Vertical offset structure and method for fabricating the same
First Claim
1. A vertical offset structure, comprising:
- a substrate;
a fixed electrode fixing portion formed on the substrate;
a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;
a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;
a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.
1 Assignment
0 Petitions
Accused Products
Abstract
A vertical offset structure and a method for fabricating the same. The vertical offset structure includes a substrate; a fixed electrode fixing portion formed on the substrate; a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance; a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves into a direction substantially perpendicular to a plate surface of the substrate; a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode.
13 Citations
15 Claims
-
1. A vertical offset structure, comprising:
-
a substrate;
a fixed electrode fixing portion formed on the substrate;
a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;
a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;
a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6)
-
-
7. A vertical operation type capacitance electrode manufactured comprising a vertical offset structure comprising:
-
a substrate;
a fixed electrode fixing portion formed on the substrate;
a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;
a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;
a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.
-
-
8. An accelerometer manufactured comprising a vertical offset structure comprising:
-
a substrate;
a fixed electrode fixing portion formed on the substrate;
a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;
a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;
a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.
-
-
9. An angular velocity system manufactured comprising a vertical offset structure comprising:
-
a substrate;
a fixed electrode fixing portion formed on the substrate;
a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;
a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;
a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.
-
-
10. A mirror manufactured comprising a vertical offset structure comprising:
-
a substrate;
a fixed electrode fixing portion formed on the substrate;
a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;
a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;
a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.
-
-
11. A method for manufacturing a vertical offset structure, the method comprising:
-
forming a fixed electrode fixing portion on a substrate;
forming a fixed electrode moving portion at a position away from an upper portion of the substrate by a predetermined distance;
forming a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction perpendicular to a plate surface of the substrate;
forming a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
bonding a cap wafer to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode to have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.
-
-
12. A method of manufacturing a vertical operation type capacitance electrode comprising a method for manufacturing a vertical offset structure comprising:
-
forming a fixed electrode fixing portion on a substrate;
forming a fixed electrode moving portion at a position away from an upper portion of the substrate by a predetermined distance;
forming a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction perpendicular to a plate surface of the substrate;
forming a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
bonding a cap wafer to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode to have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.
-
-
13. A method of manufacturing an accelerometer comprising a method for manufacturing a vertical offset structure comprising:
-
forming a fixed electrode fixing portion on a substrate;
forming a fixed electrode moving portion at a position away from an upper portion of the substrate by a predetermined distance;
forming a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction perpendicular to a plate surface of the substrate;
forming a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
bonding a cap wafer to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode to have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.
-
-
14. A method of manufacturing an angular velocity system comprising a method for manufacturing a vertical offset structure comprising:
-
forming a fixed electrode fixing portion on a substrate;
forming a fixed electrode moving portion at a position away from an upper portion of the substrate by a predetermined distance;
forming a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction perpendicular to a plate surface of the substrate;
forming a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
bonding a cap wafer to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode to have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.
-
-
15. A method of manufacturing a mirror comprising a method for manufacturing a vertical offset structure comprising:
-
forming a fixed electrode fixing portion on a substrate;
forming a fixed electrode moving portion at a position away from an upper portion of the substrate by a predetermined distance;
forming a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction perpendicular to a plate surface of the substrate;
forming a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and
bonding a cap wafer to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode to have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.
-
Specification