Electronic component comprising predominantly organic functional materials and a method for the production thereof

• US 20060024947A1
• Filed: 07/09/2003
• Published: 02/02/2006
• Est. Priority Date: 07/29/2002
• Status: Active Grant

• Current Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Original Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Inventors: Bernds, Adolf, Knobloch, Alexander Friedrich, Clements, Wolfgang
• Granted Patent: US 8,044,517 B2
• Time in Patent Office: Days
• US Class Current: 438/622
• CPC Class Codes: H10K 19/00 Integrated devices, or assemblies of multiple devices, comprising at least one organic element specially adapted for rectifying, amplifying, oscillating or switching, covered by group H10K10/00
• CPC Class Codes: H10K 19/80 Interconnections, e.g. terminals
• CPC Class Codes: H10K 71/60 Forming conductive regions or layers, e.g. electrodes
• CPC Class Codes: H10K 85/111 comprising aromatic, heteroaromatic, or aryl chains, e.g. polyaniline, polyphenylene or polyphenylene vinylene
• CPC Class Codes: H10K 85/1135 Polyethylene dioxythiophene [PEDOT]; Derivatives thereof

Abstract

Electronic component comprising predominantly organic functional materials and a process for the production thereof. The invention concerns an electronic component comprising predominantly organic functional materials with improved through-plating. The through-plating is formed in the present case prior to application of the insulating layer, in the form of a free-standing raised portion.

Claims

1. An electronic component comprising a Plurality of predominantly organic functional layers at least one of which layers is a lower layer and at least one other of the layers is a central layer, said layers being coupled to at least one through-plating, having a cross-sectional profile which extends through the layers transversely to the layers and which through plating extends at least in part below the at least one central functional layer, has non-sharp contours and/or is at least in part in the shape of a truncated cone, whereby prior to the application of the through plating to the at least one central functional layer the at least one lower functional layer is locally treated with the through plating.

2. The An electronic component as set forth in claim 1 wherein the cross-sectional profile of the through plating comprises a free-standing raised portion of electrically conductive or non-conductive material.

3. The electronic component as set forth in claim 2 wherein the conductive material includes polyaniline, pedot, carbon black, graphite, conducting silver and/or metal and/or a mixture thereof.

4. The electronic component as set forth in claim 2 including a non-conducting material wherein at least one of the central functional layer and the non-conducting material includes an insulating material such as polyhydroxystyrene, polymethylmethacrylate and/or polystyrene and/or a semiconducting material such as polyalkylthiophene and/or polyfluorene and/or a mixture thereof.

5. The electronic component as set forth in claim 1 wherein of the through-plating is in the form of a raised portion that has a surface roughness which promotes contacting.

6. The electronic component as set forth in one of the preceding claims wherein the cross-sectional profile shows a chemical treatment at least of a lower functional layer.

7. The electronic component as set forth in one claims 1-5 wherein the cross-sectional profile shows a physical treatment of at least of a lower functional layer.

8. The electronic component as set forth in one of claims 1-5 wherein the cross-sectional profile shows a local disruption location on the at least one lower functional layer.

9. The electronic component as set forth in one of claims 1-5 wherein the cross-sectional profile shows a preceding locally restricted change in the surface energy of the at least one lower functional layer, at which no wetting by a subsequently applied organic material of a subsequent central functional layer occurred.

10. The electronic component as set forth in one of claims 1-5 wherein a disruption location is produced locally on the at least one lower functional layer chemically by application of a material, at which prior to or after application of one of the central functional layers the dislocation can be detected by at least one of material residues, the shape of the disruption location and/or traces on the at least one lower functional layer.

11. The electronic component as set forth in one of claims 1-5 wherein the component is made up of a plastic substrate which includes one of the following materials:

PET, PP, PEN, polyimide, polyamide and/or coated paper.

13. The use of the component as set forth in one of claims 1 through 5 in an electronic product.

12. A process for the production of at least one through-plating of an electronic component comprising predominantly organic material and an insulating layer, wherein the through-plating is formed prior to application of the insulating layer.