Method and system for managing, analyzing and automating data in the production of semiconductor wafers and for monitoring the production process

• US 20060009943A1
• Filed: 07/08/2005
• Published: 01/12/2006
• Est. Priority Date: 07/09/2004
• Status: Abandoned Application

• Current Assignee: ADE Corporation (KLA Corporation)
• Original Assignee: ADE Corporation (KLA Corporation)
• Inventors: Keck, Jay, Kallus, David M.
• Application Number:
  US11/177,781
• Publication Number:
  US 20060009943A1
• Time in Patent Office: Days
• US Class Current: 702/122
• CPC Class Codes: G01N 21/9501 Semiconductor wafers manufacturing processes per se of semiconductor devices implementing a measuring step H01L22/10
• CPC Class Codes: G05B 19/41875 characterised by quality surveillance of production
• CPC Class Codes: G05B 2219/2602 Wafer processing
• CPC Class Codes: G06F 16/248 Presentation of query results
• CPC Class Codes: G06Q 10/06 Resources, workflows, human or project management; Enterprise or organisation planning; Enterprise or organisation modelling
• CPC Class Codes: G06Q 50/04 Manufacturing
• CPC Class Codes: H01L 21/67005 Apparatus not specifically provided for elsewhere processes per se H01L21/30, H01L21/46, H01L23/00; simple temporary support means, e.g. using adhesives, electric or magnetic means H01L21/68, H01L21/302
• CPC Class Codes: H01L 21/67253 Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: Y02P 90/02 Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
• CPC Class Codes: Y02P 90/30 Computing systems specially adapted for manufacturing

Abstract

A system for integrating semiconductor wafer data for use in silicon manufacturing and device fabrication processes, the system including: a data acquisition system 00 capable of acquiring scan data from differing types of semiconductor wafer scanning tools such as wafer dimensional tools 10, wafer inspection tools 12, and wafer nanotopography tools 14, a buffer system 02 for providing temporary storage for scan data transmitted and for providing fault tolerance; a server system 04 for providing storage for the scan data transmitted from the buffer system 02 and for converting the scan data into a format used by and stored in a database 08 management system; and an analysis system 06, the analysis system 06 and the server system 04 providing wafer data management, process monitoring, wafer data analysis, and data automation.

Claims

1. A system for integrating semiconductor wafer data for use in silicon manufacturing and device fabrication processes, comprising:

a communications path;

a data acquisition system capable of acquiring scan data from differing types of semiconductor wafer scanning tools such as wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools, the data acquisition system being capable of communicating over the communications path;

a buffer system for providing temporary storage for scan data transmitted over the communications path from the data acquisition system and for providing fault tolerance;

a server system for providing storage for the scan data transmitted from the buffer system over the communications path, the server system converting the scan data into a format used by and stored in a database management system;

an analysis system communicating with the server system over the communications path, the analysis system and the server system being capable of providing wafer data management, process monitoring, wafer data analysis, and data automation.

2. The system of claim 1, wherein wafer data management further comprises:

a wafer data reuse subsystem for specifying scan data to be stored and reused through the selective retention and retrieval of scan data; and

a wafer data evaluation subsystem for evaluating scan data, the wafer data evaluation system being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes.

3. The system of claim 1, wherein wafer data management further comprises:

a wafer data evaluation subsystem for evaluating scan data, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

a scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems to enable a user to detect and correct process excursions.

4. The system of claim 1, wherein wafer data management further comprises:

a wafer data evaluation subsystem, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

a process control subsystem for operating data analysis and server system functions even while the data acquisition system is not operating.

5. The system of claim 1, wherein wafer data management further comprises:

a wafer data reuse subsystem for specifying scan data to be stored and reused through the selective retention and retrieval of scan data; and

a process control subsystem for operating data analysis and server system functions even while the data acquisition system is not operating.

6. The system of claim 1, wherein process monitoring further comprises:

a wafer data reuse subsystem for specifying scan data to be stored and reused through the selective retention and retrieval of scan data; and

a scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different to enable a user to detect and correct process excursions.

7. The system of claim 1, wherein process monitoring further comprises:

a wafer data reuse subsystem for specifying scan data to be stored and reused through the selective retention and retrieval of scan data; and

a process control subsystem for operating data analysis and server system functions even while the data acquisition system is not operating.

8. The system of claim 1, wherein process monitoring further comprises:

a wafer data evaluation subsystem the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

a scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems to enable a user to detect and correct process excursions.

9. The system of claim 1, wherein process monitoring further comprises:

a process control subsystem for operating data analysis and server system functions even while the data acquisition system is not operating; and

scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems to enable a user to detect and correct process excursions.

10. The system of claim 1, wherein wafer data analysis further comprises:

a wafer data evaluation subsystem for evaluating scan data, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

a wafer data reuse subsystem for specifying scan data to be stored and reused through the selective retention and retrieval of scan data.

