PCB board incorporating thermo-encapsulant for providing controlled heat dissipation and electromagnetic functions and associated method of manufacturing a PCB board

• US 20060018098A1
• Filed: 07/22/2004
• Published: 01/26/2006
• Est. Priority Date: 07/22/2004
• Status: Abandoned Application

• Current Assignee: Solid State Racing, LLC
• Original Assignee: Solid State Racing, LLC
• Inventors: Hill, Adrian, Rogove, Brian
• Application Number:
  US10/896,523
• Publication Number:
  US 20060018098A1
• Time in Patent Office: Days
• US Class Current: 361/708
• CPC Class Codes: H05K 1/0204 using means for thermal conduction connection in the thickness direction of the substrate H05K1/0207 takes precedence
• CPC Class Codes: H05K 1/0218 by printed shielding conductors, ground planes or power plane H05K1/0236 takes precedence
• CPC Class Codes: H05K 2201/066 Heatsink mounted on the surface of the PCB heatsink inserted in the PCB H05K2201/10416
• CPC Class Codes: H05K 2201/10416 Metallic blocks or heatsinks completely inserted in a PCB metallic supports H05K3/0061
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence

Abstract

A circuit board assembly includes a substantially planar shaped printed circuit board (PCB) having a first side and a second side separated by a determined thickness. At least one electrically operable component, typically an LED element, is secured to a selected one of first and second sides of the PCB board, the component generating at least one of a thermal flow pattern and an electromagnetic field. A three-dimensional encapsulant is in-molded around the printed circuit board in such a fashion as to substantially embed the electrically operable component. The encapsulant provides selective heat conductive management of the thermal flow pattern and electromagnetic management of the electromagnetic fields generated by the component.

Claims

1. A circuit board assembly, comprising:

a substantially planar shaped printed circuit board having a first side and a second side separated by a determined thickness;

at least one electrically operable component secured to a selected one of said first and second sides, said component generating at least one of a thermal flow pattern and an electromagnetic field; and

a three-dimensional encapsulant molded around said printed circuit board and substantially embedding said electrically operable component, said encapsulant providing selective heat conductive management of said thermal flow pattern and electromagnetic management of said electromagnetic fields generated by said component.

2. The circuit board assembly as described in claim 1, said encapsulant further comprising a thermoplastic material exhibiting an elevated melting point.

3. The circuit board assembly as described in claim 1, further comprising a plurality of wires connected to at least one location associated with said circuit board and about which is molded said encapsulant.

4. The circuit board assembly as described in claim 1, further comprising in-molded bracketry extending from locations associated with said three-dimensional encapsulant, said encapsulant functioning as an environmental casing for said PCB assembly.

5. The circuit board assembly as described in claim 1, said at least one electrically operable component further comprising at least one of an LED element, a power transistor, and a radio frequency antenna and circuit driver.

6. The circuit board assembly as described in claim 1, said printed circuit board exhibiting a specified shape and size and including at least one of thermal conducting pin holes and associated through apertures.

7. The circuit board assembly as described in claim 6, further comprising at least one heat conductive element including first and second heat spreader pieces secured against said first and second sides and interconnected through said through aperture.

8. The circuit board assembly as described in claim 1, further providing at least one electromagnetic countermeasure incorporated into said circuit board and selected from the group including a RF shield and a Faraday cage.

9. The circuit board assembly as described in claim 1, said three-dimensional encapsulant further comprising an outer insulated encapsulant layer, an inner conductive encapsulant filler bordering against said outer layer, at least a portion of said inner conductive encapsulant being exposed to an exterior of said circuit board assembly.

10. The circuit board assembly as described in claim 1, said three-dimensional encapsulant further comprising an outer electromagnetic shielding layer and an electrically insulative encapsulant filler.

11. The circuit board assembly as described in claim 1, said three-dimensional encapsulant exhibiting a specified shape and size and further comprising an environmental sealant about said printed circuit board and electrically operable components.

12. The circuit board assembly as described in claim 1, further comprising at least one heat conductive element in-molded within said encapsulant in a determined spaced relationship relative to said circuit board and electrically operable components.

13. The circuit board assembly as described in claim 1, further comprising a ferrous based electromagnetic countermeasure in-molded within said encapsulant at a location proximate to selected electromagnetic generating components.

14. The circuit board assembly as described in claim 13, said three-dimensional encapsulating further comprising dual encapsulating layers with a ground connection.

15. A manufacturing process for assembling a printed circuit board assembly, comprising the steps of:

screen printing a solder paste onto at least one side of a circuit board panel;

securing at least one passive component upon said panel in communication with said solder paste;

attaching at least one electrically operable and heat/EMI generating component to said panel;

attaching a plurality of wires to at least one location associated with said circuit board and at least one of said components; and

molding a three-dimensional encapsulant about said circuit board and a connecting portion associated with said wires, said encapsulant substantially surrounding said electrically operable components and providing at least one of controlled heat conduction and electromagnetic shielding to said assembly.

16. The manufacturing process as described in claim 15, further comprising the step of in-molding at least one bracket within said three-dimensional encapsulant.

17. The manufacturing process as described in claim 15, said step of attaching at least one electrically operable and heat/EMI generating component to said panel further comprising the step of attaching at least one of an LED element, a power transistor and a radio frequency antenna and circuit driver.

18. The manufacturing process as described in claim 15, further comprising the step of forming at least one thermal pin hole through said panel.

19. The manufacturing process as described in claim 15, further comprising the step of forming at least one aperture through said panel.

20. The manufacturing process as described in claim 19, further comprising the step of attaching at least one heat conductive element including first and second heat spreader pieces secured against first and second sides and interconnected through said through aperture.

21. The manufacturing process as described in claim 15, said step of molding a three-dimensional encapsulant further comprising applying an outer insulated encapsulant layer over an inner conductive encapsulant filler, at least a portion of said inner conductive encapsulant being exposed to an exterior of said circuit board assembly.

22. The manufacturing process as described in claim 15, said step of molding a three-dimensional encapsulant further comprising applying an outer electromagnetic shielding over an electrically insulative encapsulant filler.

23. The manufacturing process as described in claim 15, further comprising the step of incorporating at least one heat conductive element within said molded three-dimensional encapsulant in a determined spaced relationship relative to said circuit board panel and said components.

24. The manufacturing process as described in claim 15, further comprising the step of incorporating at least ferrous based electromagnetic countermeasure within said molded three-dimensional encapsulant at a location proximate to at least one selected EMI generating component.

25. The manufacturing process as described in claim 15, further comprising the step of molding said three-dimensional encapsulant in dual layers incorporating an electrically grounding connecting to said circuit board panel.