Endoscope electronics assembly

• US 20060025651A1
• Filed: 07/29/2004
• Published: 02/02/2006
• Est. Priority Date: 07/29/2004
• Status: Active Grant

• Current Assignee: Gyrus ACMI, Inc. (Olympus Corporation)
• Original Assignee: C2Cure Inc.
• Inventors: Adler, Doron, Finkman, Shai, Hanuka, David, Pillar, Ofer, Blumenzweig, Arie
• Granted Patent: US 7,300,397 B2
• Time in Patent Office: Days
• US Class Current: 600/110
• CPC Class Codes: A61B 1/0011 Manufacturing of endoscope parts
• CPC Class Codes: A61B 1/00114 Electrical cables in or with an endoscope
• CPC Class Codes: A61B 1/00124 electrical, e.g. electrical plug-and-socket connection
• CPC Class Codes: A61B 1/042 characterised by a proximal camera, e.g. a CCD camera
• CPC Class Codes: A61B 1/051 Details of CCD assembly
• CPC Class Codes: Y10S 600/92 Method of making endoscopes

Abstract

A method for assembling an endoscope that includes an imaging subassembly inside an insertion tube having distal and proximal ends. The method includes coupling the imaging subassembly to a plurality of wires, which have respective first and second ends, by fixing the first ends of the wires to the imaging subassembly. A connector is coupled to the wires by fixing the second ends of the wires to the connector. After coupling the imaging subassembly and the connector to the wires, the imaging subassembly is installed in the insertion tube by passing the connector through the insertion tube from the distal end of the insertion tube to the proximal end. After passing the connector through the insertion tube, the connector is inserted in a receptacle.

Claims

1. A method for assembling an endoscope that includes an imaging subassembly inside an insertion tube having distal and proximal ends, the method comprising:

coupling the imaging subassembly to a plurality of wires, which have respective first and second ends, by fixing the first ends of the wires to the imaging subassembly;

coupling a connector to the wires by fixing the second ends of the wires to the connector;

after coupling the imaging subassembly and the connector to the wires, installing the imaging subassembly in the insertion tube by passing the connector through the insertion tube from the distal end of the insertion tube to the proximal end; and

after passing the connector through the insertion tube, inserting the connector in a receptacle.

2. The method according to claim 1, and comprising testing the imaging subassembly by receiving signals from the connector after coupling the imaging subassembly and the connector to the wires and before installing the imaging subassembly in the insertion tube.

3. The method according to claim 1, wherein inserting the connector in the receptacle comprises coupling the imaging subassembly to convey signals to a processing subassembly via the wires.

4. The method according to claim 1, wherein the connector has an axis and comprises a first array of conductive elements disposed along the axis, and wherein coupling the connector to the wires comprises connecting the wires to the conductive elements.

5. The method according to claim 4, wherein the receptacle comprises a second array of conductive pads, and wherein coupling the connector to the receptacle comprises aligning the first and second arrays, and exerting a pressure on at least one of the connector and the receptacle so as to engender an electrical contact between the conductive elements and the conductive pads.

6. The method according to claim 5, wherein coupling the connector to the receptacle comprises inserting between the first and second arrays an elastomeric material comprising alternating conductive and non-conductive layers so that the electrical contact is formed through the elastomeric material.

7. The method according to claim 4, wherein the connector comprises a dielectric substrate, and wherein the conductive elements are formed from a layer of conductive material that is disposed on the dielectric substrate.

8. The method according to claim 4, wherein while passing the connector through the insertion tube, the axis of the connector is approximately parallel to the wires.

9. An electronic assembly for use in an endoscope that includes an insertion tube, the assembly comprising:

an imaging subassembly, comprising an image sensor;

an elongate connector, which has an axis and comprises a first array of conductive elements disposed along the axis, and which has transverse dimensions that are sufficiently small to permit the connector to pass through the insertion tube of the endoscope; and

wires, which have respective first ends that are fixed to the imaging subassembly and respective second ends that are fixed to the connector so as to electrically couple the imaging subassembly to the conductive elements of the connector.

