Electroless plating with nanometer particles
First Claim
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1. An electroless metal boron plating bath comprising:
- an effective amount of reducing agent, an effective amount of nanometer particles having a diameter so that the seeding in the bath is reduced an effective amount of complexing agent, and an effective amount of metal ions.
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Abstract
The addition of nanometer particles to electroless metal plating baths reduces or eliminates seeding in the electroless plating baths. The reduced seeding results in less inclusions or pitting in the coating. Usually the maintenance and frequent tank-cleaning schedule can be increased beyond the normal 2-3 day. The properties of the coating can be improved by the co-deposition of the particles into the bath. Properties such as hardness, corrosion resistance, and wear resistance were improved.
16 Citations
30 Claims
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1. An electroless metal boron plating bath comprising:
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an effective amount of reducing agent, an effective amount of nanometer particles having a diameter so that the seeding in the bath is reduced an effective amount of complexing agent, and an effective amount of metal ions. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 11, 19)
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10. (canceled)
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12. A process of electroless plating comprising:
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plating an article in a bath comprising, an effective amount of a boron reducing agent, an effective amount of nanometer particles having a diameter so that the seeding in the bath is reduced an effective amount of complexing agent, and an effective amount of metal ions. - View Dependent Claims (13, 14, 15, 16, 17, 18, 20, 21, 22, 23, 24, 25)
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- 26. An electroless deposited metal boron coating comprising a codeposited nanometer particle having a particle size diameter of less than 100 micron.
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30. A process of electroless plating metal phosphorous comprising:
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plating an article in a bath comprising, an effective amount of a reducing agent, an effective amount of nanometer particles having a diameter so that the seeding in the bath is reduced an effective amount of complexing agent, and an effective amount of metal ions. continuing the plating beyond the point seeding would normally occur without the presence of the nanometer particle thereby extending the life of the bath without seeding.
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Specification