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Heterogeneous organic laminate stack ups for high frequency applications

  • US 20060017152A1
  • Filed: 07/08/2005
  • Published: 01/26/2006
  • Est. Priority Date: 07/08/2004
  • Status: Active Grant
First Claim
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1. A multi-layer organic stack up, comprising:

  • a first organic layer;

    a circuitized conductive layer on a surface of the first organic layer for forming passive circuits;

    a second organic layer positioned opposite the circuitized conductive layer, wherein the second organic layer is coupled to the first organic layer with a layer of prepreg; and

    a cavity defined by one or more walls formed by at least one of the second organic and the prepeg layer, wherein the cavity exposes at least a portion of the circuitized conductive layer; and

    a discrete device attached to the circuitized conductive layer in the cavity.

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