10. The assembly according to claim 9, wherein the wires are fixed so as to couple the imaging subassembly to the conductive elements of the connector before installation of the assembly in the insertion tube of the endoscope.

11. The assembly according to claim 9, wherein the connector is adapted to be received by a receptacle, which includes a second array of conductive pads, by aligning the first and second arrays, inserting between the first and second arrays an elastomeric material comprising alternating conductive and non-conductive layers, and exerting a pressure on at least one of the connector and the receptacle so as to engender an electrical contact between the conductive elements and the conductive pads.

12. The assembly according to claim 9, wherein the connector comprises a dielectric substrate, and wherein the conductive elements are formed from a layer of conductive material that is disposed on the dielectric substrate.

13. A connector assembly, comprising:

an elongate connector, which has an axis and comprises a first array of conductive elements disposed along the axis, and which is adapted for coupling of respective wires to the conductive elements;

a receptacle, of a size and shape suitable for receiving the connector, and comprising a second array of conductive pads, positioned so as to be aligned with the first array when the connector is inserted in the receptacle; and

an elastomeric material, which comprises alternating conductive and non-conductive layers, and which is adapted to be held in the receptacle between the first and second arrays so as to provide electrical contact between the conductive elements and the conductive pads when the connector is inserted in the receptacle.

14. The assembly according to claim 13, wherein the connector comprises a dielectric substrate, and wherein the conductive elements are formed from a layer of conductive material that is disposed on the dielectric substrate.

15. The assembly according to claim 14, wherein the layer of conductive material is disposed on at least first and second sides of the substrate, wherein the first side is configured to contact the elastomeric material, and wherein the wires are attached to the conductive material on the second side.

16. The assembly according to claim 15, wherein the first and second sides are opposing sides of the substrate, and wherein the conductive material on the second side is electrically connected by through-holes passing through the substrate to the conductive elements on the first side.

17. An endoscope, comprising:

an insertion tube having distal and proximal ends and having an internal dimension;

an electronic assembly, which is installed inside the insertion tube, and comprises;

an imaging subassembly, comprising an image sensor, positioned in the distal end of the insertion tube;

an elongate connector, which protrudes from the proximal end of the insertion tube, and which has transverse dimensions that are smaller than the internal dimension of the insertion tube; and

wires, which pass through the insertion tube and which have respective first ends that are fixed to the imaging subassembly and respective second ends that are fixed to the connector so as to electrically couple the imaging subassembly to the connector; and

a processing assembly, comprising a receptacle that is adapted to receive the connector outside the proximal end of the insertion tube.

18. The endoscope according to claim 17, wherein the electronic assembly is installed in the insertion tube by passing the connector through the insertion tube from the distal end of the insertion tube to the proximal end after fixing the imaging subassembly and the connector to the wires.

19. The endoscope according to claim 18, wherein while passing the connector through the insertion tube, the axis of the connector is approximately parallel to the wires.

20. The endoscope according to claim 18, wherein the electronic assembly is tested by receiving signals from the connector after fixing the imaging subassembly and the connector to the wires and before installing the imaging subassembly in the insertion tube.

21. The endoscope according to claim 17, wherein the connector has an axis and comprises a first array of conductive elements disposed along the axis, and wherein the wires are connected to the conductive elements.

22. The endoscope according to claim 21, wherein the receptacle comprises a second array of conductive pads, and is adapted to receive the connector so as to align the first and second arrays, and to exert a pressure on at least one of the connector and the receptacle so as to engender an electrical contact between the conductive elements and the conductive pads.

23. The endoscope according to claim 22, wherein the receptacle comprises an elastomeric material, which comprises alternating conductive and non-conductive layers, and which is positioned between the first and second arrays so that the electrical contact is formed through the elastomeric material.

24. The method according to claim 22, wherein the connector comprises a dielectric substrate and a layer of conductive material that is disposed over the dielectric substrate, and wherein the conductive elements are formed from the layer of the conductive material.