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Electroless plating with nanometer particles

  • US 20060024447A1
  • Filed: 08/02/2004
  • Published: 02/02/2006
  • Est. Priority Date: 08/02/2004
  • Status: Abandoned Application
First Claim
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1. An electroless metal boron plating bath comprising:

  • an effective amount of reducing agent, an effective amount of nanometer particles having a diameter so that the seeding in the bath is reduced an effective amount of complexing agent, and an effective amount of metal ions.

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