Semiconductor encapsulating epoxy resin Composition and semiconductor device
First Claim
1. A semiconductor encapsulating epoxy resin composition comprising (A) an epoxy resin, (B) a phenolic resin curing agent in an amount to provide 0.5 to 1.5 moles of phenolic hydroxyl groups per mole of epoxy groups in the epoxy resin (A), (C) an inorganic filler in an amount of 400 to 1,200 parts by weight per 100 parts by weight of components (A) and (B) combined, and (D) a rare earth oxide in an amount of 0.5 to 20 parts by weight per 100 parts by weight of components (A) and (B) combined.
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Accused Products
Abstract
Epoxy resin compositions comprising (A) an epoxy resin, (B) a phenolic resin curing agent, (C) an inorganic filler, (D) a rare earth oxide, and optionally (E) a phosphazene compound cure into products having improved heat resistance and moisture-proof reliability and are best suited for the encapsulation of semiconductor devices.
33 Citations
14 Claims
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1. A semiconductor encapsulating epoxy resin composition comprising
(A) an epoxy resin, (B) a phenolic resin curing agent in an amount to provide 0.5 to 1.5 moles of phenolic hydroxyl groups per mole of epoxy groups in the epoxy resin (A), (C) an inorganic filler in an amount of 400 to 1,200 parts by weight per 100 parts by weight of components (A) and (B) combined, and (D) a rare earth oxide in an amount of 0.5 to 20 parts by weight per 100 parts by weight of components (A) and (B) combined.
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7. A semiconductor encapsulating, flame retardant epoxy resin composition comprising
(A) an epoxy resin, (B) a phenolic resin curing agent in an amount to provide 0.5 to 1.5 moles of phenolic hydroxyl groups per mole of epoxy groups in the epoxy resin (A), (C) an inorganic filler in an amount of 400 to 1,200 parts by weight per 100 parts by weight of components (A), (B) and (E) combined, (D) a rare earth oxide in an amount of 0.5 to 20 parts by weight per 100 parts by weight of components (A), (B) and (E) combined, and (E) a phosphazene compound of the average compositional formula (1): -
wherein X is a single bond or a group selected from among CH2, C(CH3)2, SO2, S, O, and O(CO)O, Y is OH, SH or NH2, R1 is a group selected from among C1-C4 alkyl and alkoxy groups, NH2, NR2R3 and SR4, wherein each of R2, R3 and R4 is a hydrogen atom or C1-C4 alkyl group, d, e, f and n are numbers satisfying 0≧
d≧
0.25n, 0≧
e≧
2n, 0≧
f≧
2n, 2d+e+f=2n, and 3≧
n≧
1,000, in an amount of 1 to 50% by weight based on the total weight of components (A), (B) and (E). - View Dependent Claims (8, 9, 10, 11, 12, 14)
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Specification