Small structure and method for fabricating the same

• US 20060022322A1
• Filed: 07/29/2005
• Published: 02/02/2006
• Est. Priority Date: 07/29/2004
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Sang-woo, Kim, Jong-pal, Choi, Joon-hyock, Lee, Byeung-leul, Cho, Yong-chul
• Granted Patent: US 7,714,421 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: G01C 19/5663 Manufacturing; Trimming; Mounting; Housings
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G02B 26/0841 the reflecting element being moved or deformed by electrostatic means
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85001 involving a temporary auxiliary member not forming part of the bonding apparatus, e.g. removable or sacrificial coating, film or substrate
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]

Abstract

A small structure which uses bonding wires to prevent disturbance and provide support and a method of fabricating the same are provided. The small structure includes a floating body having a plurality of first contact pads, a base having a plurality of second contact pads, and a plurality of bonding wires electrically connecting the first and second contact pads and elastically supporting the floating body. The method of fabricating the small structure includes preparing a base, forming a sacrificial layer on the base, disposing a floating body on the sacrificial layer, connecting the base and the floating body with bonding wires, and removing the sacrificial layer. Thereby, fabrication costs of the small structure are reduced.

Claims

1. A small structure, comprising:

a floating body which includes a plurality of first contact pads;

a base which includes a plurality of second contact pads; and

a plurality of bonding wires which electrically connect the first contact pads and the second contact pads, wherein the plurality of bonding wires elastically support the floating body and maintain the floating body over the base in a floated state in which the floating body is spaced apart from the base at a predetermined interval.

2. The small structure as claimed in claim 1, wherein the bonding wires are formed of one of gold and aluminum.

3. The small structure as claimed in claim 1, wherein:

the small structure is a gyroscope;

the floating body includes at least one mass and at least one electrode which drives the mass; and

the base includes a circuit which controls operation of the mass and converts displacement of the floating body into capacitance.

4. The small structure as claimed in claim 1, wherein:

the small structure is a gyroscope;

the floating body includes at least one mass, at least one electrode which drives the mass, and a first circuit which controls operation of the mass and converts displacement of the floating body into a capacitance; and

the base includes a second circuit which controls the first circuit.

5. The small structure as claimed in claim 1, wherein:

the small structure is an accelerometer;

the floating body includes at least one mass and at least one piezoelectric element which converts displacement of the floating body into an electric charge; and

the base includes a circuit which detects a quantity of the electric charge of the piezoelectric element.

6. A small structure, comprising:

a floating body;

a base; and

a plurality of bonding wires which elastically support the floating body and maintain the floating body over the base in a floated state in which the floating body is spaced apart from the base at a predetermined interval.

7. The small structure as claimed in claim 6, wherein the bonding wires are formed of one of gold and aluminum.

8. The small structure as claimed in claim 6, wherein:

the small structure is a mirror;

the floating body includes a conductive plate with a reflective surface which is formed on one surface of the conductive plate; and

the base includes a plurality of electrodes which are formed opposite to the floating body and which attract a corresponding portion of the floating body with an electrostatic force when a voltage is applied.

9. A method of fabricating a small structure, comprising:

preparing a base;

forming a sacrificial layer on the base;

disposing a floating body on the sacrificial layer;

connecting the base and the floating body with bonding wires; and

removing the sacrificial layer.

10. The method as claimed in claim 9, wherein forming the sacrificial layer includes covering a portion of the base where the floating body is to be located with one of a photoresist and a polymer to a predetermined thickness, said one of a photoresist and a polymer having a higher etching ratio than the base.

11. The method as claimed in claim 10, wherein removing the sacrificial layer includes removing the sacrificial layer by an etching process.

12. The method as claimed in claim 9, wherein the bonding wires are formed of one of gold and aluminum.

13. The method as claimed in claim 9, wherein forming the sacrificial layer includes covering the base with a sublimatable material on a portion of the base where the floating body is to be located to a predetermined thickness.

14. The method as claimed in claim 13, wherein the sublimatable material includes p-dichlorobenzene.

15. The method as claimed in claim 13, wherein removing the sacrificial layer includes one of leaving and sublimating the sacrificial layer of the sublimatable material at a room temperature, and sublimating the sacrificial layer of the sublimatable material under a predetermined condition for accelerating sublimation.

16. A method of fabricating a small structure, comprising:

preparing a base;

disposing a spacer jig on the base;

disposing a floating body on the spacer jig;

connecting the base and the floating body with bonding wires; and

removing the spacer jig.

17. The method as claimed in claim 16, wherein disposing the spacer jig on the base includes disposing the spacer jig, which has a predetermined thickness, on a portion of the base where the floating body is to be located.

18. The method as claimed in claim 16, wherein the bonding wires are formed of one of gold and aluminum.

19. A method of fabricating a small structure, comprising:

preparing a base;

disposing a temporary adhesive layer on the base;

disposing a floating body on the temporary adhesive layer;

connecting the base and the floating body with bonding wires; and

lifting the floating body from the base by using a tool.

20. The method as claimed in claim 19, wherein disposing the temporary adhesive layer on the base includes disposing a double sided tape, which has a predetermined adhesive force, on a portion of the base where the floating body is to be located.

21. The method as claimed in claim 19, wherein the bonding wires are formed of one of gold and aluminum.

22. The method as claimed in claim 19, wherein lifting the floating body from the base by using the tool includes floating the floating body, which is adhered to the base by the temporary adhesive layer from the base by a predetermined interval, by attaching a vacuum chuck on the floating body to apply a vacuum force.