Electrical contact encapsulation
First Claim
Patent Images
1. An electronic device comprising:
- a substrate;
an electrical contact disposed on the substrate;
a lead electrically coupled to the electrical contact;
a polymer enclosing the electrical contact; and
a first film disposed over the electrical contact and in contact with the polymer;
a second film disposed over the first film.
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Accused Products
Abstract
An electronic device comprises a substrate and an electrical contact in contact with the dielectric layer and electrically coupled with at least one resistor, a substrate carrier including an electrical trace electrically coupled to the electrical contact, a polymer enclosing the electrical contact, and a substantially planar film disposed over the electrical contact.
62 Citations
59 Claims
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1. An electronic device comprising:
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a substrate;
an electrical contact disposed on the substrate;
a lead electrically coupled to the electrical contact;
a polymer enclosing the electrical contact; and
a first film disposed over the electrical contact and in contact with the polymer;
a second film disposed over the first film. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An electronic device, comprising:
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a substrate;
an electrical contact disposed on the substrate;
a lead electrically coupled to the electrical contact;
a polymer enclosing the electrical contact; and
a substantially planar film disposed over the electrical contact. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. An electronic device comprising:
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a substrate including at least one resistor disposed thereon, a dielectric layer disposed over at least a portion of the substrate, and an electrical contact in contact with the dielectric layer and electrically coupled with the at least one resistor;
a substrate carrier including an electrical trace electrically coupled to the electrical contact;
a polymer enclosing the electrical contact; and
a substantially planar film disposed over the electrical contact. - View Dependent Claims (33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43, 44)
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45. A method of forming a contact comprising:
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providing a substrate including an electrical contact;
providing a lead;
coupling at least part of the lead with the electrical contact;
encapsulating at least a portion of the lead and electrical contact that have been coupled; and
applying a film over the substrate so that at least a portion of the lead and electrical contact that have been coupled is covered by the film. - View Dependent Claims (46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57)
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58. A method of forming a contact comprising:
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providing a substrate including an electrical contact;
providing a lead;
coupling at least part of the lead with the electrical contact; and
applying a film over the substrate so that at least a portion of the lead and electrical contact that have been coupled is covered by the film. - View Dependent Claims (59)
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Specification