Encapsulated surface acoustic wave sensor
First Claim
Patent Images
1. A sensor package system, comprising:
- a quartz sensor package encapsulated by an overmold material;
a surface acoustic wave sensing element and at least one bonding pad integrated with said quartz sensor package; and
at least one antenna respectively bonded to said quartz sensor package at said at least one bonding pad, such that said at least one antenna communicates electrically with said surface acoustic wave sensing element and permits wireless interrogation of said quartz sensor package including said surface acoustic wave sensing element from an external wireless source.
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Abstract
Sensor package systems and methods are disclosed, which include a quartz sensor package encapsulated by an overmold material. A surface acoustic wave sensing element and one or more bonding pads can be integrated with the quartz sensor package. Additionally, one or more antennas can be respectively bonded to the quartz sensor package at the bonding pads, such that the antennas communicates electrically with the surface acoustic wave sensing element and permits wireless interrogation of the quartz sensor package including the surface acoustic wave sensing element from an external wireless source.
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Citations
20 Claims
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1. A sensor package system, comprising:
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a quartz sensor package encapsulated by an overmold material;
a surface acoustic wave sensing element and at least one bonding pad integrated with said quartz sensor package; and
at least one antenna respectively bonded to said quartz sensor package at said at least one bonding pad, such that said at least one antenna communicates electrically with said surface acoustic wave sensing element and permits wireless interrogation of said quartz sensor package including said surface acoustic wave sensing element from an external wireless source. - View Dependent Claims (2, 3, 4, 5, 7, 8, 9, 10)
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6. The system of claim wherein 1 said at least one antenna comprises a flexible circuit antenna.
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11. A tire sensor package system, comprising:
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a tire in which a quartz sensor integrated circuit (IC) package is located;
a quartz sensor IC package encapsulated by an overmold material, wherein said quartz sensor IC package is integrated into said tire, such that said quartz sensor package measures air pressure and air temperature within said tire;
a surface acoustic wave sensing element and at least one bonding pad integrated with said quartz sensor IC package; and
at least one antenna respectively bonded to said quartz sensor IC package at said at least one bonding pad, such that said at least one antenna communicates electrically with said surface acoustic wave sensing element and permits wireless interrogation of said quartz sensor IC package including said surface acoustic wave sensing element from an external wireless source. - View Dependent Claims (12)
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13. A sensor packaging method, comprising the steps of:
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encapsulating a quartz sensor package with an overmold material;
integrating a surface acoustic wave sensing element and at least one bonding pad with said quartz sensor package; and
respectively bonding at least one antenna to said quartz sensor package at said at least one bonding pad, such that said at least one antenna communicates electrically with said surface acoustic wave sensing element and permits wireless interrogation of said quartz sensor package including said surface acoustic wave sensing element from an external wireless source. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20)
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Specification