Apparatus and method of shaping profiles of large-area PECVD electrodes

• US 20060005771A1
• Filed: 06/02/2005
• Published: 01/12/2006
• Est. Priority Date: 07/12/2004
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Choi, Soo Young, White, John M., Tiner, Robin L., Beer, Emanuel, Chang, Wei
• Application Number:
  US11/143,506
• Publication Number:
  US 20060005771A1
• Time in Patent Office: Days
• US Class Current: 118/728
• CPC Class Codes: C23C 16/4583 the substrate being supported substantially horizontally
• CPC Class Codes: H01J 2237/3325 large area
• CPC Class Codes: H01J 37/3244 Gas supply means

Abstract

An apparatus and method for shaping profiles of a large-area PECVD electrode is provided. A plasma-enhanced CVD chamber for processing a large-area substrate is first provided. The chamber includes a lower electrode that supports a large area substrate. The lower electrode is shaped to selectively conform the supported substrate in a selected orientation under operating conditions. The orientation may be either planar or nonplanar. The substrate complies with the shape of the electrode so the substrate is substantially parallel to an upper electrode in the chamber, and/or to a gas diffusion plate in the chamber. The lower electrode comprises a substrate support fabricated from a material of insufficient strength to support itself at operating temperatures and pressure in the chamber. The shape of the substrate support is adjusted by modifying the dimensions and/or planarity of a supporting base structure, and/or by appropriately varying the thickness of the substrate support.

Claims

1. A plasma-enhanced chemical vapor deposition (PECVD) chamber for processing a large-area substrate, comprising:

an upper electrode; and

a lower electrode which supports the substrate, the lower electrode comprising;

a substrate support fabricated from a material of insufficient strength to rigidly support itself under operating conditions; and

a base structure that is pre-shaped to support the substrate support such that the substrate support deforms to place the substrate in a desired orientation with the upper electrode at operating conditions.

2. The chamber of claim 1, wherein the substrate support is fabricated from a thermally conductive metal, and is configured to receive the substrate.

3. The chamber of claim 2, wherein the substrate support is fabricated from aluminum.

4. The chamber of claim 1, wherein the base structure is pre-shaped in a nonplanar shape to support the substrate support in the desired orientation relative to the upper electrode.

5. The chamber of claim 1, wherein the base structure is fabricated from a material that has sufficient strength to support itself in a substantially rigid orientation under operating conditions.

6. The chamber of claim 4, wherein the base structure is a lattice-type base structure.

7. The chamber of claim 6, wherein the lattice-type base structure comprises at least one ceramic base plate oriented in a first direction, and at least two ceramic support plates disposed on the at least one base plate, and oriented generally transverse to the at least one base plate.

8. The chamber of claim 4, wherein the nonplanar shape of the base structure is created by providing shims at selected locations on a top surface of the base structure.

9. The chamber of claim 1, wherein the substrate support has a variable thickness to provide a nonplanar shape to the substrate support before being exposed to operating conditions.

10. The chamber of claim 9, wherein the substrate support is concave before being placed on the pre-shaped base structure and conforms to the desired orientation after being placed on the base structure under operating conditions.

11. The chamber of claim 1, wherein the substrate support bows into a the desired orientation when supported by the base structure under operating conditions.

12. The chamber of claim 4, wherein the desired orientation is a convex shape relative to the upper electrode when supported by the base structure under operating conditions.

13. The chamber of claim 4, wherein the desired orientation is a concave shape relative to the upper electrode when supported by the base structure under operating conditions.

14. The chamber of claim 1, wherein the upper electrode is one of concave or convex relative to a substantially planar supported substrate.

15. The chamber of claim 1, wherein the chamber further comprises:

a gas diffuser adjacent the lower electrode that is nonplanar; and

the substrate support and supported substrate conforms to desired orientation relative the gas diffuser under operating conditions.

