Encapsulated surface acoustic wave sensor

• US 20060017553A1
• Filed: 07/20/2004
• Published: 01/26/2006
• Est. Priority Date: 07/20/2004
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: Cook, James D.
• Granted Patent: US 7,129,828 B2
• Time in Patent Office: Days
• US Class Current: 340/447
• CPC Class Codes: B60C 23/0493 for attachment on the tyre
• CPC Class Codes: G01K 11/265 using surface acoustic wave [SAW]
• CPC Class Codes: G01K 7/32 using change of resonant frequency of a crystal
• CPC Class Codes: G01L 9/0025 with acoustic surface waves

Abstract

Sensor package systems and methods are disclosed, which include a quartz sensor package encapsulated by an overmold material. A surface acoustic wave sensing element and one or more bonding pads can be integrated with the quartz sensor package. Additionally, one or more antennas can be respectively bonded to the quartz sensor package at the bonding pads, such that the antennas communicates electrically with the surface acoustic wave sensing element and permits wireless interrogation of the quartz sensor package including the surface acoustic wave sensing element from an external wireless source.

Claims

1. A sensor package system, comprising:

a quartz sensor package encapsulated by an overmold material;

a surface acoustic wave sensing element and at least one bonding pad integrated with said quartz sensor package; and

at least one antenna respectively bonded to said quartz sensor package at said at least one bonding pad, such that said at least one antenna communicates electrically with said surface acoustic wave sensing element and permits wireless interrogation of said quartz sensor package including said surface acoustic wave sensing element from an external wireless source.

2. The system of claim 1 wherein said at least one bonding pad comprises at least one of the following types of bonds:

a thermo-compression bond, a solder bond, or an adhesive bond.

3. The system of claim 1 wherein said at least one antenna comprises an antenna ribbon.

4. The system of claim 1 wherein said at least one antenna comprises an antenna wire.

5. The system of claim 4 further comprising a ribbon bond stress-relief gel located between said antenna ribbon and said quartz sensor package.

7. The system of claim 1 wherein said quartz sensor package comprises a sensor diaphragm comprising said surface acoustic wave sensing element.

8. The system of claim 7 wherein a pressure access cavity is formed from said sensor diaphragm and filled with a non-compressible gel in order to transfer air pressure from an external pressure source to said sensor diaphragm.

9. The system of claim 1 wherein said quartz sensor package comprises an integrated circuit (IC) package.

10. The system of claim 9 wherein said IC package is integrated into a tire, such that said quartz sensor package measures air pressure and air temperature within said tire.

6. The system of claim wherein 1 said at least one antenna comprises a flexible circuit antenna.

11. A tire sensor package system, comprising:

a tire in which a quartz sensor integrated circuit (IC) package is located;

a quartz sensor IC package encapsulated by an overmold material, wherein said quartz sensor IC package is integrated into said tire, such that said quartz sensor package measures air pressure and air temperature within said tire;

a surface acoustic wave sensing element and at least one bonding pad integrated with said quartz sensor IC package; and

at least one antenna respectively bonded to said quartz sensor IC package at said at least one bonding pad, such that said at least one antenna communicates electrically with said surface acoustic wave sensing element and permits wireless interrogation of said quartz sensor IC package including said surface acoustic wave sensing element from an external wireless source.

12. The system of claim 11 wherein said at least one antenna comprises an antenna ribbon and wherein a ribbon bond stress-relief gel located between said antenna ribbon and said quartz sensor package.

13. A sensor packaging method, comprising the steps of:

encapsulating a quartz sensor package with an overmold material;

integrating a surface acoustic wave sensing element and at least one bonding pad with said quartz sensor package; and

respectively bonding at least one antenna to said quartz sensor package at said at least one bonding pad, such that said at least one antenna communicates electrically with said surface acoustic wave sensing element and permits wireless interrogation of said quartz sensor package including said surface acoustic wave sensing element from an external wireless source.

14. The method of claim 13 further comprising the step of configuring said at least one bonding pad to comprise a thermo-compression bond.

15. The method of claim 13 further comprising the step of configuring said at least one antenna to comprise an antenna ribbon.

16. The method of claim 15 further comprising the step of locating a ribbon bond stress-relief gel between said antenna ribbon and said quartz sensor package.

17. The method of claim 13 wherein further comprising the step of configuring said at least one antenna to comprise a flexible circuit antenna.

18. The method of claim 13 further comprising the step of configuring said quartz sensor package to comprise a sensor diaphragm that incorporates said surface acoustic wave sensing element.

19. The method of claim 18 further comprising the steps of:

forming a pressure access cavity is from said sensor diaphragm;

filling said pressure access cavity with a non-compressible gel in order to transfer air pressure from an external pressure source to said sensor diaphragm.

20. The method of claim 18 wherein said quartz sensor package comprises an integrated circuit (IC) package and further comprising the steps of:

placing said IC package into a tire prior to molding of said tire; and

integrating said IC package into said tire, such that said quartz sensor package is capable of measuring air pressure and air temperature within said tire.