Integrated electroless deposition system

• US 20060033678A1
• Filed: 07/29/2005
• Published: 02/16/2006
• Est. Priority Date: 01/26/2004
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Weidman, Timothy W., Birang, Manoocher, Lubomirsky, Dmitry, Shanmugasundram, Arulkumar, Wang, Yaxin, Yang, Michael X., Sherman, Svetlana, Rabinovich, Eugene, Hansen, Bradley, D'Ambra, Allen
• Application Number:
  US11/192,993
• Publication Number:
  US 20060033678A1
• Time in Patent Office: Days
• US Class Current: 345/32
• CPC Class Codes: C23C 16/06 characterised by the deposition of metallic material
• CPC Class Codes: C23C 16/34 Nitrides C23C16/303 takes precedence
• CPC Class Codes: C23C 16/4488 by in situ generation of reactive gas by chemical or electrochemical reaction
• CPC Class Codes: C23C 18/1632 Features specific for the apparatus, e.g. layout of cells and of its equipment, multiple cells
• CPC Class Codes: C23C 18/1653 Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
• CPC Class Codes: H01L 21/28556 by chemical means, e.g. CVD, LPCVD, PECVD, laser CVD H01L21/28518 - H01L21/28537 and H01L21/28568 take precedence
• CPC Class Codes: H01L 21/288 from a liquid, e.g. electrolytic deposition
• CPC Class Codes: H01L 21/67167 surrounding a central transfer chamber
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/67207 comprising a chamber adapted to a particular process
• CPC Class Codes: H01L 21/6723 comprising at least one plating chamber electroless plating apparatuses C23C, electroplating apparatuses C25D
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67745 characterized by movements or sequence of movements of transfer devices
• CPC Class Codes: H01L 21/76843 formed in openings in a dielectric
• CPC Class Codes: H01L 21/76873 for electroplating
• CPC Class Codes: H01L 21/76877 Filling of holes, grooves or trenches, e.g. vias, with conductive material

Abstract

Embodiments of the invention provide a cluster tool configured to deposit a material onto a substrate surface by using one or more electroless, electrochemical plating, CVD and/or ALD processing chambers. In one aspect, a ruthenium-containing catalytic layer is formed. Embodiments of the invention provide a hybrid deposition system configured to deposit a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP cell. Other aspects provide an electroless deposition system configured to deposit a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides an electroless deposition system configured to form a capping layer over substrate interconnects. The system includes a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.

Claims

1. An electroless deposition cluster tool, comprising:

a mainframe;

at least one electroless plating cell in an environmentally controlled enclosure, wherein the at least one electroless plating cell is on the mainframe; and

at least one electroplating cell on the mainframe.

2. The cluster tool of claim 1, wherein the electroless plating cell comprises:

a first fluid processing chamber;

a second fluid processing chamber; and

a substrate transfer shuttle adapted to transfer substrates inside the processing enclosure between the first chamber and the second chamber.

3. The cluster tool of claim 1, further comprising:

at least one IBC chamber; and

at least one SRD chamber.

4. The cluster tool of claim 1, further comprising:

at least one brush box chamber; and

at least one vapor dryer chamber.

5. The cluster tool of claim 1, further comprising a plasma-enhanced dry etch chamber, comprising:

a temperature-controlled substrate support;

a temperature-controlled chamber body;

a lid assembly containing a first and second electrode, wherein plasma is struck between the first and second electrode and the second electrode is adapted to heat the substrate; and

a processing zone between the second electrode and the substrate support, wherein process gases flow from the lid assembly to the surface of the substrate.

19. The cluster tool of claim 1, wherein the electroless plating cell comprises:

a substrate support assembly having a substrate supporting surface, wherein the substrate support assembly is adapted to center and rotate a substrate, and;

a fluid dispense arm that is adapted to dispense multiple processing fluids onto a surface of a substrate on the substrate supporting surface, wherein the fluid dispense arm further comprises;

a plurality of fluid conduits configured to supply a fluid to a surface of a substrate, wherein the fluid is selected from a list consisting of an electroless deposition fluid, a rinsing fluid and a substrate bevel cleaning fluid; and

a fluid nozzle that is in fluid communication with one of the fluid conduits and is adapted to deliver a fluid to an edge of the substrate.

