Manufacturing method of a multi-layer circuit board with an embedded passive component

• US 20060005384A1
• Filed: 07/06/2005
• Published: 01/12/2006
• Est. Priority Date: 07/06/2004
• Status: Abandoned Application

• Current Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Original Assignee: Advanced Semiconductor Engineering Inc (ASE Technology Holding Co., Ltd.)
• Inventors: Wang, Yung-Hui, Hung, Ching-Fu
• Application Number:
  US11/174,534
• Publication Number:
  US 20060005384A1
• Time in Patent Office: Days
• US Class Current: 29/832
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 1/188 manufactured by mounting on or attaching to a structure having a conductive layer, e.g. a metal foil, such that the terminals of the component are connected to or adjacent to the conductive layer before embedding, and by using the conductive layer, which is patterned after embedding, at least partially for connecting the component
• CPC Class Codes: H05K 2201/0355 Metal foils
• CPC Class Codes: H05K 2201/10636 Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 3/321 by conductive adhesives
• CPC Class Codes: H05K 3/4652 Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern H05K3/4647 takes precedence
• CPC Class Codes: Y02P 70/50 Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 29/49126 Assembling bases
• CPC Class Codes: Y10T 29/49128 Assembling formed circuit to base
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.

Abstract

A manufacturing method of a multi-layer circuit board with an embedded passive component includes: providing a conductive layer which has a first surface and a second surface; forming a metal paste on the first surface to form metal joints; using a sintering process to connect a passive element to the corresponding metal joints; stacking a core substrate and an organic isolated layer on the first surface of the conductive layer; and forming electrical pattern connecting to the passive element on the second surface of the conductive layer.

Claims

1. A manufacturing method of a multi-layer circuit board with an embedded passive component, comprising:

providing a conductive foil, wherein the conductive foil has a first surface and a second surface;

forming a metal paste on the first surface to form a metal contact;

connecting a passive component to the corresponding metal contact by using a sintering process;

stacking a core substrate and an organic insulation layer on the first surface of the conductive foil, wherein the organic insulation layer is located between the conductive foil and the core substrate, wherein the passive component is embedded in the organic insulation layer; and

patterning the conductive foil.

2. The manufacturing method according to claim 1, wherein the conductive foil is a copper foil.

3. The manufacturing method according to claim 1, wherein the metal paste is a copper paste.

4. The manufacturing method according to claim 3, wherein the copper paste includes aluminum oxide and copper powers.

5. The manufacturing method according to claim 3, wherein the copper paste includes copper oxide and glass.

6. The manufacturing method according to claim 1, wherein the passive component is selected from a group consisting of a capacitor, an inductance and a resistor.

7. The manufacturing method according to claim 1, wherein the core substrate is a double-layer circuit board.

8. The manufacturing method according to claim 1, wherein the core substrate is a multi-layer circuit board.

9. The manufacturing method according to claim 1, wherein the core substrate is made of an insulating material.

10. The manufacturing method according to claim 1, wherein the organic insulation layer is made of a prepreg material.

11. The manufacturing method according to claim 1, wherein the organic insulation layer is made of epoxy resin.

12. The manufacturing method according to claim 1, wherein the stacking step includes hot-pressing.

13. The manufacturing method according to claim 1, wherein in the connecting step by using the sintering process, sintering temperature is lower than 700 degrees centigrade.

14. The manufacturing method according to claim 13, wherein in the connecting step by using sintering process, the sintering temperature is 600 degrees centigrade.

15. The manufacturing method according to claim 1, wherein the step of forming the electrical pattern comprises:

penetrating the core substrate, the organic insulation layer and the conductive foil to form a through-hole via;

forming a metal layer on the second surface of the conductive foil and an inner wall of the through-hole via; and

patterning the metal layer of the second surface.

16. The manufacturing method according to claim 15, wherein the metal layer is made of copper.

17. The manufacturing method according to claim 1, wherein the step of forming an electrical pattern comprises:

penetrating the organic insulation layer and the conductive foil to form a blind via;

forming a metal layer on the second surface of the conductive foil and the inner wall of the blind via; and

patterning the metal layer.

18. The manufacturing method according to claim 17, wherein the metal layer is made of copper.

19. The manufacturing method according to claim 17, wherein the core substrate further comprises a buried via electrically connected to the blind via.