Low-loss inductor device and fabrication method thereof

• US 20060017539A1
• Filed: 07/20/2005
• Published: 01/26/2006
• Est. Priority Date: 07/20/2004
• Status: Abandoned Application

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Moon-chul, Choi, Hyung
• Application Number:
  US11/184,999
• Publication Number:
  US 20060017539A1
• Time in Patent Office: Days
• US Class Current: 336/200
• CPC Class Codes: H01F 17/0006 Printed inductances printed coils for dynamo-electric machines H02K3/26; printed circuits H05K
• CPC Class Codes: H01F 17/02 without magnetic core
• CPC Class Codes: H01F 2017/002 Details of via holes for interconnecting the layers
• CPC Class Codes: H01F 2017/008 Electric or magnetic shielding of printed inductances
• CPC Class Codes: H01F 27/027 specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
• CPC Class Codes: H01L 27/08 including only semiconductor components of a single kind

Abstract

An inductor device having an improved quality factor is provided. To obtain the improved quality factor, the inductor device includes a substrate etched away at predetermined intervals; first and second inductors formed on the top and bottom of the substrate, respectively; and first and second protection packages for shielding the first and second inductors, respectively, from outside. The first and second inductors are formed in a symmetrical structure with respect to the substrate, and the inductor device further includes connection parts for electrically connecting the first and second inductors. Further, the inductor device has air gaps between the substrate, first inductor, and second inductor in order for the first and second inductors to be exposed in the air, and the first protection package has an electrode layer formed thereon at predetermined positions to supply electric currents to the inductor device.

Claims

1. An inductor device, comprising:

a substrate etched at predetermined intervals;

first and second inductors formed on a top and a bottom of the substrate, respectively; and

a protection package for shielding at least one of the first and the second inductors from outside.

2. The inductor device as claimed in claim 1, wherein the first and second inductors are formed in a symmetrical structure with respect to the substrate.

3. The inductor device as claimed in claim 1, further comprising connection parts for electrically connecting the first and second inductors.

4. The inductor device as claimed in claim 1, further comprising air gaps formed among the substrate, the first inductor, and the second inductor in order for the first and the second inductors to be exposed in the air.

5. The inductor device as claimed in claim 1, further comprising a further protection package for shielding the other of the first and the second inductors from outside.

6. The inductor device as claimed in claim 5, wherein the further protection package has an electrode layer formed thereon at predetermined positions to supply electric currents to the inductor device.

7. An inductor device fabrication method comprising:

forming a first inductor on a top of a substrate, and forming a second inductor on a bottom of the substrate;

etching the substrate at predetermined intervals; and

forming a protection package for hermetically sealing at least one of the first inductor and the second inductor for shielding the at least one of the first inductor and the second inductor from outside.

8. The inductor device fabrication method as claimed in claim 7, wherein the first and second inductors are formed in a symmetrical structure with respect to the substrate.

9. The inductor device fabrication method as claimed in claim 7, further comprising:

electrically connecting the first and second inductors.

10. The inductor device fabrication method as claimed in claim 7, further comprising:

forming air gaps among the substrate, the first inductor, and the second inductor in order for the first and second inductors to be exposed in the air.

11. The inductor device fabrication method as claimed in claim 7, further comprising:

forming a further protection package for hermetically sealing the other of the first and second inductors to shield the other of the first and second inductors from outside.

12. The inductor device fabrication method as claimed in claim 11, further comprising:

forming an electrode layer at predetermined positions of the further protection package to supply electrical currents to the inductor device.

13. The inductor device fabrication method as claimed in claim 7, wherein the substrate is etched by dry etching.