Process and a device for the calibration of a semiconductor component test system

• US 20060028225A1
• Filed: 07/21/2005
• Published: 02/09/2006
• Est. Priority Date: 07/22/2004
• Status: Abandoned Application

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: von Appen, Stephan
• Application Number:
  US11/185,967
• Publication Number:
  US 20060028225A1
• Time in Patent Office: Days
• US Class Current: 324/750.20
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: G01R 31/3191 Calibration
• CPC Class Codes: G01R 35/00 Testing or calibrating of apparatus covered by the other groups of this subclass

Abstract

The invention relates to a device, in particular a probe card to be used for the testing of semi-conductor components, and/or a device, in particular a probe card, to be used in the calibration of a semi-conductor component test system and/or of a semi-conductor component test apparatus, a contact mechanism, in particular a wafer, as well as a process to be used in the calibration of a semi-conductor component test system and/or of a semi-conductor component test apparatus. The device and/or the probe card comprises a calibration device or parts of a calibration device, in particular a standard and/or reference comparator device and/or a standard and/or a reference driver device.

Claims

1. A device configured to test semi-conductor components, comprising:

at least one contact element for contacting corresponding semi-conductor components, arranged on a wafer; and

at least part of a calibration device configured to calibrate a semi-conductor component test system and/or a semi-conductor component test apparatus.

2. The device according to claim 1, wherein the calibration device comprises a standard and/or reference comparator device for receiving test signals emitted by a test apparatus connected with the device.

3. The device according to claims 1, wherein the calibration device comprises a standard and/or reference driver device for sending test signals to a test apparatus connected with the device.

4. The device according to claim 1, wherein the at least part of a calibration device are connected to the device in a fixed and non-removable fashion.

5. The device according to claim 1, wherein the at least part of a calibration device are connected to the device in a removable fashion.

6. The device according to claim 5, wherein the at least part of a calibration device are connected with the device by means of a disconnectable plug-in connection.

7. The device according to claim 5, wherein the at least part of a calibration device are connected with the device by means of a disconnectable clipped connection.

8. The device according to claim 5, wherein the at least part of a calibration device are connected with the device by means of a disconnectable screw connection.

9. The device according to claim 1, wherein the at least one contact element is a contact pin.

10. A device configured to calibrate a semi-conductor component test system and/or a semi-conductor component test apparatus, comprising:

at least one contact element; and

at least part of a calibration device configured to calibrate the semi-conductor component test system and/or the semi-conductor component test apparatus.

11. A contact device configured for calibration of a semi-conductor component test apparatus and/or a semi-conductor component test system, comprising:

a first connection, at which a corresponding signal can be entered; and

a second connection, connected or connectable with the first connection, at which the signal can be emitted.

12. The contact device according to claim 11, configured such that, in a first setting of a device, a first contact element of the device, connected or connectable with a standard and/or reference driver device of the calibration device, contacts the first connection, and a second contact element of the device, connected or connectable with a standard and/or reference comparator device of the calibration device, contacts the second connection.

13. A system, which comprises:

a contact device configured for calibration of a semi-conductor component test apparatus and/or a semi-conductor component test system, including a first connection, at which a corresponding signal can be entered, and a second connection, connected or connectable with the first connection, at which the signal can be emitted; and

a device configured to test semi-conductor components, including at least one contact element for contacting corresponding semi-conductor components, arranged on a wafer, and at least part of a calibration device configured to calibrate a semi-conductor component test system and/or a semi-conductor component test apparatus.

14. A process to be used in the calibration of a semi-conductor component test system and/or of a semi-conductor component test apparatus, comprising:

emitting a signal at a driver channel of a semi-conductor component test apparatus; and

relaying the signal to a probe card, wherein the probe card comprises a standard and/or reference comparator device, which receives the signal.

15. A process to be used for the calibration of a semi-conductor component test system and/or a semi-conductor component test apparatus, comprising:

relaying a signal from a probe card to a comparator channel of a semi-conductor component test apparatus, wherein

the probe card comprises a standard and/or reference driver device, which emits the signal.