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Thermoelectric heat dissipation device and method for fabricating the same

  • US 20060005944A1
  • Filed: 07/06/2004
  • Published: 01/12/2006
  • Est. Priority Date: 07/06/2004
  • Status: Abandoned Application
First Claim
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1. A method for fabricating a thermoelectric heat dissipation device, comprising:

  • providing a base plate having one surface patterned with a plurality of first conductive lines;

    providing a heat sink having one surface patterned with a plurality of second conductive lines; and

    adhering a thermoelectric semiconductive element to be sandwiched between the base plate and the heat sink so that a plurality of P-N posts of the thermoelectric semiconductive element are electrically connected with the first and the second conductive lines, respectively.

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