20. The electroless deposition system of claim 3, further comprising a plasma processing chamber adapted to form a reducing layer and/or a catalytic layer on a substrate, comprising:

one or more walls forming a processing region;

a temperature-controlled substrate support on one of the one or more walls, wherein the temperature-controlled substrate support is adapted to support the substrate during processing;

a gas supply adapted to provide appropriate process gases to the process region for forming a reducing layer and/or a catalytic layer on the substrate;

a gas distribution showerhead on the one of the one or more walls and is in fluid communication with the gas supply, wherein the gas distribution showerhead is adapted to distribute process gases uniformly into the process region; and

an RF power supply connect to the gas distribution showerhead so that the gas distribution showerhead can be adapted to control a plasma generated in the processing region.

21. The electroless deposition system of claim 20, further comprising a plasma-enhanced dry etch chamber, comprising:

a temperature-controlled chamber body having one or more walls that form a processing region;

a temperature-controlled substrate support in the processing region;

a lid assembly containing a first and second electrode, wherein plasma is struck between the first and second electrode and the second electrode is adapted to heat the substrate; and

a fluid source in fluid communication with the lid assembly, wherein the fluid source is adapted to deliver a process gases from the lid assembly to the surface of the substrate.

22. The electroless deposition system of claim 20, wherein the gas supply is further adapted to provide appropriate process gases to the processing region for forming a barrier layer on the substrate.

6. An electroless deposition cluster tool, comprising:

at least one electroless plating cell on a mainframe;

at least one electroplating cell on the mainframe;

at least one IBC chamber on the mainframe; and

at least one SRD chamber on the mainframe.

7. The cluster tool of claim 6, further comprising at least one plasma processing chamber.

8. The cluster tool of claim 6, further comprising at least one plasma-enhanced dry etch chamber.

9. An electroless deposition cluster tool, comprising:

at least one electroless plating cell in an environmentally controlled enclosure, wherein the at least one electroless plating cell is on a mainframe; and

at least one SRD chamber on the mainframe.

10. The cluster tool of claim 9, wherein the electroless plating cell comprises:

a first fluid processing chamber;

a second fluid processing chamber; and

a substrate transfer shuttle adapted to transfer substrates inside the processing enclosure between the first chamber and the second chamber.

11. The cluster tool of claim 9, further comprising at least one brush box chamber.

12. The cluster tool of claim 9, further comprising at least one IBC chamber.

13. The cluster tool of claim 12, wherein the IBC and SRD chambers are combined into a hybrid IBC/SRD chamber.

14. The cluster tool of claim 9, further comprising at least one plasma-enhanced dry etch chamber.

15. The cluster tool of claim 9, further comprising at least one supercritical clean chamber.

16. An electroless deposition cluster tool, comprising:

at least one electroless plating cell in an environmentally controlled enclosure, wherein the at least one electroless plating cell is on a mainframe;

at least one brush box chamber on the mainframe; and

at least one vapor dryer chamber on the mainframe.

17. The cluster tool of claim 16, wherein the electroless plating cell comprises:

a first fluid processing chamber;

a second fluid processing chamber; and

a substrate transfer shuttle adapted to transfer substrates inside the processing enclosure between the first chamber and the second chamber.

18. The cluster tool of claim 16, further comprising at least one plasma-enhanced dry etch chamber.

23. An electroless deposition cluster tool, comprising:

at least one plasma processing chamber that is on a mainframe and is adapted to form a reducing layer and/or a catalytic layer on a substrate, wherein the at least one plasma processing chamber comprises;

one or more walls forming a processing region;

a temperature-controlled substrate support on one of the one or more walls, wherein the temperature-controlled substrate support is adapted to support the substrate during processing;

a gas supply adapted to provide appropriate process gases to the process region for forming a reducing layer and/or a catalytic layer on the substrate;

a gas distribution showerhead on the one of the one or more walls and in fluid communication with the gas supply, wherein the gas distribution showerhead is adapted to distribute process gases uniformly into the process region; and

an RF power supply connect to the gas distribution showerhead so that the gas distribution showerhead can be adapted to control a plasma generated in the processing region; and

at least one fluid processing chamber on the mainframe, wherein the at least one fluid processing chamber comprises;

a substrate support assembly adapted to support and rotate the substrate;

one or more fluid dispense arms adapted to dispense multiple processing fluids onto a surface of a substrate on the substrate support assembly; and

a substrate processing platen assembly adapted to dispense a temperature controlled fluid to the backside of the substrate during processing.