11. The system of claim 1, wherein wafer data analysis further comprises:

a wafer data evaluation subsystem for evaluating scan data, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

a scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems to enable a user to detect and correct process excursions.

12. The system of claim 1, wherein wafer data analysis further comprises:

a wafer data evaluation subsystem for evaluating scan data, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

a process control subsystem for operating data analysis and server system functions even while the data acquisition system is not operating.

13. The system of claim 1, wherein wafer data automation further comprises:

a wafer data reuse subsystem for specifying scan data to be stored and reused through the selective retention and retrieval of scan data; and

a scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems, the scan data and communication sharing subsystem including options for automating transmissions and updates of scan data.

14. The system of claim 1, wherein wafer data automation further comprises:

a process control subsystem for operating data analysis and server system functions even while the data acquisition system is not operating; and

a scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems, the scan data and communication sharing subsystem including options for automating transmissions and updates of scan data.

15. The system of claim 1, wherein wafer data automation further comprises:

a wafer data evaluation subsystem for evaluating scan data, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

a scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems, the scan data and communication sharing subsystem including options for automating transmissions and updates of scan data.

16. The system of claim 1, wherein the server system further comprises a scan data and communication sharing system for sharing scan data with at least two users looking at scan data.

17. The system of claim 1, wherein the server system further comprises a scan data and communication sharing system for sharing the scan data with at least two users, each looking at scan data from a different type of wafer scanning tool system.

18. The system of claim 1, wherein the server system further comprises a scan data and communication sharing system for sharing the scan data with at least two users, each user working in a different capacity.

19. The system of claim 1, wherein the server system further comprises a scan data and communication sharing system for sharing the scan data with at least two users, each user being in a different location.

20. The system of claim 1, wherein the server system further comprises a scan data and communication sharing system for sharing the scan data with at least two users, each user being in a different plant.

21. The system of claim 1, wherein the communications path further comprises a network.

22. The system of claim 1, wherein the communications path further comprises a computer input and output bus.

23. The system of claim 1, wherein the buffer system further comprises at least one buffer box for storing scan data from at least one type of wafer scanning tool in the data acquisition system.

24. The system of claim 1, wherein the buffer system further comprises temporary storage to hold scan data from the data acquisition system and permit scanning to continue if the server system is not operating.

25. The system of claim 1, wherein the buffer system further comprises a communications protocol normalizer for communicating with the data acquisition system in the protocol used by each wafer scanning tool, and communicating with the server system in the protocol used by the server system.

26. A method for integrating semiconductor wafer data for use in silicon manufacturing and device fabrication processes, comprising the steps of:

communicating over a communications path;

acquiring scan data from differing types of semiconductor wafer scanning tools such as wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools using a data acquisition system, the data acquisition system being capable of communicating over the communications path;

providing temporary storage and fault tolerance for scan data transmitted over the communications path from the data acquisition system by using a buffer system;

providing storage for the scan data transmitted from the buffer system over the communications path using a server system, the server system converting the scan data into a format used by and stored in a database management system;

analyzing the scan data stored in the database management system by using an analysis system communicating with the server system over the communications path, the analysis system and the server system being capable of providing wafer data management, process monitoring, wafer data analysis, and data automation.

27. The method of claim 26, wherein the step of providing wafer data management further comprises the steps of

specifying scan data to be stored and reused using a wafer data reuse subsystem for the selective retention and retrieval of scan data;

and

evaluating scan data using a wafer data evaluation subsystem, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes.

28. The method of claim 26, wherein the step of providing wafer data management further comprises the steps of:

evaluating scan data using a wafer data evaluation subsystem, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

communicating and sharing scan data using a communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems to enable a user to detect and correct process excursions.

29. The method of claim 26, wherein the step of providing wafer data management further comprises the steps of:

evaluating scan data using a wafer data evaluation subsystem, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

operating data analysis and server system functions even while the data acquisition system is not operating by using a process control subsystem.

30. The method of claim 26, wherein the step of providing wafer data management further comprises the steps of:

specifying scan data to be stored and reused using a wafer data reuse subsystem for the selective retention and retrieval of scan data; and

operating data analysis and server system functions even while the data acquisition system is not operating by using a process control subsystem.

31. The method of claim 26, wherein the step of providing process monitoring further comprises the steps of:

specifying scan data to be stored and reused using a wafer data reuse subsystem for the selective retention and retrieval of scan data; and

communicating and sharing scan data using a communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems to enable a user to detect and correct process excursions.

32. The method of claim 26, wherein the step of providing process monitoring further comprises the steps of:

specifying scan data to be stored and reused using a wafer data reuse subsystem for the selective retention and retrieval of scan data; and

operating data analysis and server system functions even while the data acquisition system is not operating by using a process control subsystem.

33. The method of claim 26, wherein the step of providing process monitoring further comprises the steps of:

evaluating scan data using a wafer data evaluation subsystem, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

communicating and sharing scan data using a communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems to enable a user to detect and correct process excursions.

34. The method of claim 26, wherein the step of providing process monitoring further comprises:

operating data analysis and server system functions even while the data acquisition system is not operating by using a process control subsystem; and

communicating and sharing scan data using a communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems to enable a user to detect and correct process excursions.

35. The method of claim 26, wherein the step of providing wafer data analysis further comprises the steps of:

evaluating scan data using a wafer data evaluation subsystem, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

specifying scan data to be stored and reused using a wafer data reuse subsystem for the selective retention and retrieval of scan data.

36. The method of claim 26, wherein the step of providing wafer data analysis further comprises the steps of:

evaluating scan data using a wafer data evaluation subsystem, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

communicating and sharing scan data using a communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems to enable a user to detect and correct process excursions.

37. The method of claim 26, wherein the step of providing wafer data analysis further comprises the steps of:

evaluating scan data using a wafer data evaluation subsystem, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

operating data analysis and server system functions even while the data acquisition system is not operating by using a process control subsystem.

38. The method of claim 26, wherein the step of providing wafer data automation further comprises the steps of:

specifying scan data to be stored and reused using a wafer data reuse subsystem for the selective retention and retrieval of scan data; and

communicating and sharing scan data using a scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems, the scan data and communication sharing subsystem including options for automating transmissions and updates of scan data.

39. The method of claim 26, wherein the step of providing wafer data automation further comprises the steps of:

operating data analysis and server system functions even while the data acquisition system is not operating by using a process control subsystem; and

communicating and sharing scan data using a scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems, the scan data and communication sharing subsystem including options for automating transmissions and updates of scan data.

40. The method of claim 26, wherein the step of providing wafer data automation further comprises the steps of:

evaluating scan data using a wafer data evaluation subsystem, the wafer data evaluation subsystem being capable of evaluating scan data for both wafer manufacturing processes and device fabrication processes; and

communicating and sharing scan data using a scan data communication and sharing subsystem for providing scan data for process optimization of wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools from different systems, the scan data and communication sharing subsystem including options for automating transmissions and updates of scan data.

41. The method of claim 26, wherein the step of providing storage further comprises the step of communicating and sharing scan data so that at least two users can look at scan data.

42. The method of claim 26, wherein the step of providing storage further comprises the step of communicating and sharing scan data with at least two users, each looking at scan data from a different type of wafer scanning tool system.

43. The method of claim 26, wherein the step of providing storage further comprises the step of communicating and sharing scan data with at least two users, each user working in a different capacity.

44. The method of claim 26, wherein the step of providing storage further comprises the step of communicating and sharing scan data with at least two users, each user being in a different location.

45. The method of claim 26, wherein the step of providing storage further comprises the step of communicating and sharing scan data with at least two users, each user being in a different plant.

46. The method of claim 26, wherein the step of communicating over a communications path further comprises the step of communicating over a network.

47. The method of claim 26, wherein the step of communicating over a communications path further comprises the step of communicating over a computer input and output bus.

48. The method of claim 26, wherein the step of providing temporary storage and fault tolerance further comprises the step of using at least one buffer box for storing scan data from at least one type of wafer scanning tool in the data acquisition system.

49. The method of claim 26, wherein the step of providing temporary storage and fault tolerance further comprises the step of using temporary storage to hold scan data from the data acquisition system and permit scanning to continue if the server system is not operating.

50. The method of claim 26, wherein the step of providing temporary storage and fault tolerance further comprises the step of communicating with the data acquisition system in the protocol used by each wafer scanning tool, and communicating with the server system in the protocol used by the server.

51. A software program product implemented on a processor readable medium including instructions performed on a data processor for integrating semiconductor wafer data for use in silicon manufacturing and device fabrication processes, the instructions comprising:

instructions for communicating over a communications path;

instructions for acquiring scan data from differing types of semiconductor wafer scanning tools such as wafer dimensional tools, wafer inspection tools, and wafer nanotopography tools using a data acquisition system, the data acquisition system being capable of communicating over the communications path;

instructions for providing temporary storage and fault tolerance for scan data transmitted over the communications path from the data acquisition system by using a buffer system;

instructions for providing storage for the scan data transmitted from the buffer system over the communications path using a server system, the server system converting the scan data into a format used by and stored in a database management system;

instructions for analyzing the scan data stored in the database management system by using an analysis system communicating with the server system over the communications path, the analysis system and the server system being capable of providing wafer data management, process monitoring, wafer data analysis, and data automation.