Semiconductor light-emitting device and method of manufacturing the same
First Claim
Patent Images
1. A semiconductor light-emitting device, comprising:
- a light-emitting element;
a first lead frame having a main surface having said light-emitting element mounted thereon;
a resin portion for fixing said first lead frame; and
a heat-radiating member bonded to a back face of said first lead frame with an electrically-conductive layer containing metal interposed therebetween.
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Abstract
A semiconductor light-emitting device includes a light-emitting element, a first lead frame having a main surface having the light-emitting element mounted thereon, a second lead frame spaced apart from the first lead frame, resin molded portions for fixing the first and second lead frames, and a heat-radiating member bonded to a back face of the first lead frame with a brazing member (electrically-conductive layer) containing metal interposed therebetween. The brazing member and the heat-radiating member are formed immediately below and around the light-emitting element.
47 Citations
12 Claims
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1. A semiconductor light-emitting device, comprising:
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a light-emitting element;
a first lead frame having a main surface having said light-emitting element mounted thereon;
a resin portion for fixing said first lead frame; and
a heat-radiating member bonded to a back face of said first lead frame with an electrically-conductive layer containing metal interposed therebetween. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of manufacturing a semiconductor light-emitting device, comprising the steps of:
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forming a resin portion for holding a lead frame such that a back face of the lead frame is exposed;
mounting a light-emitting element on a main surface of the lead frame located at said exposed back face of said lead frame; and
bonding a heat-radiating member to the exposed back face of said lead frame with an electrically-conductive layer containing metal interposed therebetween. - View Dependent Claims (10, 11, 12)
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Specification