Flexible test head internal interface

• US 20060006892A1
• Filed: 12/11/2002
• Published: 01/12/2006
• Est. Priority Date: 12/14/2001
• Status: Abandoned Application

• Current Assignee: inTEST Corporation
• Original Assignee: inTEST Corporation
• Inventors: Spear, Charles, Green, Roy W, Cruz, Rex, Tejeda, Victor
• Application Number:
  US10/498,711
• Publication Number:
  US 20060006892A1
• Time in Patent Office: Days
• US Class Current: 324/754.30
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H05K 1/147 at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit H05K1/148 takes precedence

Abstract

A connection module for use with a test head system is provided, the test head system including a test head for testing devices. The connection module includes a plurality of flexible circuits for transmitting and receiving signals between electronics in the test head and a device to be tested. The connection module also includes connection points on a first end of each of the flexible circuits for connecting the flexible circuits to the electronics in the test head.

Claims

1. A connection module for use with a test head system, the test head system including a test head for testing devices, said connection module comprising:

a plurality of flexible circuits for transmitting and receiving signals between electronics in the test head and a device to be tested; and

connection points on a first end of each of said flexible circuits for connecting said flexible circuits to the electronics in the test head.

2. The connection module of claim 1 wherein each of said flexible circuits includes a plurality of conductive paths.

3. The connection module of claim 1 wherein each of said flexible circuits includes at least one signal conductive path and one ground conductive path.

4. The connection module of claim 1 wherein at least one of said flexible circuits includes a plurality of layers.

5. The connection module of claim 4 wherein said at least one of said flexible circuits includes three insulative layers and two conductive layers arranged such that each of said two conductive layers is surrounded by a respective two of said three insulative layers.

6. The connection module of claim 5 wherein one of said conductive layers is a signal layer, and the other of said conductive layers is a ground layer.

7. The connection module of claim 6 wherein said signal layer and said ground layer each include a plurality of conductive paths.

8. The connection module of claim 6 wherein said signal layer includes a plurality of conductive paths, and said ground layer includes a single conductive plane.

9. The connection module of claim 5 wherein at least one of said conductive layers includes signal conductors and ground conductors.

10. The connection module of claim 3 wherein said at least one signal conductive path includes a strip line.

11. The connection module of claim 1 wherein the width of at least one of said plurality of flexible circuits varies along the length of said at least one flexible circuit.

12. The connection module of claim 1 wherein each of said plurality of flexible circuits includes a pin electronics end for connecting to the electronics in the test head and an interface end for providing interconnection with the device to be tested.

13. The connection module of claim 12 wherein said interface end includes a plurality of conductive plated through holes for mating with respective conductive posts, the conductive posts providing interconnection with the device to be tested.

14. The connection module of claim 12 wherein said interface end includes a plurality of conductive posts for mating with respective conductive plated through holes, the conductive plated through holes providing interconnection with the device to be tested.

15. The connection module of claim 13 wherein each of said conductive posts is connected to a spring-loaded contact pin receptacle for receiving a spring-loaded contact pin, said spring-loaded contact pin providing interconnection with the device to be tested.

16. The connection module of claim 12 wherein each of said plurality of flexible circuits includes a interface connector block at the interface end, said interface connector block defining a plurality of female receptacles for mating with a respective plurality of conductive posts, the conductive posts providing interconnection with the device to be tested.

17. The connection module of claim 12 wherein each of said plurality of flexible circuits includes a interface connector block at the interface end, said interface connector block including a plurality of conductive posts for mating with a respective plurality of female receptacles, the female receptacles providing interconnection with the device to be tested.

18. The connection module of claim 16 wherein each of said conductive posts is connected to a spring-loaded contact pin receptacle for receiving a spring-loaded contact pin, said spring-loaded contact pin providing interconnection with the device to be tested.

19. The connection module of claim 12 wherein each of said plurality of flexible circuits includes a pin electronics connector block at the pin electronics end, said pin electronics connector block defining a plurality of female receptacles for mating with a respective plurality of conductive posts, the conductive posts providing interconnection with the electronics in the test head.

20. The connection module of claim 12 wherein each of said plurality of flexible circuits includes a pin electronics connector block at the pin electronics end, said pin electronics connector block including a plurality of conductive posts for mating with a respective plurality of female receptacles, the female receptacles providing interconnection with the electronics in the test head.

