Mounting semiconductor chips
First Claim
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1. A method for applying semiconductor chips (3) to a substrate (2), comprising:
- applying molecules of a first type (1) to a substrate (2) surface on which semiconductor chips (3) are to be applied;
applying molecules of a second type (4) to a surface of a semiconductor chip (3), wherein the molecules of the second type are configured to bond to the molecules of the first type (1);
introducing the semiconductor chip (3) into a liquid (5);
positioning a drop (51) of the liquid (5) with not more than one semiconductor chip (3) on the substrate (2); and
evaporating the drop (51) of liquid (5) from the substrate (2), leaving the semiconductor chip on the substrate (2).
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Abstract
To mount semiconductor chips (3), the chips are placed in a liquid (5), and drops (51) of the liquid containing no more than one semiconductor chip are positioned on a substrate (2). On the substrate are molecules of a first type (1), on the semiconductor chips (3) are molecules of a second type (4) which can bond with the molecules of the first type (1). After the liquid (5) dries, the semiconductor chip (3) can be electrically contacted on the substrate (2) by conductive structures (21).
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Citations
17 Claims
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1. A method for applying semiconductor chips (3) to a substrate (2), comprising:
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applying molecules of a first type (1) to a substrate (2) surface on which semiconductor chips (3) are to be applied;
applying molecules of a second type (4) to a surface of a semiconductor chip (3), wherein the molecules of the second type are configured to bond to the molecules of the first type (1);
introducing the semiconductor chip (3) into a liquid (5);
positioning a drop (51) of the liquid (5) with not more than one semiconductor chip (3) on the substrate (2); and
evaporating the drop (51) of liquid (5) from the substrate (2), leaving the semiconductor chip on the substrate (2). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification