Laminating system, IC sheet, roll of IC sheet, and method for manufacturing IC chip

• US 20060011288A1
• Filed: 06/29/2005
• Published: 01/19/2006
• Est. Priority Date: 07/16/2004
• Status: Active Grant

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Tsurume, Takuya, Arai, Yasuyuki, Takahashi, Hidekazu, Watanabe, Yasuko, Watanabe, Ryosuke, Higuchi, Miyuki
• Granted Patent: US 7,591,863 B2
• Time in Patent Office: Days
• US Class Current: 156/244.110
• CPC Class Codes: B32B 2305/342 Chips
• CPC Class Codes: B32B 2519/02 RFID tags
• CPC Class Codes: B32B 37/153 at least one layer is extruded and immediately laminated while in semi-molten state
• CPC Class Codes: B32B 37/226 Laminating sheets, panels or inserts between two continuous plastic layers
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: Y10T 156/1095 Opposed laminae are running length webs
• CPC Class Codes: Y10T 156/1734 Means bringing articles into association with web

Abstract

The invention provides a laminating system in which one of second and third substrates for sealing a thin film integrated circuit is supplied to a first substrate having the plurality of thin film integrated circuit while being extruded in a heated and melted state, and further rollers are used for supplying the other substrate, receiving IC chips, separating, and sealing. Processes of separating the thin film integrated circuits provided over the first substrate, sealing the separated thin film integrated circuits, and receiving the sealed thin film integrated circuits can be continuously carried out by rotating the rollers. Thus, the production efficiency can be extremely improved.

Claims

1. A laminating system comprising:

means for transferring a first substrate provided with a plurality of thin film integrated circuits;

means for supplying a thermoplastic resin over the first substrate while being extruded in a heated and melted state;

a roller having a cooling means, which attaches one surface of the thin film integrated circuits to a second substrate formed from the thermoplastic resin and separates the thin film integrated circuits from the first substrate by cooling the thermoplastic resin supplied in a heated and melted state;

a supplying roller wound with a third substrate;

means for sealing the thin film integrated circuits separated from the first substrate between the second substrate and the third substrate; and

a receiving roller to be wound with the sealed thin film integrated circuits.

2. A laminating system according to claim 1, wherein each of the second substrate and the third substrate is a laminate film.

3. A laminating system according to claim 1, wherein the sealing means includes a first roller and a second roller which are opposed to each other.

4. A laminating system according to claim 1, wherein the sealing means includes a first roller and a second roller which are opposed to each other, and at least one of the first roller and the second roller has at least one of a heating means and a cooling means.

5. A laminating system according to claim 1, wherein the sealing means seals the thin film integrated circuits by performing either or both of pressure treatment and heat treatment while the thin film integrated circuits pass between a first roller and a second roller which are opposed to each other.

6. A laminating system comprising:

means for supplying a thermoplastic resin over a first substrate while being extruded in a heated and melted state;

a roller having a cooling means, which attaches one surface of the thin film integrated circuits to a second substrate formed from the thermoplastic resin and separates the thin film integrated circuits from the first substrate by cooling the thermoplastic resin supplied in a heated and melted state;

a supplying roller wound with a third substrate;

means for sealing the thin film integrated circuits separated from the first substrate between the second substrate and the third substrate; and

a receiving roller to be wound with the sealed thin film integrated circuits.

7. A laminating system according to claim 6, wherein each of the second substrate and the third substrate is a laminate film.

8. A laminating system according to claim 6, wherein the sealing means includes a first roller and a second roller which are opposed to each other.

9. A laminating system according to claim 6, wherein the sealing means includes a first roller and a second roller which are opposed to each other, and at least one of the first roller and the second roller has at least one of a heating means and a cooling means.

10. A laminating system according to claim 6, wherein the sealing means seals the thin film integrated circuits by performing either or both of pressure treatment and heat treatment while the thin film integrated circuits pass between a first roller and a second roller which are opposed to each other.

11. A laminating system comprising:

means for transferring a first substrate provided with a plurality of thin film integrated circuits;

means for supplying a thermoplastic resin over the first substrate while being extruded in a heated and melted state;

a supplying roller wound with a third substrate;

means for sealing the thin film integrated circuits separated from the first substrate between the second substrate and the third substrate by separating the thin film integrated circuits from the first substrate by cooling the thermoplastic resin supplied in a heated and melted state and attaching one surface of the thin film integrated circuits to a second substrate formed from the thermoplastic resin; and

a receiving roller to be wound with the sealed thin film integrated circuits.

