Multi-swap communication module

• US 20060029094A1
• Filed: 08/07/2004
• Published: 02/09/2006
• Est. Priority Date: 08/07/2004
• Status: Active Grant

• Current Assignee: C-One Technology Corporation (Pretec Electronics Corporation)
• Original Assignee: C-One Technology Corporation (Pretec Electronics Corporation)
• Inventors: Yu, Gordon, Chen, Jui-Chung, Wen, Forli
• Granted Patent: US 7,324,835 B2
• Time in Patent Office: Days
• US Class Current: 370/438
• CPC Class Codes: H04B 1/40 Circuits
• CPC Class Codes: H04W 88/02 Terminal devices
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence

Abstract

A multi-swap communication module includes a motherboard and a daughterboard. The motherboard is provided with a plurality of necessary components for maintaining the operation of a wireless communication card and the daughterboard is connectable with the motherboard. The daughterboard is a modular add-on card swappable according to different requests, while the motherboard reads control data selectively either in the motherboard or in the daughterboard by means of a swapping action of the daughterboard.

Claims

1. A multi-swap communication module of General Packet Radio Service (GPRS) comprising at least a motherboard and a daughterboard, in which the motherboard is provided with at least some necessary components for operating a wireless communication card;

the daughterboard is a modular appended card swappable according to different requests; and

the wireless communication card will selectively read the control data either in the motherboard or in the daughterboard referring to a swapping action of the daughterboard.

2. The multi-swap communication module according to claim 1, wherein the necessary components include at least a multi-function controller, an Electrically Erasable programmable Read Only Memory (E²PROM), a bus, a wireless communication module, and a connector.

3. The multi-swap communication module according to claim 2, wherein the control data of the motherboard is stored in the E²PROM.

4. The multi-swap communication module according to claim 1, wherein the daughterboard is provided with at least an E²PROM and a connector, and further, at least one of four components including a battery pack, a memory slot, a Global Positioning System (GPS) module, or a wireless communication module.

5. The multi-swap communication module according to claim 4, wherein the control data of the daughterboard is stored in the E²PROM.

6. The multi-swap communication module according to claim 3, wherein depending on a switching chip, the multi-function controller is supposed to selectively read the control data from the E²PROM either on the motherboard or on the daughterboard.

7. The multi-swap communication module according to claim 6, wherein the operation of the switching chip depends on a swapping action of the daughterboard that performs an ON/OFF operation of a pin in the switching chip.

8. The multi-swap communication module according to claim 5, wherein the control dada is transmitted to the multi-function controller in the order through the connector then the bus.

9. The multi-swap communication module according to claim 1, wherein the necessary components include at least a multi-function controller, a Solid Static Disk device bridge chip (SSD), an E²PROM, two buses, a wireless communication module, and a connector.

10. The multi-swap communication module according to claim 9, wherein the two buses are connected the connector and the multi-function controller respectively to the SSD.

11. The multi-swap communication module according to claim 10, wherein the control data on the motherboard is stored in the E²PROM.

12. The multi-swap communication module according to claim 11, wherein the daughterboard is provided with at least an E²PROM and a connector, and further, at least one of four components including a battery pack, a memory slot, a Global Positioning System (GPS) module, or a wireless communication module.

13. The multi-swap communication module according to claim 12, wherein the control data of the daughterboard is stored in the E² PROM.

14. The multi-swap communication module according to claim 11, wherein depending on a switching chip, the multi-function controller is supposed to selectively read the control data from the E²PROM either on the motherboard or on the daughterboard.

15. The multi-swap communication module according to claim 14, wherein the operation of the switching chip depends on a swapping action of the daughterboard that performs an ON/OFF operation of a pin in the switching chip.

16. The multi-swap communication module according to claim 13, wherein the control data is transmitted to the multi-function controller in the order through the connector, the bus, the SSD, and the other bus on the motherboard.

17. The multi-swap communication module according to claim 1, wherein the necessary components include at least a multi-function controller, an SSD, an E²PROM, a first bus, a second bus, a third bus, a wireless communication module, and a connector.

18. The multi-swap communication module according to claim 17, wherein the control data of the motherboard is stored in the E²PROM.

19. The multi-swap communication module according to claim 1, wherein the daughterboard is provided with at least an E²PROM and a connector, and further, at least one of four components including a battery pack, a memory slot, a Global Positioning System (GPS) module, or a wireless communication module.

20. The multi-swap communication module according to claim 18, wherein the control data of the daughterboard is stored in the E²PROM.

21. The multi-swap communication module according to claim 18, wherein the control data is transmitted to the multi-function controller in the order through the connector, the first bus, the SSD, then the second bus.

22. The multi-swap communication module according to claim 21, wherein the transmission path of the control data is determined by a switching chip.

23. The multi-swap communication module according to claim 18, wherein the control data is transmitted to the multi-function controller in the order through the connector, then the third bus on the motherboard.

24. The multi-swap communication module according to claim 23, wherein the transmission path of the control data is determined by a switching chip.

25. The multi-swap communication module according to claim 22, wherein the operation of the switching chip is determined by a swapping action of the daughterboard.

26. The multi-swap communication module according to claim 18, wherein depending on a switching chip, the multi-function controller is supposed to selectively read the control data from the E²PROM either on the motherboard or on the daughterboard.

27. The multi-swap communication module according to claim 26, wherein the operation of the switching chip depends on a swapping action of the daughterboard that performs an ON/OFF operation of a pin in the switching chip.