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Dynamic deep depletion field effect transistor

  • US 20060017100A1
  • Filed: 07/14/2005
  • Published: 01/26/2006
  • Est. Priority Date: 07/14/2004
  • Status: Active Grant
First Claim
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1. A semiconductor switching device comprising a semiconductor die of one conductivity type having a plurality of equally spaced trenches, spaced by mesa regions;

  • a gate insulation lining at least a portion of the walls of said trenches;

    a conductive polysilicon mass deposed within said trenches for a height Wo from the bottom of said trench, a source contact disposed atop said die and in contact with said source region and insulated from said conductive polysilicon masses;

    said mesas having a given width;

    said polysilicon masses being connected to a source of gate to source bias for turning off said device at a given turn off-voltage;

    said polysilicon masses producing depletion regions in the mesas adjacent said trench walls which depletion regions overlap one another to deplete said mesas and turn off the conduction channel between said source and drain electrodes when said turn off-voltage is applied to said polysilicon masses said source of gate to source bias being pulse voltage source.

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