Method of manufacturing a data carrier
First Claim
Patent Images
1. A method of manufacturing a data carrier from a support strip, the data carrier comprising a data carrier body provided with a microcircuit, the support strip comprising at least one support element, the support element comprising wiring pads, the method comprising the following steps:
- an overmoulding step, in which the support element of the support strip is overmoulded so as to obtain the data carrier body; and
a microcircuit-connecting step, in which the microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.
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Abstract
A method of manufacturing a data carrier from a support strip includes an overmoulding step, in which at least one support element of the support strip is overmoulded so as to obtain a data carrier body, and a microcircuit-connecting step, in which a microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.
4 Citations
9 Claims
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1. A method of manufacturing a data carrier from a support strip, the data carrier comprising a data carrier body provided with a microcircuit, the support strip comprising at least one support element, the support element comprising wiring pads, the method comprising the following steps:
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an overmoulding step, in which the support element of the support strip is overmoulded so as to obtain the data carrier body; and
a microcircuit-connecting step, in which the microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier. - View Dependent Claims (2)
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3. A support strip comprising:
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at least one roughly parallel gripping area; and
at least one support element, wherein the support element comprises conducting element having a contact pad and a wiring pad, and wherein the support element is connected to the at least one gripping area using a snap-off junction area. - View Dependent Claims (4, 5, 6, 7, 8, 9)
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Specification