21. The connection module of claim 12 wherein the pin electronics end includes a plurality of conductive tabs configured to mate with at least one zero insertion force connector, said zero insertion force connector providing interconnection between the plurality of conductive tabs and electronics in the test head.

22. The connection module of claim 12 wherein the pin electronics end includes at least one zero insertion force connector for mating with a plurality of conductive tabs, said conductive tabs providing interconnection between the zero insertion force connector and electronics in the test head.

23. The connection module of claim 1 wherein at least one of said flexible circuits includes auxilliary electrical circuits for the test head system.

24. The connection module of claim 1 wherein said flexible circuits include a material selected from the group consisting of fluoropolymer film, aramid fiber-based paper, aramid fiber-based cloth, formable composite, flexible epoxy based composite, and thermoplastic film.

25. The connection module of claim 1 wherein said flexible circuits comprise a patterned arrangement of printed wiring and a flexible base material.

26. An interface for providing interconnection between a test head and a device to be tested, said interface comprising:

a plurality of connection modules, each of said connection modules including a plurality of flexible circuits for transmitting and receiving signals between electronics in the test head and the device to be tested; and

a device interface providing interconnection between at least one of said plurality of connection modules and the device to be tested.

27. The interface of claim 26 wherein said plurality of connection modules are radially arranged and define a center hole in said interface for aligning with a viewing hole of the test head.

28. The interface of claim 26 wherein the width of at least one of said plurality of flexible circuits varies along the length of said at least one flexible circuit.

29. The interface of claim 26 wherein said flexible circuits include a material selected from the group consisting of fluoropolymer film, aramid fiber-based paper, aramid fiber-based cloth, formable composite, flexible epoxy based composite, and thermoplastic film.

30. The interface of claim 26 wherein said flexible circuits comprise a patterned arrangement of printed wiring and a flexible base material.

31. A test head system comprising:

a test head including a plurality of electronic circuits; and

an interface for providing interconnection between said test head and a device to be tested, said interface including a plurality of flexible circuits for transmitting and receiving signals between said plurality of electronic circuits and the device to be tested.

32. The test head system of claim 31 wherein the width of at least one of said plurality of flexible circuits varies along the length of said at least one flexible circuit.

33. The test head system of claim 31 wherein said flexible circuits include a material selected from the group consisting of fluoropolymer film, aramid fiber-based paper, aramid fiber-based cloth, formable composite, flexible epoxy based composite, and thermoplastic film.

34. The test head system of claim 31 wherein said flexible circuits comprise a patterned arrangement of printed wiring and a flexible base material.

35. A method of connecting a test head to a device to be tested comprising the steps of:

providing at least one connection module, said connection module including,

a plurality of flexible circuits for transmitting and receiving signals between electronics in the test head and the device to be tested; and

connecting said connection module between electronics in the test head and the device to be tested.

36. A method of modifying a test head system comprising the steps of:

removing a first flexible circuit from said test head system, the first flexible circuit having a first configuration for exchanging signals between electronics in a test head and a device to be tested, and

replacing the first flexible circuit with a second flexible circuit having a second configuration, the second flexible circuit for exchanging signals between the electronics in the test head and a device to be tested, the first configuration being different from the second configuration.

37. A method of modifying a test head system comprising the steps of:

removing a first connection module from the test head system, the first connection module having a first configuration and including a plurality of flexible circuits for exchanging signals between electronics in a test head and a device to be tested; and

replacing the first connection module with a second connection module having a second configuration, the second connection module including a plurality of flexible circuits for exchanging signals between the electronics in the test head and a device to be tested, the first configuration being different from the second configuration.

38. A method of modifying a test head system comprising the steps of:

providing a flexible circuit configured for transmitting and receiving signals between electronics in a test head and a device to be tested; and

adding the flexible circuit to the test head system.

39. A method of assembling a test head system, the test head system including a test head for testing devices, the method comprising the steps of:

providing a plurality of connection modules, each of said connection modules including a plurality of flexible circuits for transmitting and receiving signals between electronics in the test head and the device to be tested; and

assembling an interface for providing interconnection between the test head and the device to be tested, said step of assembling including arranging said connection modules in a predetermined configuration.