Device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer

• US 20060032587A1
• Filed: 10/18/2005
• Published: 02/16/2006
• Est. Priority Date: 09/29/2000
• Status: Abandoned Application

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Kroninger, Werner, Hecht, Franz, Lutzke, Melanie
• Application Number:
  US11/252,477
• Publication Number:
  US 20060032587A1
• Time in Patent Office: Days
• US Class Current: 156/382
• CPC Class Codes: H01L 21/67092 Apparatus for mechanical treatment or grinding or cutting, see the relevant groups in subclasses B24B or B28D
• CPC Class Codes: H01L 21/67132 Apparatus for placing on an insulating substrate, e.g. tape
• CPC Class Codes: H01L 21/6838 with gripping and holding devices using a vacuum; Bernoulli devices

Abstract

A device for connecting two wafers in a planar manner for grinding down and cutting up a product wafer has a vacuum chamber, a chuck for receiving a carrier wafer, a heating device for heating up the chuck and a vacuum-chamber cover with a vacuum-holding device, on which a product wafer can be arranged suspended above the carrier wafer. After the evacuation of the vacuum chamber, the active surface of the product wafer is dropped onto a double-sided adhesive film on the carrier wafer and is pressed into place by the rising pressure during air admission. The result is that the wafers are connected together.

Claims

1. A device for connecting two wafers one on top of another in a planar manner, the device comprising:

a vacuum chamber having a chamber volume and an evacuating device for said chamber volume;

a chuck having an evacuating device for receiving a carrier wafer having a surface with a double-sided adhesive film or an adhesive layer;

a heating device for heating up said chuck; and

a vacuum-chamber cover having a vacuum-holding device for holding a product wafer having a surface;

said vacuum-holding device configured on said vacuum-chamber cover for suspending the product wafer in said vacuum chamber at a distance above the carrier wafer such that the surface of the product wafer and the surface of the carrier wafer are congruent before being connected.

2. The device according to claim 1, wherein:

said vacuum-holding device has a surface and a plurality of guiding pins protruding perpendicularly from said surface of said holding device; and

said plurality of guiding pins being conically shaped.

3. The device according to claim 2, wherein each of said plurality of guiding pins has a conical base area positioned on said vacuum-holding device and a cone tip protruding from said vacuum-holding device.

4. The device according to claim 2, in combination with the product wafer, wherein:

the product wafer has an edge region and is being held on said vacuum-holding device; and

said plurality of guiding pins are configured near the edge region of the product wafer.

5. The device according to claim 2, wherein said vacuum-holding device has a plurality of guiding pins configured, in relation to said chuck, for ensuring that when the carrier wafer is on said chuck and when the product wafer is being received on the double-sided adhesive film or on the adhesive layer of the carrier wafer, the product wafer is received in a precise and aligned manner.

6. The device according to claim 1, further comprising:

a first vacuum valve, a second vacuum valve, and a third vacuum valve;

said vacuum-holding device having an evacuating device;

said first vacuum valve configured between said evacuating device of said vacuum-holding device and said vacuum-chamber cover;

said second vacuum valve configured between said evacuating device of said vacuum chamber and said vacuum chamber; and

said third vacuum valve configured between said evacuating device of said chuck and said chuck.

7. The device according to claim 1, wherein said vacuum-holding device includes at least three guiding pins.

8. The device according to claim 1, wherein said vacuum-holding device includes at least five guiding pins.

9. The device according to claim 1, in combination with the product wafer and the carrier wafer, wherein:

the product wafer has a thickness;

said vacuum-holding device has a surface;

said chuck has a surface;

said vacuum-holding device includes a plurality of guiding pins that have a length of at least the thickness of the product wafer plus a distance between the product wafer and the double-sided adhesive film or the adhesive layer of the carrier wafer on said chuck; and

said length of each of said plurality of said guiding pins of said vacuum-holding device is less than a distance between said surface of said vacuum-holding device of said vacuum-chamber cover and said surface of said chuck.

10. The device according to claim 1, wherein:

said vacuum-holding device includes a plurality of guiding pins; and

each of said plurality of said guiding pins of said vacuum-holding device has a conical base area with a diameter of 200 to 1200 micrometers.

11. The device according to claim 1, wherein:

said vacuum-holding device includes a plurality of guiding pins; and

each of said plurality of said guiding pins of said vacuum-holding device has a cone tip with a diameter of 100 to 500 micrometers.

12. The device according to claim 1, wherein:

said vacuum-holding device has a first vacuum valve and a plurality of depressions; and

said vacuum-holding device has an evacuating device; and

said first vacuum valve is for connecting said plurality of depressions of said vacuum-holding device to said evacuating device of said vacuum-holding device.

13. The device according to claim 12, wherein:

said plurality of depressions are concentric grooves formed in said vacuum-holding device; and

each of said plurality of depressions has a groove base with a drilled hole communicating with said evacuating device of said vacuum-holding device.

14. The device according to claim 1, wherein:

said chuck has a surface; and

said chuck includes a plurality of positioning pins protruding perpendicularly from said surface of said chuck.

15. The device according to claim 14, wherein:

said plurality of positioning pins are conically shaped; and

each of said plurality of positioning pins has a cone base area positioned on said surface of said chuck and a cone tip protruding from said surface of said chuck.

16. The device according to claim 14, in combination with the carrier wafer, wherein:

the carrier wafer has an edge region and is being held on said chuck; and

said plurality of positioning pins of said chuck are configured near the edge region of the carrier wafer.

17. The device according to claim 14, wherein said positioning pins of said chuck are configured, in relation to said vacuum-holding device, for ensuring that when the carrier wafer is on said chuck and when the product wafer is being received on the double-sided adhesive film or on the adhesive layer of the carrier wafer, the product wafer is received in a precise and aligned manner.

18. The device according to claim 14, in combination with the carrier wafer, wherein:

the carrier wafer has a thickness; and

each of said plurality of positioning pins of said chuck has a length that is less than or equal to the thickness of the carrier wafer.

19. The device according to claim 14, in combination with the carrier wafer and the product wafer, wherein:

the carrier wafer has an edge and is being held on said chuck;

the product wafer has an edge and is being held by said vacuum holding device;

the carrier wafer and the product wafer will be connected together;

said vacuum-holding device includes a plurality of guiding pins; and

said plurality of positioning pins are configured offset from said plurality of guiding pins with respect to the edge of the carrier wafer and the edge of the product wafer.