Transparent double-injection field-effect transistor

• US 20060033108A1
• Filed: 09/27/2005
• Published: 02/16/2006
• Est. Priority Date: 02/07/2003
• Status: Active Grant

• Current Assignee: Randy Hoffman
• Original Assignee: Randy Hoffman
• Inventors: Hoffman, Randy
• Granted Patent: US 7,132,319 B2
• Time in Patent Office: Days
• US Class Current: 257/66
• CPC Class Codes: H01L 29/66969 of devices having semiconductor bodies not comprising group 14 or group 13/15 materials comprising selenium or tellurium in uncombined form other than as impurities in semiconductor bodies of other materials, comprising cuprous oxide or cuprous iodide H01L21/02365
• CPC Class Codes: H01L 29/786 Thin film transistors, i.e. transistors with a channel being at least partly a thin film transistors having only the source or the drain region on an insulator layer H01L29/0653; thin film FinFETs H01L29/785
• CPC Class Codes: H01L 29/78645 with multiple gate
• CPC Class Codes: H01L 29/78648 arranged on opposing sides of the channel
• CPC Class Codes: H01L 29/78681 having a semiconductor body comprising AIIIBV or AIIBVI or AIVBVI semiconductor materials, or Se or Te
• CPC Class Codes: H01L 29/7869 having a semiconductor body comprising an oxide semiconductor material, e.g. zinc oxide, copper aluminium oxide, cadmium stannate
• CPC Class Codes: H01L 29/78696 characterised by the structure of the channel, e.g. multichannel, transverse or longitudinal shape, length or width, doping structure, or the overlap or alignment between the channel and the gate, the source or the drain, or the contacting structure of the channel H01L29/78612 takes precedence; transistors having a drain offset region or a lightly doped drain [LDD] H01L29/78621

Abstract

A double-injection field-effect transistor has an anode, a cathode, a substantially transparent channel, a substantially transparent gate insulator, and at least one substantially transparent gate electrode. The transistor may also have a substantially transparent anode and/or cathode. The transistor may also be formed on a substantially transparent substrate. Electrode contacts and electrical interconnection leads may also be substantially transparent. Methods for making and using such double-injection field-effect transistors are also disclosed.

Claims

1-50. -50. (canceled)

51. A field-effect transistor, comprising:

a) an anode;

b) a cathode spaced apart from the anode;

c) a substantially transparent channel adapted to selectively conduct carriers between the anode and the cathode;

d) at least one substantially transparent gate electrode adapted for controlling current in the channel; and

e) at least one substantially transparent gate insulator, only one of the anode and cathode being adapted to inject carriers into the channel.

52. An integrated circuit comprising the field-effect transistor of claim 51.

53. A substrate with microelectronics comprising the field-effect transistor of claim 51.

54. An electronic device comprising the field-effect transistor of claim 51.

55. A display comprising an array of pixel elements, each pixel element of the display comprising the field-effect transistor of claim 51.

56-57. -57. (canceled)

58. A method for fabricating a double-injection field-effect transistor, the method comprising the steps of:

a) providing a substrate;

b) depositing and patterning a first conductive layer to form an anode;

c) depositing and patterning a second conductive layer to form a cathode spaced apart from the anode;

d) forming a transparent channel extending at least between the anode and cathode;

e) depositing and optionally patterning at least one transparent insulating layer to form at least one gate insulator; and

f) depositing and patterning at least one transparent conductive layer to form at least one gate electrode overlapping at least a portion of the transparent channel and at least partially aligned with the at least one gate insulator.

59. The method of claim 58, wherein the steps are performed in the order recited.

60. The method of claim 58, wherein the step of depositing and patterning a first conductive layer to form an anode is performed by depositing and patterning a substantially transparent conductive layer.

61. The method of claim 58, wherein the step of depositing and patterning a second conductive layer to form a cathode is performed by depositing and patterning a substantially transparent conductive layer.

62. The method of claim 58, wherein the step of providing a substrate is performed by providing a substantially transparent substrate.

63. The method of claim 58, wherein the step of providing a substrate is performed by providing a substrate including a pixel element and the step of depositing and patterning a first transparent conductive layer to form anode and cathode conductors includes at least partially aligning the anode and cathode conductors with the pixel element.

64. A substantially transparent double-injection field-effect transistor, made by the method of claim 58.

65. An integrated circuit comprising the double-injection field-effect transistor of claim 64.

66. A substrate with microelectronics comprising the double-injection field-effect transistor of claim 64.

67. An electronic device comprising the double-injection field-effect transistor of claim 64.

68. A display comprising an array of pixel elements, each pixel element of the display comprising the substantially transparent double-injection field-effect transistor of claim 64.

69. A method of using a substantially transparent double-injection field-effect transistor in an array of pixel elements of a display, comprising forming an array of substantially transparent double-injection field-effect transistor by the method of claim 58.

70. A method of using a substantially transparent double-injection field-effect transistor, comprising the steps of:

a) forming an array of pixel elements for a display;

b) forming at least one substantially transparent double-injection field-effect transistor in at least partial alignment with and electrically coupled with each pixel element of the array; and

c) controlling each pixel element of the array with the at least one substantially transparent double-injection field-effect transistor corresponding to the pixel element.

71. The method of claim 70, wherein the step of forming at least one substantially transparent double-injection field-effect transistor is performed by the substeps of:

a) providing a substrate;

b) depositing and patterning a first conductive layer to form an anode;

c) depositing and patterning a second conductive layer to form a cathode spaced apart from the anode;

d) forming a transparent channel extending at least between the anode and cathode;

e) depositing and optionally patterning at least one transparent insulating layer to form at least one gate insulator; and

f) depositing and patterning at least one transparent conductive layer to form at least one gate electrode overlapping at least a portion of the transparent channel and at least partially aligned with the at least one gate insulator.