Radio frequency identification (RFID) tag and manufacturing method thereof

• US 20060032926A1
• Filed: 12/08/2004
• Published: 02/16/2006
• Est. Priority Date: 08/13/2004
• Status: Active Grant

• Current Assignee: Fujitsu Limited
• Original Assignee: Fujitsu Limited
• Inventors: Kai, Manabu, Hayashi, Hiroyuki, Baba, Shunji, Maniwa, Toru, Yamagajo, Takashi
• Granted Patent: US 7,342,498 B2
• Time in Patent Office: Days
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07771 the record carrier comprising means for minimising adverse effects on the data communication capability of the record carrier, e.g. minimising Eddy currents induced in a proximate metal or otherwise electromagnetically interfering object
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01078 Platinum [Pt]
• CPC Class Codes: H01L 2924/15153 the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15165 Monolayer substrate
• CPC Class Codes: H01Q 1/2208 associated with components used in interrogation type services, i.e. in systems for information exchange between an interrogator/reader and a tag/transponder, e.g. in Radio Frequency Identification [RFID] systems methods or arrangements for sensing record carriers, e.g. for reading patterns G06K7/00; record carrier for use with machines and with at least a part designed to carry digital markings G06K19/00
• CPC Class Codes: H01Q 1/2216 used in interrogator/reader equipment
• CPC Class Codes: H01Q 1/2225 used in active tags, i.e. provided with its own power source or in passive tags, i.e. deriving power from RF signal
• CPC Class Codes: H01Q 23/00 Antennas with active circuits or circuit elements integrated within them or attached to them
• CPC Class Codes: H01Q 7/00 Loop antennas with a substantially uniform current distribution around the loop and having a directional radiation pattern in a plane perpendicular to the plane of the loop
• CPC Class Codes: Y10T 29/49117 Conductor or circuit manufacturing
• CPC Class Codes: Y10T 29/49124 On flat or curved insulated base, e.g., printed circuit, etc.

Abstract

An RFID tag includes a dielectric member, an antenna pattern formed on and around a surface of the dielectric member, and an IC chip that is electrically connected to the antenna pattern by means of two chip pads.

Claims

1. An RFID tag comprising:

a dielectric member;

an antenna pattern formed on and around a surface of the dielectric member whereby the antenna pattern forms a loop; and

an IC chip with a built-in communication circuit and a built-in memory circuit, the IC chip being electrically connected to the antenna pattern.

2. The RFID tag according to claim 1, wherein the dielectric member includes a plurality of dielectric members having different dielectric constants and dielectric losses.

3. The RFID tag according to claim 1, wherein the dielectric member includes an airspace.

4. An RFID tag comprising:

a dielectric member;

a film substrate that includes an antenna pattern, the film substrate being tied on and around the dielectric member whereby the antenna pattern forms a loop; and

an IC chip with a built-in communication circuit and a built-in memory circuit, the IC chip being electrically connected to the antenna pattern.

5. The RFID tag according to claim 4, wherein the film substrate include a chip pad for electrically connecting the IC chip to the antenna pattern.

6. The RFID tag according to claim 4, wherein the dielectric member includes a chip pad for electrically connecting the IC chip to the antenna pattern.

7. The RFID tag according to claim 4, wherein the dielectric member includes a concavity for accommodating the IC chip.

8. The RFID tag according to claim 5, wherein the chip pad extends to a side surface of the dielectric member and the IC chip is mounted on the side surface.

9. The RFID tag according to claim 5, wherein the chip pads are provided along a length of the antenna pattern in such a way that a position of a feeding point of the IC chip can be adjusted.

10. The RFID tag according to claim 4, wherein the dielectric member includes a depressed portion for accommodating the film substrate.

11. The RFID tag according to claim 7, comprising a plurality of the film substrates, wherein the film substrates are laminated on the surface of the dielectric member, and antenna patterns of respective film substrates being electrically connected by means of a conductive member.

12. The RFID tag according to claim 10, wherein the depressed portion has a depth such that the IC chip does not jut out above a surface of the dielectric member in a portion other than the depressed portion.

13. The RFID tag according to claim 4, wherein the dielectric member includes a plurality of dielectric members having different dielectric constants and dielectric losses.

14. The RFID tag according to claim 4, wherein the dielectric member includes an airspace.

15. An RFID tag comprising:

a dielectric member;

a dielectric member support that slidably supports the dielectric member;

a film substrate that includes an antenna pattern, the film substrate being tied on and around the dielectric member whereby the antenna pattern forms a loop; and

an IC chip with a built-in communication circuit and a built-in memory circuit, the IC chip being electrically connected to the antenna pattern.

16. The RFID tag according to claim 15, further comprising a dielectric member securing member with which the dielectric member can be secured after a position of the dielectric member in the dielectric member support is adjusted.

17. The RFID tag according to claim 15, wherein the dielectric member support includes a concavity for accommodating the film substrate.

18. The RFID tag according to claim 15, wherein the dielectric member includes a plurality of dielectric members having different dielectric constants and dielectric losses.

19. The RFID tag according to claim 15, wherein the dielectric member includes an airspace.

20. An RFID tag manufacturing method comprising:

mounting a film substrate having a transceiving antenna pattern on a surface of a dielectric member and forming a loop antenna; and

electrically connecting an IC chip to the antenna pattern, the IC chip including at least a built-in communication circuit and a built-in memory circuit.

21. An RFID tag manufacturing method comprising:

forming a loop antenna on a surface of a dielectric member by means of a transceiving antenna pattern; and

electrically connecting an IC chip to the antenna pattern, the IC chip including a built-in communication circuit and a built-in memory circuit.

22. An RFID tag manufacturing method comprising:

electrically connecting an IC chip to a first transceiving antenna pattern of a first film substrate, wherein the IC chip includes a built-in communication circuit and a built-in memory circuit;

laminating a first surface of a dielectric member with the first film substrate such that the IC chip mounted on the first film substrate fits into a concavity provided on the dielectric member;

laminating a second surface of the dielectric member with a second film substrate having a second transceiving antenna pattern; and

electrically connecting the first transceiving antenna pattern of the first film substrate and the second transceiving antenna pattern of the second film substrate by means of a conductive member.