Protective coating on a substrate and method of making thereof

• US 20060008676A1
• Filed: 07/06/2005
• Published: 01/12/2006
• Est. Priority Date: 07/07/2004
• Status: Abandoned Application

• Current Assignee: General Electric Company
• Original Assignee: General Electric Company
• Inventors: Ebata, Toshiki, Morikawa, Yuji
• Application Number:
  US11/175,237
• Publication Number:
  US 20060008676A1
• Time in Patent Office: Days
• US Class Current: 428/698
• CPC Class Codes: C04B 35/522 Graphite C04B35/536 takes precedence
• CPC Class Codes: C04B 35/583 based on boron nitride
• CPC Class Codes: C04B 41/009 characterised by the material treated
• CPC Class Codes: C04B 41/4529 applied from the gas phase
• CPC Class Codes: C04B 41/4531 by C.V.D.
• CPC Class Codes: C04B 41/5031 Alumina
• CPC Class Codes: C04B 41/5057 Carbides
• CPC Class Codes: C04B 41/5063 Aluminium nitride
• CPC Class Codes: C04B 41/5064 Boron nitride
• CPC Class Codes: C04B 41/52 Multiple coating or impregnating multiple coating or impregnating with the same composition or with compositions only differing in the concentration of the constituents, is classified as single coating or impregnation
• CPC Class Codes: C04B 41/522 Multiple coatings, for one of the coatings of which at least one alternative is described
• CPC Class Codes: C04B 41/87 Ceramics
• CPC Class Codes: C04B 41/89 for obtaining at least two superposed coatings having different compositions
• CPC Class Codes: C23C 14/0617 AIII BV compounds, where A is Al, Ga, In or Tl and B is N, P, As, Sb or Bi
• CPC Class Codes: C23C 14/22 characterised by the process of coating
• CPC Class Codes: C23C 16/303 Nitrides
• CPC Class Codes: C23C 16/4404 Coatings or surface treatment on the inside of the reaction chamber or on parts thereof
• CPC Class Codes: C23C 16/4581 characterised by material of construction or surface finish of the means for supporting the substrate
• CPC Class Codes: C23C 16/513 using plasma jets
• CPC Class Codes: H01L 21/68757 characterised by a coating or a hardness or a material
• CPC Class Codes: Y10T 428/30 : Self-sustaining carbon mass or layer with impregnant or other layer

Abstract

Disclosed herein is a protective coating having a compressive stress of less than 280 Mpa, for devices to be used in a corrosive environment such as halogen containing gases or halogen plasma atmosphere, e.g., wafer supporting device for use in semi-conductor processing assemblies such as electrostatic chucks, heaters, etc. The protective coating in one embodiment is crack-free, with a compressive stress of less than 250 Mpa. It is deposited onto at least one surface of the device via an ion-plating process, in which the Ar flow is kept below 5 sccm, and one embodiment, at 0 sccm, for a crack-free protective layer.

Claims

1. A protective layer for coating at least a surface of an article for use in a halogen-containing gas and/or plasma environment,

wherein said at least a surface comprises one of pyrolytic boron nitride, graphite, pyrolytic graphite, and combinations thereof,

wherein the protective layer has a compressive stress of less than 280 Mpa.

2. The protective layer of claim 1, wherein the protective layer has a compressive stress of less than 250 Mpa.

3. The protective layer of claim 1, wherein the protective layer comprises one of aluminum nitride, aluminum oxynitride, and combinations thereof.

4. The protective layer of claim 1, wherein the protective layer is deposited onto said at least a surface of an article via an ion plating method.

5. The protective layer of claim 4, wherein the protective layer is deposited onto said at least a surface of an article via an ion plating method.

6. The protective layer of claim 5, wherein ion plating method includes Argon as a non-reactive gas.

7. The protective layer of claim 6, wherein the Argon flow rate is kept below a rate of 10 sccm.

8. The protective layer of claim 7, wherein the Argon flow rate is kept below a rate of 5 sccm.

9. The protective layer of claim 1, wherein at least a surface comprises pyrolytic boron nitride.

10. The protective layer of claim 1, wherein the protective layer comprises aluminum nitride.

11. The protective layer of claim 1, wherein the protective layer has a thickness in the range between 3 μ

m to 200 μ

m.

12. The protective coating layer of claim 1, wherein the protective layer is substantially crack-free.

13. The protective coating layer of claim 1, wherein the layer has an etch resistance rate of less than 50 Angstroms per minute upon exposure to a halogen-containing gas and/or plasma environment.

14. The protective coating layer of claim 13, wherein the layer has an etch resistance rate of less than 40 Angstroms per minute upon exposure to a fluorine-containing gas and/or plasma environment.

16. The article of claim 13, wherein the protective coating layer has a compressive stress of less than 280 Mpa.

24. The protective layer of claim 1, wherein the layer is a multilayer.

25. The protective layer of claim 1, wherein the protective coating layer has an adhesion strength which exceeds the cohesive strength of the surface protected by said coating layer.

15. An article comprising a protective coating layer on at least one of its surfaces, said coating layer comprises at least one of aluminum nitride, aluminum oxynitride or combinations thereof,

and wherein the coating layer is substantially crack free when said article is exposed to fluorine containing gases and/or plasma.

17. A method for modifying the in-film stress in a protective coating layer of an article for use in a halogen-containing gas and/or plasma environment, said method comprising:

depositing a protective coating layer on at least one surface of the article, said coating layer comprising at least one of aluminum nitride, carbon and/or oxygen doped aluminum nitride, aluminum oxynitride or combinations thereof,

said at least one surface comprises at least one of pyrolytic boron nitride, pyrolytic graphite and/or carbon doped boron nitride, and combinations thereof;

wherein said protective coating layer is substantially crack free upon exposure to said halogen-containing gas and/or plasma environment.

18. The method of claim 17, wherein the deposited coating layer has a compressive stress of less than 280 Mpa.

19. The method of claim 17, wherein the protective coating layer is deposited on said at least one surface via an ion plating method.

20. The method of claim 19, wherein the ion plating method includes Ar as a non-reactive gas, and wherein the Ar gas flow rate is maintained at an average of less than 10 sccm.

21. The method of claim 17, wherein the protective coating layer has an adhesion strength which exceeds the cohesive strength of the surface protected by said coating layer.

22. The method of claim 17, wherein said at least one surface of the article is first protected by depositing at least a layer of pyrolytic boron nitride, pyrolytic graphite and/or carbon doped boron nitride on said surface.

23. An article manufactured the method of claim 28.