Method of manufacturing a data carrier

• US 20060012023A1
• Filed: 10/15/2003
• Published: 01/19/2006
• Est. Priority Date: 10/15/2002
• Status: Active Grant

• Current Assignee: Gemalto SA (Thales SA)
• Original Assignee: Axalto S A
• Inventors: Reignoux, Yves, Nerot, Dorothee
• Granted Patent: US 7,242,079 B2
• Time in Patent Office: Days
• US Class Current: 257/692
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 23/4985 Flexible insulating substrates H01L23/49572 and H01L23/49855 take precedence
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A method of manufacturing a data carrier from a support strip includes an overmoulding step, in which at least one support element of the support strip is overmoulded so as to obtain a data carrier body, and a microcircuit-connecting step, in which a microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.

Claims

1. A method of manufacturing a data carrier from a support strip, the data carrier comprising a data carrier body provided with a microcircuit, the support strip comprising at least one support element, the support element comprising wiring pads, the method comprising the following steps:

an overmoulding step, in which the support element of the support strip is overmoulded so as to obtain the data carrier body; and

a microcircuit-connecting step, in which the microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.

2. The method according to claim 1, wherein the method further comprises a cutting step, in which the data carrier is cut out.

3. A support strip comprising:

at least one roughly parallel gripping area; and

at least one support element, wherein the support element comprises conducting element having a contact pad and a wiring pad, and wherein the support element is connected to the at least one gripping area using a snap-off junction area.

4. The support strip according to claim 3, wherein the support element is a support grid.

5. The support strip according to claim 3, wherein the support element comprises a foolproofing edge.

6. The support strip according to claim 4, wherein support element comprises a second foolproofing edge.

7. The support strip according to claim 3, wherein the support element is metallic.

8. The support strip according to claim 4, wherein the support element has a contour whose geometry substantially complies with the standard GSM 11.11.

9. The support strip according to claim 3, wherein the support element is arranged to receive an electronic component.