Resin for optical-semiconductor element encapsulation

• US 20060022356A1
• Filed: 07/27/2005
• Published: 02/02/2006
• Est. Priority Date: 07/27/2004
• Status: Abandoned Application

• Current Assignee: Nitto Denko Corporation
• Original Assignee: Nitto Denko Corporation
• Inventors: Hotta, Yuji, Uwada, Kazuki, Sadayori, Naoki
• Application Number:
  US11/189,745
• Publication Number:
  US 20060022356A1
• Time in Patent Office: Days
• US Class Current: 257/787
• CPC Class Codes: C08G 18/025 the polymeric products containing carbodiimide groups
• CPC Class Codes: C08G 18/71 Monoisocyanates or monoisothiocyanates
• CPC Class Codes: C08G 18/7685 containing two or more non-condensed aromatic rings directly linked to each other
• CPC Class Codes: C08G 18/797 containing carbodiimide and/or uretone-imine groups
• CPC Class Codes: C09J 175/12 from compounds containing nitrogen and active hydrogen, the nitrogen atom not being part of an isocyanate group
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8592 Applying permanent coating, e.g. protective coating
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation

Abstract

The present invention provides a resin for encapsulating an optical-semiconductor element, comprising a polycarbodiimide represented by the following general formula (1):
wherein R represents a diisocyanate residue, provided that at least one of the n pieces of the R groups is a diisocyanate residue having the framework represented by the following structural formula (2);
R¹ represents a monoisocyanate residue; and n is an integer of 1 to 100.

Claims

1. A resin for encapsulating an optical-semiconductor element, comprising a polycarbodiimide represented by the following general formula (1):

2. The resin for optical-semiconductor element encapsulation of claim 1, wherein at least 10% by mole of the diisocyanate residues are diisocyanate residues having the framework represented by the structural formula (2).

3. The resin for optical-semiconductor element encapsulation of claim 1, wherein the monoisocyanate residues comprise aromatic monoisocyanate residues.

4. The resin for optical-semiconductor element encapsulation of claim 3, wherein the aromatic monoisocyanate residues comprise 1-naphthyl isocyanate residues.

5. A resin sheet for optical-semiconductor element encapsulation obtained by a process comprising molding the resin for optical-semiconductor element encapsulation of claim 1 into a sheet.

6. An optical semiconductor device comprising an optical semiconductor element encapsulated with the resin for optical-semiconductor element encapsulation of claim 1 or with the resin sheet for optical-semiconductor element encapsulation of claim 5.

7. A process for producing an optical semiconductor device, comprising the steps of:

placing the resin for optical-semiconductor element encapsulation of claim 1 or the resin sheet for optical-semiconductor element encapsulation of claim 5 on an optical semiconductor element; and

applying heat to the resin or resin sheet.