Heterogeneous organic laminate stack ups for high frequency applications
First Claim
1. A multi-layer organic stack up, comprising:
- a first organic layer;
a circuitized conductive layer on a surface of the first organic layer for forming passive circuits;
a second organic layer positioned opposite the circuitized conductive layer, wherein the second organic layer is coupled to the first organic layer with a layer of prepreg; and
a cavity defined by one or more walls formed by at least one of the second organic and the prepeg layer, wherein the cavity exposes at least a portion of the circuitized conductive layer; and
a discrete device attached to the circuitized conductive layer in the cavity.
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Accused Products
Abstract
Organic laminate stack ups are disclosed for a variety of applications, including high frequency RF applications. One or more inner core layers may be disposed between outer layers along with bondply or prepreg layers as needed. Discrete devices, including surface mount components and flip chips, may be embedded within the organic laminate stack up structures. The embedding of the discrete devices, which may be active or passive devices, may be in the form of a layer of bondply or prepreg encapsulating the discrete devices. In addition or in the alternative, cavities may be formed in at least the outer layers for housing discrete devices, which include surface mount components, flip chips, and wire bonded integrated circuits. A variety of caps may be utilized to seal the cavities. Further, shielding may be provided for the organic laminate stack up structure, including through a wall of vias or a plated trench cut along at least one side of the stack up structure. Each stack up structure may be packaged in a variety of ways, including as a surface mount component, ball grid array, or land grid array.
129 Citations
22 Claims
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1. A multi-layer organic stack up, comprising:
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a first organic layer;
a circuitized conductive layer on a surface of the first organic layer for forming passive circuits;
a second organic layer positioned opposite the circuitized conductive layer, wherein the second organic layer is coupled to the first organic layer with a layer of prepreg; and
a cavity defined by one or more walls formed by at least one of the second organic and the prepeg layer, wherein the cavity exposes at least a portion of the circuitized conductive layer; and
a discrete device attached to the circuitized conductive layer in the cavity. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of fabricating high frequency electronic components, comprising;
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providing an inner core layer, wherein the inner core layer comprises at least one conductive layer that includes a first passive circuit formed therein;
attaching at least one discrete device to the conductive layer;
providing a layer of prepreg on the inner core layer, wherein the layer of prepeg and the inner core layer encapsulate the discrete device; and
providing an outer layer on the layer of prepeg opposite the inner core layer. - View Dependent Claims (10, 11, 12, 13, 14, 15)
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16. A multi-layer organic stack up, comprising:
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an inner organic layer, wherein inner organic layer comprises at least one conductive layer for forming a first passive circuit thereon;
at least one discrete device coupled to the conductive layer;
a layer of prepreg on the inner organic layer, wherein the layer of prepeg and the inner organic layer encapsulate the discrete device; and
an outer organic layer on the layer of prepreg opposite the inner organic layer. - View Dependent Claims (17, 18, 19, 20, 21, 22)
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Specification