Electrochemically fabricated microprobes

• US 20060006888A1
• Filed: 09/24/2004
• Published: 01/12/2006
• Est. Priority Date: 02/04/2003
• Status: Abandoned Application

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Zhang, Gang, Cohen, Adam L., Arat, Vacit, Kim, Kieun, Bang, Christopher A., Kruglick, Ezekiel J. J., Chen, Richard T.
• Application Number:
  US10/949,738
• Publication Number:
  US 20060006888A1
• Time in Patent Office: Days
• US Class Current: 324/754.140
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06733 Geometry aspects G01R1/06727 takes precedence
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Multilayer probe structures for testing semiconductor die are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. In some embodiments the structures may include generally helical shaped configurations, helical shape configurations with narrowing radius as the probe extends outward from a substrate, bellows-like configurations, and the like. In some embodiments arrays of multiple probes are provided.

Claims

1. A probe device for testing semiconductor die, comprising:

a substrate;

a multi-turn compliant helical conductive element having a proximal end attached directly or indirectly to the substrate, and having a distal end that may be used to contact a pad to be tested.

2. A probe device for testing semiconductor die, comprising:

a substrate;

a multi-turn compliant, conical helical conductive element adhered directly or indirectly to the substrate and extending substantially perpendicular to the substrate along a winding path of progressively narrowing radius, where a distal end of the probe is substantially located at a point along an axis of helix and may be used to contact a pad to be tested.

3. A probe device for testing semiconductor die, comprising:

a substrate; and

a multi-turn helical conductive element adhered directly or indirectly to the substrate and extending substantially perpendicular to the substrate along a spiraling path where a plurality of successive layers define the spiraling path such that it includes a pattern of deposited structural material along a given layer that only partially overlays a pattern of deposited structural material on an immediately preceding layer.

4. A plurality of probes for testing semiconductor die at least some of which were formed in separate formation processes, comprising:

a plurality of probes formed from a plurality of adhered layers of at least one desired material, each probe having a compliance;

at least one substrate for holding a plurality of probes;

wherein the maximum compliance difference between a plurality of probes is less than a summation, for each layer of the plurality of probes, of an absolute value of a maximum difference between compliance associated with portions of the probes on each consecutive pair of layers.

5. A plurality of separate probes for testing semiconductor die, comprising:

a substrate;

a plurality of multi-turn helical conductive elements, each having a proximal end attached directly or indirectly to the substrate, and having a distal end that may be used to contact a pad to be tested, and each formed from a plurality of adhered layers;

wherein the spacing between portions of each probe formed on each layer is greater than a spacing between each probe element.

6. A plurality of separate probes for testing semiconductor die, comprising:

a substrate;

a plurality of multi-turn helical conductive elements, each having a proximal end attached directly or indirectly to the substrate, and having a distal end that may be used to contact a pad to be tested, and each formed from a plurality of adhered layers;

wherein the probes overlap in space but do not contact one another during anticipated levels of compression during use.

7. A probe device for testing semiconductor die, comprising:

a substrate;

a bellow-like, compliant, conductive element having a proximal end attached directly or indirectly to the substrate, and having a distal end that may be used to contact a pad to be tested.