12. A laminating system according to claim 11, wherein each of the second substrate and the third substrate is a laminate film.

13. A laminating system according to claim 11, wherein the sealing means includes a first roller and a second roller which are opposed to each other.

14. A laminating system according to claim 11, wherein the sealing means includes a first roller and a second roller which are opposed to each other, and at least one of the first roller and the second roller has at least one of a heating means and a cooling means.

15. A laminating system according to claim 11, wherein the sealing means seals the thin film integrated circuits by performing either or both of pressure treatment and heat treatment while the thin film integrated circuits pass between a first roller and a second roller which are opposed to each other.

16. A laminating system comprising:

a first substrate provided with a plurality of thin film integrated circuits;

a supplying roller wound with a second substrate;

means for transferring the second substrate;

means for placing the first substrate above the second substrate so that one surface of the thin film integrated circuits provided over the first substrate is attached to the second substrate;

means for separating the thin film integrated circuits from the first substrate by attaching the one surface of the thin film integrated circuits to the second substrate and separates;

means for supplying a thermoplastic resin in a heated and melted state;

means for sealing the thin film integrated circuits separated from the first substrate between the second substrate and a third substrate formed from the thermoplastic resin; and

a receiving roller to be wound with the sealed thin film integrated circuits.

17. A laminating system according to claim 16, wherein each of the second substrate and the third substrate is a laminate film.

18. A laminating system according to claim 16, wherein the sealing means includes a first roller and a second roller which are opposed to each other.

19. A laminating system according to claim 16, wherein the sealing means includes a first roller and a second roller which are opposed to each other, and one of the first roller and the second roller has at least one of a heating means and a cooling means.

20. A laminating system according to claim 16, wherein the sealing means seals the thin film integrated circuits by performing either or both of pressure treatment and heat treatment while the thin film integrated circuits pass between a first roller and a second roller which are opposed to each other.

21. A method for manufacturing an IC chip comprising the steps of:

forming a separation layer over a first substrate having an insulating surface;

forming a plurality of thin film integrated circuits over the first substrate;

forming an opening at a boundary between the thin film integrated circuits to expose the separation layer;

introducing a gas or a liquid containing halogen fluoride into the opening to remove the separation layer;

attaching one surface of the thin film integrated circuits to a second substrate to separate the thin film integrated circuits from the first substrate;

attaching the other surface of the thin film integrated circuits to a third substrate; and

sealing the thin film integrated circuits between the second substrate and the third substrate.

22. A method for manufacturing an IC chip according to claim 21, wherein a plurality of thin film transistors and a conductive layer serving as an antenna are formed as the thin film integrated circuit over the first substrate.

23. A method for manufacturing an IC chip comprising the steps of:

transferring a first substrate provided with a plurality of thin film integrated circuits;

supplying a thermoplastic resin over the first substrate;

attaching one surface of the thin film integrated circuits to a second substrate formed from the thermoplastic resin;

separating the thin film integrated circuits from the first substrate;

supplying a third substrate; and

sealing the thin film integrated circuits separated from the first substrate between the second substrate and the third substrate.

24. A method for manufacturing an IC chip according to claim 23, wherein a plurality of thin film transistors and a conductive layer serving as an antenna are formed as the thin film integrated circuit over the first substrate.

25. A laminating system comprising:

means for transferring a first substrate provided with a plurality of thin film integrated circuits;

a die for supplying a thermoplastic resin over the first substrate;

a roller which attaches one surface of the thin film integrated circuits to a second substrate formed from the thermoplastic resin and separates the thin film integrated circuits from the first substrate by cooling the thermoplastic resin supplied in a heated and melted state;

a supplying roller wound with a third substrate;

means for sealing the thin film integrated circuits separated from the first substrate between the second substrate and the third substrate; and

a receiving roller to be wound with the sealed thin film integrated circuits.

26. A laminating system according to claim 25, wherein each of the second substrate and the third substrate is a laminate film.

27. A laminating system according to claim 25, wherein the sealing means includes a first roller and a second roller which are opposed to each other.

28. A laminating system according to claim 25, wherein the sealing means includes a first roller and a second roller which are opposed to each other, and at least one of the first roller and the second roller has at least one of a heating means and a cooling means.

29. A laminating system according to claim 25, wherein the sealing means seals the thin film integrated circuits by performing either or both of pressure treatment and heat treatment while the thin film integrated circuits pass between a first roller and a second roller which are opposed to each other.