×

Mounting semiconductor chips

  • US 20060008943A1
  • Filed: 06/30/2005
  • Published: 01/12/2006
  • Est. Priority Date: 06/30/2004
  • Status: Active Application
First Claim
Patent Images

1. A method for applying semiconductor chips (3) to a substrate (2), comprising:

  • applying molecules of a first type (1) to a substrate (2) surface on which semiconductor chips (3) are to be applied;

    applying molecules of a second type (4) to a surface of a semiconductor chip (3), wherein the molecules of the second type are configured to bond to the molecules of the first type (1);

    introducing the semiconductor chip (3) into a liquid (5);

    positioning a drop (51) of the liquid (5) with not more than one semiconductor chip (3) on the substrate (2); and

    evaporating the drop (51) of liquid (5) from the substrate (2), leaving the semiconductor chip on the substrate (2).

View all claims
  • 1 Assignment
Timeline View
Assignment View
    ×
    ×