacturing data from at least one process tool and store the data in the at least two predetermined areas in the storage entity; and

a data inquirer connected to the storage entity to access the semiconductor manufacturing data in each predetermined area in the storage entity after the storing of semiconductor manufacturing data in each predefined area is complete.

20. The system of claim 19, wherein the storage entity is a database.

21. The system of claim 19, wherein the data collector collects the semiconductor manufacturing data for a predetermined period of time prior to storing the semiconductor manufacturing data in the storage entity.

22. The system of claim 21, wherein the predetermined period of time represents a period for processing a single lot of wafers by the process tool.

23. The system of claim 19, wherein the data collector normalizes the semiconductor manufacturing data from the at least one process tool prior to storing it in the storage entity.

24. The system of claim 19, wherein the data collector utilizes bind variables in the collection and storing of the semiconductor manufacturing data from the at least one process tool.

25. The system of claim 19, wherein at least two predetermined areas for storing data are data tables.

26. The system of claim 25, wherein the data tables are organized into data groups.