Image sensor camera module and method of fabricating the same

• US 20060028573A1
• Filed: 07/07/2005
• Published: 02/09/2006
• Est. Priority Date: 08/06/2004
• Status: Active Grant

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Kong, Yung-Cheol, Lee, Seok-Won, Seo, Byoung-Rim, Doh, Jae-Cheon
• Granted Patent: US 7,484,901 B2
• Time in Patent Office: Days
• US Class Current: 348/340
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof

Abstract

The invention involves an image sensor camera module and a method of fabricating the image sensor camera module. The image sensor camera module uses a single-body type lens holder defined by a hollow cylindrical body having a shoulder protruding radially inwardly from an inner surface thereof. First and second lenses therein are spaced apart by a first spacer and a filter therein is spaced from the second lens by a second spacer. An image sensor is adhered to a lower rim of the body, and the filter is adhered to an upper rim thereof. All optical elements within the lens holder thus are affixed in fixed relative position compatible with a predefined focal length and axis. Moreover, the adhesively sealed interior of the body of the image sensor camera module prevents particulate contamination.

Claims

1. An image sensor camera module comprising:

a lens holder defined by a single generally cylindrical body having an opening extending axially therethrough;

a first lens installed inside the lens holder;

an image sensor comprising an upper surface directly adhered to an inner surface of the cylindrical body; and

a circuit board electrically coupled to terminals of the image sensor.

2. The image sensor camera module of claim 1, wherein the inner surface of the lens holder includes a generally planar substantially contiguous peripheral inward protrusion to support the first lens.

3. The image sensor camera module of claim 1, wherein a filling adhesive is filled between the body of the lens holder and the circuit board.

4. The image sensor camera module of claim 1, further comprising a second lens installed inside the lens holder, the second lens being spaced apart from and above the first lens via a spacer.

5. The image sensor camera module of claim 4, further comprising a filter placed above the second lens.

6. The image sensor camera module of claim 5, wherein the lens holder, the first lens, the image sensor, the circuit board, the second lens and the filter are all affixed in a predefined fixed positional relationship to one another that defines an aligned and fixed-distance focal length at least as among the first and second lens and the image sensor.

7. An image sensor camera module comprising:

a lens holder defined by a hollow cylindrical body with an axial opening therethrough into which first and second lenses are inserted in spaced-apart relationship from each other;

a filter adhered to an inner surface of a first rim of the lens holder above the second lens to expose an outer surface of the filter;

an image sensor including an upper surface, the upper surface being adhered to the inner surface of the lens holder under the first lens; and

a circuit board electrically coupled to terminals of the image sensor adjacent a second opposite rim of the lens holder.

8. The image sensor camera module of claim 7, wherein the body of the lens holder includes a generally planar substantially contiguous peripheral inward protrusion to support the first lens.

9. The image sensor camera module of claim 8, wherein the image sensor is adhered adjacent the second rim of the body of the lens holder to a lower surface of the protrusion using an adhesive.

10. The image sensor camera module of claim 7, wherein the filter is adhered to the inner surface of the body of the lens holder adjacent the first rim thereof to seal an interior of the lens holder.

11. The image sensor camera module of claim 7, wherein a filling adhesive is filled between the lens holder and the circuit board.

12. The image sensor camera module of claim 7, wherein a passivation layer is formed on the upper surface of the image sensor.

13. A method of fabricating an image sensor camera module, comprising:

providing a single-body type lens holder having an inwardly extending shoulder on an inside surface;

placing a first lens flush against the shoulder;

placing a first spacer flush against the lens;

placing a second lens flush against the first spacer;

placing a second spacer flush against the second lens;

sealingly adhering a filter flush against the second spacer adjacent a first end of the lens holder;

sealingly adhering an image sensor to a lower surface of the shoulder adjacent a second opposite end of the lens holder; and

electrically coupling terminals of the image sensor to a circuit board.

14. The method of claim 13, further comprising:

filling a filling adhesive between the image sensor and the circuit board.

15. The method of claim 13, wherein the terminals of the image sensor are directly coupled to corresponding terminals of the circuit board.

16. The method of claim 13, wherein the filter and the image sensor are adhered to the lens holder using an adhesive.

17. The method of claim 13 which further comprises:

affixing the lens holder, the first lens, the image sensor, the circuit board, the second lens and the filter in a fixed predetermined positional relationship to one another that defines an aligned and fixed-distance focal length at least as among the first and second lens and the image sensor.

18. A method of fabricating an image sensor camera module, the method comprising:

providing a single-body type lens holder into which first and second lenses are inserted in spaced-apart relationship with each other via a spacer and to which a filter is adhered above the second lens to expose an outer surface of the filter to the outside of the lens holder;

adhering an upper peripheral surface of an image sensor to an inner peripheral surface of the lens holder under the first lens;

electrically coupling terminals of the image sensor to a circuit board under the lens holder; and

filling a filling adhesive between the image sensor and the circuit board.

19. The method of claim 18, wherein the inner peripheral surface of the lens holder is adhered to the upper peripheral surface of the image sensor using an adhesive.

20. The method of claim 18, wherein the inner peripheral surface of the lens holder is adhered to the upper peripheral surface of the image sensor, and wherein substantially the entire upper surface of the image sensor is passivated by a passivation layer.