FEATURE DIMENSION DEVIATION CORRECTION SYSTEM, METHOD AND PROGRAM PRODUCT
First Claim
1. A method for correcting a deviation of a dimension of a feature from a target in a semiconductor process, the method comprising the steps of:
- first measuring the feature prior to conducting a process relative to the feature to obtain an incoming feature dimension;
conducting the process based on a process model;
second measuring the feature after conducting the process to obtain an outgoing feature dimension;
determining an origin of any deviation of the outgoing feature dimension from a target structure dimension; and
adjusting, according to the origin, at least one of the measuring steps and the process conducting step to correct for any deviation.
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Abstract
A system, method and program product for correcting a deviation of a dimension of a feature from a target in a semiconductor process, are disclosed. The invention determines an origin of a deviation in a feature dimension from a target dimension regardless of whether it is based on processing or metrology. Adjustments for wafer processing variation of previous process tools can be fed forward, and adjustments for the process and/or integrated metrology tools may be fed back automatically during the processing of semiconductor wafers. The invention implements process reference wafers to determine the origin in one mode, and measurement reference wafers to determine the origin of deviations in another mode.
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Citations
30 Claims
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1. A method for correcting a deviation of a dimension of a feature from a target in a semiconductor process, the method comprising the steps of:
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first measuring the feature prior to conducting a process relative to the feature to obtain an incoming feature dimension;
conducting the process based on a process model;
second measuring the feature after conducting the process to obtain an outgoing feature dimension;
determining an origin of any deviation of the outgoing feature dimension from a target structure dimension; and
adjusting, according to the origin, at least one of the measuring steps and the process conducting step to correct for any deviation. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A system for correcting a deviation of a dimension of a feature from a target in a semiconductor process, the system comprising:
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means for first measuring the feature prior to conducting a process relative to the feature to obtain an incoming feature dimension;
means for conducting the process based on a process model;
means for second measuring the feature after conducting the process to obtain an outgoing feature dimension;
means for determining an origin of any deviation of the outgoing feature dimension from a target structure dimension; and
means for adjusting, according to the origin, at least one of the measuring means and the process conducting means to correct for any deviation. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21)
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22. A computer program product comprising a computer useable medium having computer readable program code embodied therein for correcting a deviation of a dimension of a feature from a target in a semiconductor process, the program product comprising:
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program code configured to control means for first measuring the feature prior to conducting a process relative to the feature to obtain an incoming feature dimension;
program code configured to control a processing tool that conducts the process based on a process model;
program code configured to control means for second measuring the feature after conducting the process to obtain an outgoing feature dimension;
program code configured to determine an origin of any deviation of the outgoing feature dimension from a target structure dimension; and
program code configured to generate an adjustment, according to the origin, for at least one of the measuring means and the processing tool to correct for any deviation. - View Dependent Claims (23, 24, 25, 26, 27, 28, 29, 30)
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Specification