16. The chamber of claim 15, wherein the gas diffuser is a concave shape and the desired orientation is a convex shape.

17. A substrate support assembly for supporting a large-area substrate in a plasma-enhanced chemical vapor deposition (PECVD) chamber, the chamber having an upper electrode, and the substrate support assembly comprising:

(a) a substrate support serving as a lower electrode, the substrate support;

being fabricated substantially from a thermally conductive metal,

being configured to receive the substrate, and

having a shape that compensates for thermal and pressure induced planarity changes of the substrate support during substrate processing; and

(b) a base structure for supporting the substrate support, the base structure having sufficient strength to rigidly support itself under operating conditions.

18. The substrate support assembly of claim 17, wherein the base structure comprises at least one ceramic base plate oriented in a first direction, and at least two ceramic support plates disposed on the at least one base plate and oriented generally transverse to the at least one base plate.

19. The substrate support assembly of claim 18, wherein the substrate support and supported substrate are oriented in a manner that is substantially parallel to the upper electrode under operating conditions.

20. The substrate support assembly of claim 19, wherein the planarity of the substrate support and supported substrate is further affected under operating conditions by modifying the planarity of the base structure.

31. The method of claim 20, wherein:

the gas diffuser is convex; and

the desired orientation is concave.

21. A method of shaping an electrode in a plasma-enhanced chemical vapor deposition (PECVD) chamber, comprising the steps of:

providing an upper electrode in the chamber;

providing a substrate support in the chamber to receive a large-area substrate and to serve as a lower electrode in the chamber, the substrate support being fabricated from a thermally conductive metal of insufficient strength to rigidly support itself under operating conditions; and

providing a base structure for supporting the substrate support that is fabricated from a material that has sufficient strength to rigidly support itself under operating conditions, and that is pre-shaped to support the substrate support and supported substrate such that the substrate support deforms to place the substrate in a desired orientation with the upper electrode at operating conditions.

22. The method of claim 21, wherein the base structure is a lattice-type structure comprising at least one ceramic base plate oriented in a first direction, and at least two ceramic support plates disposed on the at least one base plate and oriented generally transverse to the at least one base plate.

23. The method of claim 21, wherein the base structure is pre-shaped in a nonplanar shape to support the substrate support and supported substrate in the desired orientation relative to the upper electrode.

24. The method of claim 23, wherein each of the at least two ceramic support plates has at least one shim disposed on the top surface of the support plate at a selected location.

25. The method of claim 23, wherein the substrate support has a variable thickness to provide a nonplanar shape to the substrate support before being exposed to operating conditions.

26. The method of claim 25, wherein the substrate support is concave before being placed on the base structure and substantially planar after being placed on the base structure under operating conditions.

27. The method of claim 25, wherein the substrate support is convex before being placed on the base structure and substantially planar after being placed on the base structure under operating conditions.

28. The method of claim 25, wherein the substrate support and supported substrate bow into a substantially planar shape when supported by the base structure under operating conditions.

29. The method of claim 25, wherein the upper electrode is concave.

30. The method of claim 21:

further comprising the step of providing a nonplanar gas diffusion plate in the chamber above the lower electrode, the plate having a plurality of gas distribution nozzles; and

injecting process gas through the nonplanar gas diffusion plate and into a processing region of the chamber; and

wherein the substrate support and supported substrate conform to a shape that is substantially parallel to the gas diffuser under operating conditions.

32. A plasma-enhanced chemical vapor deposition (PECVD) chamber for processing a large-area substrate, comprising:

a nonplanar upper electrode;

a substrate support assembly disposed below the upper electrode and supporting the substrate, wherein a processing region is formed between the upper electrode and the substrate support assembly;

a gas diffusion plate for diffusing gases into the processing region and onto the substrate; and

a lower electrode within the substrate support assembly, the lower electrode being shaped to selectively place the supported substrate in a nonplanar profile under operating conditions.

33. The chamber of claim 32, wherein the gas diffusion plate has a nonplanar profile.