Component arrangement with a planar transformer

• US 20060028313A1
• Filed: 07/26/2005
• Published: 02/09/2006
• Est. Priority Date: 07/26/2004
• Status: Active Grant

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Feldtkeller, Martin, Strzalkowski, Bernhard
• Granted Patent: US 7,233,224 B2
• Time in Patent Office: Days
• US Class Current: 336/223
• CPC Class Codes: H01F 2027/2819 Planar transformers with printed windings, e.g. surrounded by two cores and to be mounted on printed circuit
• CPC Class Codes: H01F 27/2804 Printed windings
• CPC Class Codes: H01F 27/34 Special means for preventing or reducing unwanted electric or magnetic effects, e.g. no-load losses, reactive currents, harmonics, oscillations, leakage fields

Abstract

The invention relates to a component arrangement which has the following features:

• • a semiconductor body (10),
  • a dielectric layer (20) which is applied to one face of the semiconductor body (10),
  • a planar transformer with a primary winding (40) and a secondary winding (30), which are isolated from one another by the dielectric layer (20) and are arranged at a distance from one another in a vertical direction with respect to the one face of the semiconductor body,
  • a first planar winding section (31) and a second planar winding section (32) of the secondary winding (30), which are arranged at a distance from one another in the vertical direction and are electrically conductively connected to one another, with a first connection (34) of the first winding section (31) forming a first connection of the secondary winding, and a first connection (36) of the second winding section (32) forming a second connection of the secondary winding.

Claims

1. (canceled)

19. The component arrangement as claimed in claim 11, in which the secondary winding is arranged on a first wiring level, the third winding is arranged on a second wiring level, and the primary winding is arranged on a third wiring level of the dielectric layer.

2. (canceled)

10. (canceled)

21. A component arrangement, comprising:

a semiconductor body including a face;

a planar transformer including a primary winding and further including a secondary winding vertically spaced apart from the primary winding with respect to the face, the secondary winding including a first planar winding section having a first connection forming a first connection of the secondary winding and further including a second planar winding section electrically conductively connected to the first planar winding section, vertically spaced apart from the first planar winding section with respect to the face, and having a first connection forming a second connection of the secondary winding; and

a dielectric layer positioned on the face and isolating the primary winding from the secondary winding.

3. The component arrangement as claimed in claim 21, in which the first and second planar winding sections each have more than one turn.

4. The component arrangement as claimed in claim 3, in which a second connection of the first planar winding section is connected to a second connection of the second planar winding section.

5. The component arrangement as claimed in claim 3, in which a winding sense of the first planar winding section runs in the opposite direction to a winding sense of the second planar winding section.

6. The component arrangement as claimed in claim 21, in which the first planar winding section has more than one turn, and in which the second planar winding section has exactly one turn, one of whose ends is separated from its other end by a gap.

7. The component arrangement as claimed in claim 6, in which the second connection of the first planar winding section is connected to the first end of the second planar winding section, and in which the second end forms the first connection of the second planar winding section.

8. The component arrangement as claimed in claim 6, in which the second connection of the first planar winding section is connected to the first end of the second planar winding section, and in which the first end forms the first connection of the second planar winding section.

9. The component arrangement as claimed in claim 6, in which the dimensions of the second planar winding section in a lateral direction correspond at least approximately to the dimensions of at least one of the first planar winding section and the primary winding.

14. The component arrangement as claimed in claim 21, in which the windings are composed of a metal.

15. The component arrangement as claimed in claim 22, in which the first and second winding sections each have more than one turn.

16. The component arrangement as claimed in claim 4, in which a winding sense of the first winding section runs in the opposite direction to a winding sense of the second winding section.

17. The component arrangement as claimed in claim 22, in which the first winding section has more than one turn, and in which the second winding section has exactly one turn, one of whose ends is separated from its other end by a gap.

18. The component arrangement as claimed in claim 8, in which the dimensions of the second winding section in a lateral direction correspond at least approximately to the dimensions of at least one of the first winding section and the primary winding.

22. The component arrangement as claimed in claim 21, further comprising:

an electrically conductive connection;

wherein the first planar winding section of the secondary winding is positioned at a first wiring level, the second planar winding section of the secondary winding is positioned at a second wiring level, the primary winding is positioned on the dielectric layer at a third wiring level, and the electrically conductive connection extends vertically with respect to the face to connect the first planar winding section of the secondary winding to the second planar winding section of the secondary winding.

23. A component arrangement, comprising:

a semiconductor body including a face;

a planar transformer including a primary winding and further including a secondary winding vertically spaced apart from the primary winding with respect to the face;

a dielectric layer positioned on the face and isolating the primary winding from the secondary winding;

a third winding positioned in a plane vertically spaced between the primary winding and the secondary winding with respect to the face, the third winding including exactly one turn defining a cutout, the turn having a first end and a second end spaced apart from the first end, the space between the first end and the second end defining a gap; and

a connect link extending from the secondary winding, further extending to the plane vertically with respect to the face and, and further extending in the plane through the gap and into the cutout.

11. The component arrangement as claimed in claim 23, in which the dimensions of the third winding in a lateral direction correspond at east approximately to the dimensions of at least one of the secondary winding and the primary winding.

12. The component arrangement as claimed in claim 23, in which the secondary winding is arranged on a first wiring level, the third winding is arranged on a second wiring level, and the primary winding is arranged on a third wiring level of the dielectric layer.

13. The component arrangement as claimed in claim 23, in which the third winding is connected to a connection for a reference ground potential for the semiconductor body.

20. The component arrangement as claimed in claim 12, in which the third winding is connected to a connection for a reference ground potential for the semiconductor body.