Anisotropically conductive connector and production process thereof, and probe member

• US 20060033100A1
• Filed: 08/17/2005
• Published: 02/16/2006
• Est. Priority Date: 02/09/2001
• Status: Active Grant

• Current Assignee: ISC Incorporated (Svenska Cellulosa AB)
• Original Assignee: JSR Corporation
• Inventors: Kokubo, Terukazu, Inoue, Kazuo, Naoi, Masaya, Seno, Koji
• Granted Patent: US 7,323,712 B2
• Time in Patent Office: Days
• US Class Current: 257/48
• CPC Class Codes: H01R 13/2414 conductive elastomers
• CPC Class Codes: H01R 43/007 for elastomeric connecting elements

Abstract

An anisotropically conductive connector, by which positioning, and holding and fixing to a wafer to be inspected can be conducted with ease even when the wafer has a large area, contains a frame plate having a plurality of anisotropically conductive film-arranging holes formed corresponding to regions of electrodes to be inspected of a wafer, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes and supported by the inner peripheral edge thereabout.

Claims

1. An anisotropically conductive connector suitable for conducting electrical inspection of each of a plurality of integrated circuits formed on a wafer in a state of the wafer, which comprises:

a frame plate in which a plurality of anisotropically conductive film-arranging holes each extending in a thickness-wise direction of the frame plate are formed corresponding to electrode regions, in which electrodes to be inspected of the integrated circuits in the wafer as an object for inspection have been formed, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes in this frame plate and each supported by the inner peripheral edge about the anisotropically conductive film-arranging hole, wherein

each of the elastic anisotropically conductive films is comprises a functional part comprising a plurality of conductive parts for connection each containing conductive particles exhibiting magnetism at high density and extending in the thickness-wise direction of the film and arranged correspondingly to the electrodes to be inspected of the integrated circuits in the wafer as an object for inspection, and insulating part insulating these conductive parts for connection mutually, and supported part integrally formed at a peripheral edge of the functional part and fixed to the inner peripheral edge about the anisotropically conductive film-arranging hole in this frame plate, and the supported part contains the conductive particles exhibiting magnetism.

2-24. -24. (canceled)