Integrated liquid cooling device for electronic components
First Claim
1. An apparatus for cooling at least one electronic component comprising:
- a housing thermally connected to the electronic component and having cooling surfaces;
cooling liquid contained in the housing; and
a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing.
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Accused Products
Abstract
An integrated liquid cooling device for electronic components addresses the need for efficient cooling created by ever increasing power densities of electronic components. The integrated liquid cooling device has a housing thermally connected to the electronic component, cooling liquid contained in the housing, a motor immersed in the cooling liquid and mounted to the housing, an impeller driven by the motor, and cooling surfaces on the exterior of the housing. The motor driven impeller creates a turbulent flow in the cooling liquid, which rapidly transfers heat from the electronic component and distributes it throughout the interior of the housing. The cooling surfaces on the exterior of the housing dissipate this heat, either by free or forced convection, into the surrounding environment. Alternately, the integrated liquid cooling device may distribute this heat energy over an equipment case by circulating cooling liquid through a baffled enclosure that provides high velocity cooling liquid flow near the heat generating electronic component. Additional cooling capacity can be gained with the described integrated liquid cooling device by selecting a cooling liquid whose boiling point is near the operating temperature of the electronic component.
38 Citations
26 Claims
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1. An apparatus for cooling at least one electronic component comprising:
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a housing thermally connected to the electronic component and having cooling surfaces;
cooling liquid contained in the housing; and
a motor mounted inside the housing and having an impeller operatively coupled to the motor, the impeller being adapted to being driven by the motor to circulate the cooling liquid within the housing. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A method of cooling an electronic component comprising the steps of:
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thermally connecting the electronic component to an apparatus comprising;
a housing containing a cooling liquid;
a motor mounted inside the housing;
an impeller driven by the motor; and
cooling surfaces thermally connected to the housing; and
activating the motor of the apparatus to drive the impeller such that the cooling liquid is circulated within the housing. - View Dependent Claims (26)
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Specification