Apparatus and methods for constructing antennas using wire bonds as radiating elements
First Claim
Patent Images
1. An antenna device, comprising:
- a substrate; and
an antenna comprising at least one wire as a radiating element, wherein the at least one wire is attached to a surface of the substrate.
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Abstract
Antennas are provided which are constructed using one or more wires as radiating elements attached to a substrate or chip, wherein wire bonding methods can be used to attach and form loop profiles for the wires. The antennas can be integrally packaged with IC chips (e.g., IC transceivers, receivers, transmitters, etc.) to build integrated wireless or RF (radio frequency) communications systems.
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Citations
31 Claims
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1. An antenna device, comprising:
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a substrate; and
an antenna comprising at least one wire as a radiating element, wherein the at least one wire is attached to a surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. An integrated communications device, comprising:
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a IC (integrated circuit) chip; and
an antenna comprising at least one wire as a radiating element, wherein the at least one wire is attached to a surface of the IC chip. - View Dependent Claims (16, 17, 18, 19)
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20. An IC (integrated circuit) package apparatus, comprising:
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a carrier substrate;
an IC chip surface mounted to the carrier substrate;
an antenna comprising at least one wire as a radiating element, wherein the at least one wire is bonded to an active surface of the IC chip; and
a package cover that encapsulates the IC chip and antenna. - View Dependent Claims (21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification