×

Device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

  • US 20060032587A1
  • Filed: 10/18/2005
  • Published: 02/16/2006
  • Est. Priority Date: 09/29/2000
  • Status: Abandoned Application
First Claim
Patent Images

1. A device for connecting two wafers one on top of another in a planar manner, the device comprising:

  • a vacuum chamber having a chamber volume and an evacuating device for said chamber volume;

    a chuck having an evacuating device for receiving a carrier wafer having a surface with a double-sided adhesive film or an adhesive layer;

    a heating device for heating up said chuck; and

    a vacuum-chamber cover having a vacuum-holding device for holding a product wafer having a surface;

    said vacuum-holding device configured on said vacuum-chamber cover for suspending the product wafer in said vacuum chamber at a distance above the carrier wafer such that the surface of the product wafer and the surface of the carrier wafer are congruent before being connected.

View all claims
  • 0 Assignments
Timeline View
Assignment View
    ×
    ×