Microstructured infrared sensor and method for its manufacture

• US 20060016995A1
• Filed: 06/10/2005
• Published: 01/26/2006
• Est. Priority Date: 06/24/2004
• Status: Abandoned Application

• Current Assignee: Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Finkbeiner, Stefan, Mueller, Andre, Muenzel, Horst, Maurer, Dieter, Mueller-Fiedler, Roland, Kummer, Nils, Perthold, Jurgen, Hiemer, Stefan
• Application Number:
  US11/150,762
• Publication Number:
  US 20060016995A1
• Time in Patent Office: Days
• US Class Current: 250/338.100
• CPC Class Codes: G01J 1/04 Optical or mechanical part supplementary adjustable parts
• CPC Class Codes: G01J 1/0411 using focussing or collimating elements, i.e. lenses or mirrors; Aberration correction
• CPC Class Codes: G01J 5/02 Constructional details
• CPC Class Codes: G01J 5/0215 Compact construction
• CPC Class Codes: G01J 5/024 Special manufacturing steps or sacrificial layers or layer structures
• CPC Class Codes: G01J 5/04 Casings
• CPC Class Codes: G01J 5/045 Sealings; Vacuum enclosures; Encapsulated packages; Wafer bonding structures; Getter arrangements getter arrangements per se H01L23/26 and H01L21/3221
• CPC Class Codes: G01J 5/046 Materials; Selection of thermal materials
• CPC Class Codes: G01J 5/08 Optical arrangements
• CPC Class Codes: G01J 5/0806 Focusing or collimating elements, e.g. lenses or concave mirrors
• CPC Class Codes: G01J 5/0853 having infrared absorbers other than the usual absorber layers deposited on infrared detectors like bolometers, wherein the heat propagation between the absorber and the detecting element occurs within a solid
• CPC Class Codes: G01J 5/0881 Compact construction
• CPC Class Codes: G01J 5/12 using thermoelectric elements, e.g. thermocouples
• CPC Class Codes: G01N 21/3504 for analysing gases, e.g. multi-gas analysis
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20

Abstract

A microstructured infrared sensor includes: a sensor chip having a diaphragm; a cavity formed underneath the diaphragm; a thermopile structure formed on the diaphragm and having bonded printed conductors; an absorber layer formed on the thermopile structure for absorbing infrared radiation; and a cap chip attached to the sensor chip. A sensor space is formed between the cap chip and the sensor chip, and the sensor space accommodates the thermopile structure. The infrared sensor also includes a convex lens area for focusing incident infrared radiation onto the absorber layer. The lens area may be formed on the top of the cap chip or on a lens chip attached to the cap chip. The lens area may be formed by drying a dispensed lacquer droplet, or by a softened, structured lacquer cylinder, or by subsequent etching of the dried lacquer droplet and the surrounding substrate material.

Claims

1. A microstructured infrared sensor, comprising:

a sensor chip having a diaphragm and a cavity formed underneath the diaphragm;

at least one thermopile structure formed on the diaphragm and having at least two bonded printed conductors made of different, electrically conductive materials;

an absorber layer formed on the thermopile structure for absorbing infrared radiation;

a cap chip attached to the sensor chip in vacuum-tight bonding areas, wherein a sensor space under vacuum is formed between the cap chip and the sensor chip, and wherein the at least one thermopile structure is accommodated in the sensor space; and

a convex lens area for focusing incident infrared radiation onto the absorber layer, wherein the convex lens area is formed above the sensor space.

2. The infrared sensor as recited in claim 1, wherein the convex lens area is formed on the top of the cap chip.

3. The infrared sensor as recited in claim 2, wherein the convex lens area is located within a depression formed on the top of the cap chip.

4. The infrared sensor as recited in claim 1, wherein the convex lens area is formed on a lens chip attached to the top of the cap chip.

5. The infrared sensor as recited in claim 4, wherein the lens chip is attached to the cap chip by an adhesive layer made of an optically transparent adhesive.

6. The infrared sensor as recited in claim 3, wherein the convex lens area has an essentially spherical curvature.

7. The infrared sensor as recited in claim 5, wherein the convex lens area has an essentially spherical curvature.

8. The infrared sensor as recited in claim 3, wherein a convergent lens is formed by a combination of the convex lens area and a bottom area, and wherein the focal point of the convergent lens lies in the absorber layer.

