Method to improve inductance with a high-permeability slotted plate core in an integrated circuit
First Claim
1. An inductor structure formed in an integrated circuit, comprising:
- a first isolation layer;
a first core plate comprising a plurality of electrically coupled conductive traces comprising a conductive ferromagnetic material layer disposed over an upper surface of the first isolation layer;
a second isolation layer overlying the first isolation layer; and
an inductor coil comprising a conductive material layer formed within the second isolation layer;
wherein the first core plate increases an inductance of the inductor coil.
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Accused Products
Abstract
An inductor structure (102) formed in an integrated circuit (100) is disclosed, and includes a first isolation layer (106) and a first core plate (104) disposed over or within the first isolation layer (106, 114). The first core plate (104) includes a plurality of electrically coupled conductive traces composed of a conductive ferromagnetic material layer. A second isolation layer (108) overlies the first isolation layer and an inductor coil (102) composed of a conductive material layer (118) is formed within the second isolation layer (108). Another core plate may be formed over the coil. The one or more core plates increase an inductance (L) of the inductor coil (102).
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Citations
22 Claims
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1. An inductor structure formed in an integrated circuit, comprising:
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a first isolation layer;
a first core plate comprising a plurality of electrically coupled conductive traces comprising a conductive ferromagnetic material layer disposed over an upper surface of the first isolation layer;
a second isolation layer overlying the first isolation layer; and
an inductor coil comprising a conductive material layer formed within the second isolation layer;
wherein the first core plate increases an inductance of the inductor coil. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of forming an integrated inductor structure over a semiconductor substrate, comprising:
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providing a first isolation layer disposed over the semiconductor substrate;
forming a first core plate comprising a plurality of electrically coupled conductive traces comprising a conductive ferromagnetic material layer disposed over an upper surface of the first isolation layer;
forming a second isolation layer over the first isolation layer and the first core plate; and
forming an inductor coil comprising a conductive material layer disposed within trenches in the second isolation layer;
wherein the first core plate increases an inductance of the inductor coil. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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19. A method of forming an integrated inductor structure over a semiconductor substrate, comprising:
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providing a first isolation layer disposed over the semiconductor substrate;
forming trenches within the first isolation layer;
forming a core plate comprising a conductive ferromagnetic material layer disposed within the trenches of the first isolation layer;
forming a second isolation layer over the core plate and the first isolation layer;
forming an inductor coil of a conductive material layer disposed within trenches overlying the second isolation layer and the core plate; and
removing a portion of the inductor coil material and the first core plate material to provide isolation between turns of the inductor coil and to define an electrically continuous core plate with radially spaced apart traces;
wherein the core plate increases an inductance of the inductor coil. - View Dependent Claims (20)
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21. An inductor structure formed in an integrated circuit, comprising:
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a first isolation layer;
a coil-shaped trench formed in the first insulation layer;
a core plate layer comprising a conductive ferromagnetic material residing in the coil-shaped trench;
a conductive layer overlying or underlying the core plate layer in the coil-shaped trench, thereby forming an inductor coil, wherein the core plate layer increases an inductance of the inductor coil.
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22. An inductor structure formed in an integrated circuit, comprising:
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a first isolation layer;
a coil-shaped trench formed in the first insulation layer;
one or more core plate vias or trenches formed in the first insulation layer and electrically isolated from the coil-shaped trench;
a conductive material residing in the coil-shaped trench and forming an inductor coil therein; and
a conductive ferromagnetic material residing in the one or more core plate vias or trenches, wherein the conductive ferromagnetic material forms one or more core plates that increase an inductance of the inductor coil.
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Specification