Thermoelectric heat dissipation device and method for fabricating the same
First Claim
1. A method for fabricating a thermoelectric heat dissipation device, comprising:
- providing a base plate having one surface patterned with a plurality of first conductive lines;
providing a heat sink having one surface patterned with a plurality of second conductive lines; and
adhering a thermoelectric semiconductive element to be sandwiched between the base plate and the heat sink so that a plurality of P-N posts of the thermoelectric semiconductive element are electrically connected with the first and the second conductive lines, respectively.
1 Assignment
0 Petitions
Accused Products
Abstract
A method for fabricating a thermoelectric heat dissipation device including the steps of providing a base plate, a thermoelectric semiconductive element connected to the base plate and a heat sink in form of plates or fins with one surface coated an electric insulation coating and patterned conductive lines, and adhering the heat sink to the thermoelectric semiconductive element. Accrodingly, the thermoelectric heat dissipation device is provided including the theremoelectric semiconductive element as a cryogenic chip and the heat sink. The cooling surface of the cryogenic chip is directly electrically connected to the heat sink which is in form of plates or fins, and the other surface of the cryogenic chip is adhered to the base plate. The base plate of the device is utilized to connect with the surface of an electronic component for heat transfer.
77 Citations
10 Claims
-
1. A method for fabricating a thermoelectric heat dissipation device, comprising:
-
providing a base plate having one surface patterned with a plurality of first conductive lines;
providing a heat sink having one surface patterned with a plurality of second conductive lines; and
adhering a thermoelectric semiconductive element to be sandwiched between the base plate and the heat sink so that a plurality of P-N posts of the thermoelectric semiconductive element are electrically connected with the first and the second conductive lines, respectively. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A thermoelectric heat dissipation device comprising:
-
a thermoelectric semicondutive element;
a base plate with a plurality of first conductive lines patterned on one surface thereof so as to be adhered to one end of the semiconductive element; and
a heat sink with a plurality of conductive lines patterned on one surface thereof so as to be stacked on the other end of the thermoelectric semiconductive element. - View Dependent Claims (8, 9, 10)
-
Specification