Pick and place machine with improved inspection

• US 20060016066A1
• Filed: 07/20/2005
• Published: 01/26/2006
• Est. Priority Date: 07/21/2004
• Status: Abandoned Application

• Current Assignee: CyberOptics Corporation (Nordson Corporation)
• Original Assignee: CyberOptics Corporation (Nordson Corporation)
• Inventors: Haugen, Paul R., Gaida, John D.
• Application Number:
  US11/185,920
• Publication Number:
  US 20060016066A1
• Time in Patent Office: Days
• US Class Current: 29/740
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: Y10T 29/49133 with component orienting
• CPC Class Codes: Y10T 29/49769 Using optical instrument [excludes mere human eyeballing]
• CPC Class Codes: Y10T 29/53087 with signal, scale, illuminator, or optical viewer
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

Embodiments of the present invention provide correlation between positional information relative to the workpiece and inspection information acquired relative to the workpiece. This correlation helps a user or technician quickly identify the physical location, on the workpiece, to which the inspection information pertains. Component inspection information can then be provided to an operator along with an indication of a position of the inspected component on the workpiece.

Claims

1. A method of inspecting component placement using an inspection system within an electronics assembly machine, the method comprising:

performing a component placement inspection to obtain component placement inspection information relative to a component on a workpiece at a placement location;

obtaining positional information relative to the placement location; and

associating the component placement inspection information with the positional information.

2. The method of claim 1, wherein the positional information is obtained from at least one position sensitive device.

3. The method of claim 2, wherein the positional information is obtained from a plurality of single axis positional sensitive devices.

4. The method of claim 2, wherein the at least one position sensitive device is a multi-axis position sensitive device.

5. The method of claim 1, wherein the positional information is obtained from a two-dimensional motion sensitive device.

6. The method of claim 5, wherein the two-dimensional motion sensitive device includes a light-emitting diode, a CMOS detector, and a digital signal processor.

7. The method of claim 1, wherein the component placement inspection information and the positional information are displayed to an operator.

8. The method of claim 7, wherein the component placement inspection information is displayed as a particular color at a position corresponding to the positional information.

9. The method of claim 8, wherein a first color is indicative of passing component placement inspection, and a second color is indicative of failing component placement inspection.

10. The method of claim 1, wherein performing component placement inspection includes obtaining at least one image of the placement location prior to component placement, and obtaining at least one image of the placement location after component placement, and contrasting the before and after placement images.

11. A component placement inspection system within an electronics assembly machine, the system comprising:

a camera disposed to acquire a plurality of images of a component placement location on a workpiece;

a position measurement system configured to provide an indication of workpiece position; and

a processing system coupled to the camera and to the position measurement system, the processing system being adapted to associate data relative to the acquired images with the workpiece position.

12. The system of claim 11, wherein the data relative to the acquired images includes component placement inspection information.

13. The system of claim 11, wherein the position measurement system includes at least one position sensitive device.

14. The system of claim 13, wherein the position measurement system includes a plurality of single axis positional sensitive devices.

15. The system of claim 13, wherein the at least one position sensitive device is a multi-axis position sensitive device.

16. The system of claim 11, wherein the positional measurement system includes a two-dimensional motion sensitive device.

17. The system of claim 16, wherein the two-dimensional motion sensitive device includes a light-emitting diode, a CMOS detector, and a digital signal processor.

18. The system of claim 11, and further comprising a display to provide at least one acquired image and the workpiece position relative to the at least one acquired image to an operator.

19. A component placement inspection system within an electronics assembly machine, the system comprising:

means for generating component placement inspection information within the electronics assembly machine;

means for measuring workpiece position;

means for associating data relative to the acquired images with the workpiece position.