Snap lid camera module

• US 20060027740A1
• Filed: 08/17/2005
• Published: 02/09/2006
• Est. Priority Date: 12/08/1999
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven, Glenn, Thomas P.
• Granted Patent: US 7,425,750 B2
• Time in Patent Office: Days
• US Class Current: 250/239
• CPC Class Codes: B29C 2043/023 having a plurality of grooves
• CPC Class Codes: B29C 33/0022 Multi-cavity moulds B29C33/301 takes precedence
• CPC Class Codes: B29C 43/36 Moulds for making articles of definite length, i.e. discrete articles
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/85 using a wire connector
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14632 Wafer-level processed structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14687 Wafer level processing
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01006 Carbon [C]
• CPC Class Codes: H01L 2924/01013 Aluminum [Al]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01032 : Germanium [Ge]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/16153 : Cap enclosing a plurality of side-by-side cavities [e.g. E-shaped cap]
• CPC Class Codes: H01L 2924/181 : Encapsulation

Abstract

An image sensor package includes a molding having a locking feature. The package further includes a snap lid having a tab, where the tab is attached to the locking feature of the molding. To form the image sensor package, a window is placed in a pocket of the molding. The snap lid is secured in place. Once secured, the snap lid presses against a peripheral region of an exterior surface of the window. The window is sandwiched between the molding and the snap lid and held in place.

Claims

1-17. -17. (canceled)

18. A camera module, comprising:

a substrate;

an image sensor comprising an active area for receiving light, said image sensor being coupled to a first surface of said substrate;

a molding coupled to said first surface of said substrate; and

a snap lid snapped onto said molding.

19. The camera module of claim 18 wherein said camera module is mounted on a larger substrate.

20. The camera module of claim 18 wherein said camera module is electrically connected to a larger substrate.

21. The camera module of claim 18 further comprising a means for electrically connecting said camera module to a larger substrate.

22. The camera module of claim 21 wherein said means for electrically connecting is coupled to a second surface of said substrate.

23. The camera module of claim 18 further comprising an adhesive layer coupling said molding to said substrate.

24. The camera module of claim 23 wherein said molding is attached to a periphery of said first surface of said substrate by said adhesive layer.

25. The camera module of claim 18 wherein said snap lid comprises a lens holder extension portion comprising a threaded aperture, said camera module further comprising a lens barrel threaded into said threaded aperture.

26. The camera module of claim 25 wherein said lens barrel comprises an optical element.

27. The camera module of claim 26 wherein said optical element comprises at least one lens.

28. The camera module of claim 26 wherein said optical element focuses said light on said active area.

29. The camera module of claim 26 wherein rotation of said lens barrel moves said optical element relative to said active area.

30. The camera module of claim 25 wherein a longitudinal axis of said threaded aperture of said lens holder extension portion is perpendicular to a plane parallel to said active area of said image sensor.

31. The camera module of claim 18 wherein bond pads of said image sensor are coupled to traces of said substrate.

32. The cameral module of claim 18 further comprising bond wires coupling bond pads of said image sensor to traces of said substrate.

33. A camera module, comprising:

a substrate;

an image sensor comprising an active area for receiving light, said image sensor being coupled to a first surface of said substrate;

a molding coupled to said first surface of said substrate;

a snap lid snapped onto said molding; and

a window between said snap lid and said molding.

34. The camera module of claim 33 wherein said window, said molding, said adhesive layer, and said substrate form an enclosure around said image sensor.

35. The camera module of claim 33 wherein said snap lid comprises a lens holder extension portion comprising a threaded aperture, said camera module further comprising a lens barrel threaded into said threaded aperture.

36. The camera module of claim 33 wherein said molding comprises a pocket, said window being supported in said pocket.

37. A camera module comprising:

a substrate;

an image sensor comprising an active area for receiving light, said image sensor being coupled to said substrate;

bond wires coupling bond pads of said image sensor to traces of said substrate;

a molding;

an adhesive layer coupling said molding to said substrate;

a snap lid snapped onto said molding, said snap lid comprising a lens holder extension portion;

a lens barrel inserted into a threaded aperture of said lens holder extension portion, said lens barrel comprising an optical element for focusing said light on said active area of said image sensor; and

a means for electrically connecting said camera module to a larger substrate.