9. The infrared sensor as recited in claim 2, wherein the convex lens area is formed as a cap of solidified lacquer, and wherein the convex lens area is transparent to infrared radiation.

10. The infrared sensor as recited in claim 9, wherein the transparent lacquer is a photoresist.

11. The infrared sensor as recited in claim 2, wherein the convex lens area is formed integrally with the cap chip.

12. The infrared sensor as recited in claim 4, wherein the convex lens area is formed integrally with the lens chip.

13. The infrared sensor as recited in claim 11, wherein a lateral dimension of the convex lens area is greater than a lateral dimension of the absorber layer.

14. The infrared sensor as recited in claim 12, wherein a lateral dimension of the convex lens area is greater than a lateral dimension of the absorber layer.

15. The infrared sensor as recited in claim 11, wherein the printed conductors of the thermopile structure are extended away to one side of the diaphragm.

16. The infrared sensor as recited in claim 12, wherein the printed conductors of the thermopile structure are extended away to one side of the diaphragm.

17. A sensor module, comprising:

a package housing;

a cover secured on the package housing and having an aperture for passage of infrared radiation, wherein a package inner space is formed between the package housing and the cover; and

an infrared sensor mounted in the package inner space, the infrared sensor including;

a sensor chip having a diaphragm and a cavity formed underneath the diaphragm;

at least one thermopile structure formed on the diaphragm and having at least two bonded printed conductors made of different, electrically conductive materials;

an absorber layer formed on the thermopile structure for absorbing infrared radiation;

a cap chip attached to the sensor chip in vacuum-tight bonding areas, wherein a sensor space under vacuum is formed between the cap chip and the sensor chip, and wherein the at least one thermopile structure is accommodated in the sensor space; and

a convex lens area for focusing incident infrared radiation onto the absorber layer, wherein the convex lens area is formed above the sensor space;

wherein the aperture of the cover is formed above the convex lens area of the infrared sensor.

18. A method for manufacturing an infrared sensor, comprising:

forming a sensor chip substrate having at least one diaphragm;

forming at least one thermopile structure on the diaphragm;

forming an absorber layer on top of the thermopile structure;

forming a liquid spherical cap from a lacquer that is transparent to infrared radiation, wherein the liquid spherical cap is formed on one of a cap substrate and a lens substrate;

solidifying the spherical cap to form a convex lens area; and

attaching the cap substrate to the sensor chip substrate, whereby the at least one thermopile structure is located in a sensor space formed between the cap substrate and the sensor chip substrate, and wherein the convex lens area is positioned above the absorber layer.

19. The method as recited in claim 18, wherein the liquid spherical cap is formed by depositing a droplet of a lacquer liquid using a precision dispensing needle.

20. The method as recited in claim 18, wherein the liquid spherical cap is generated by forming a lacquer layer of radiation-transparent lacquer, structuring a cylinder in the lacquer layer, and softening the cylinder by treatment with solvent vapor.

21. The method as recited in claim 19, wherein the liquid spherical cap is solidified by drying.

22. The method as recited in one of claim 21, wherein, after drying the liquid spherical cap, the convex lens area is formed by etching the dried spherical cap and surrounding portions of one of the cap substrate and the lens substrate such that the convex lens area is formed on one of the cap substrate and the lens substrate.

23. The method as recited in claim 22, wherein etching rates in the dried spherical cap and in the surrounding portions of one of the cap substrate and the lens substrate are approximately the same.

24. The method as recited in claim 22, wherein an etching rate in the dried spherical cap is different from an etching rate in the surrounding portions of one the cap substrate and the lens substrate, whereby a non-spherical convex lens area is formed on one of the cap substrate and the lens substrate.

25. The method as recited in claim 22, wherein the convex lens area is formed on the top of the cap substrate.

26. The method as recited in claim 18, wherein the convex lens area is formed on the lens substrate, and wherein the lens substrate is attached to the top of the cap chip by a radiation-transparent adhesive layer.

27. The method as recited in claim 18, wherein the convex lens area is positioned such that a focal point of the convex lens area is in the absorber layer.

28. The method as recited in claim 26, wherein the convex lens area is positioned such that a focal point of the convex lens area is in the absorber layer.