24. The cluster tool of claim 23, wherein the gas supply is adapted to provide a process gas to the processing region, wherein the process gas is adapted to form a barrier layer on a surface of a substrate on the temperature-controlled substrate support.

25. The cluster tool of claim 23, wherein the gas supply is further adapted to provide appropriate process gases to the process region for forming a barrier layer on the substrate.

26. The cluster tool of claim 23, wherein the plasma processing chamber further comprises:

a ruthenium tetroxide generation system comprising;

a vessel that is adapted to retain an amount of ruthenium metal;

an oxidizing source that is adapted to deliver an ozone containing gas to the vessel to form a ruthenium tetroxide containing gas in the vessel; and

a source vessel assembly that is in fluid communication with the vessel and is adapted to collect the ruthenium tetroxide containing gas formed in the vessel, wherein the source vessel assembly comprises;

a source vessel; and

a heat exchanging device that is in thermal communication with the source vessel and is adapted to control the temperature of the source vessel; and

a processing chamber in fluid communication with the source vessel.

27. The cluster tool of claim 23, further comprising:

an IBC process chamber on the mainframe and having one or more fluid dispense arms are adapted to deliver a fluid to a surface of a substrate on a substrate support, wherein the IBC process chamber further comprises;

a plurality of fluid conduits configured to supply a fluid to a surface of a substrate, wherein the fluid is selected from a list consisting of an electroless deposition fluid, a rinsing fluid and a substrate bevel cleaning fluid; and

a fluid nozzle that is in fluid communication with one of the fluid conduits and is adapted to deliver a fluid to an edge of the substrate; and

a SRD chamber on the mainframe.

28. The cluster tool of claim 23, further comprising:

at least one processing chamber adapted to perform the IBC process on the substrate;

at least one brush box chamber; and

at least one vapor dryer chamber.

29. The cluster tool of claim 23, further comprising a plasma-enhanced dry etch chamber, comprising:

a temperature-controlled chamber body having one or more walls that form a processing region;

a temperature-controlled substrate support in the processing region;

a lid assembly containing a first and second electrode, wherein plasma is struck between the first and second electrode and the second electrode is adapted to heat the substrate; and

a fluid source in fluid communication with the lid assembly, wherein the fluid source is adapted to deliver a process gases from the lid assembly to the surface of the substrate.

30. The cluster tool of claim 23, further comprising at least one supercritical clean chamber on the mainframe.

31. An electroless cluster tool, comprising:

at least one plasma processing chamber on a mainframe that is adapted to form a reducing layer on a substrate, comprising;

one or more walls forming a processing region;

a temperature-controlled substrate support on one of the one or more walls, wherein the temperature-controlled substrate support is adapted to support the substrate during processing;

a gas supply adapted to provide a process gas to the process region to forming a reducing layer on a surface of a substrate on the temperature-controlled substrate support;

a gas distribution showerhead on one of the one or more walls and is in fluid communication with the gas supply, wherein the gas distribution showerhead is adapted to distribute process gases uniformly into the process region; and

an RF power supply connect to the gas distribution showerhead so that the gas distribution showerhead can be adapted to control a plasma generated in the processing region; and

at least one fluid processing chamber that is on the mainframe and is adapted to form a metal-containing catalytic and/or conductive layer on a surface of a substrate via an electroless plating process, comprising;

a substrate support assembly adapted to support and rotate the substrate;

one or more fluid dispense arms adapted to dispense multiple processing fluids onto a surface of the substrate on the substrate support assembly; and

a substrate processing platen assembly adapted to dispense a temperature controlled fluid to the backside of a substrate on the substrate support assembly.

32. The cluster tool of claim 31, further comprising at least one plasma processing chamber adapted to form a barrier layer on a substrate, comprising:

one or more walls forming a processing region;

a temperature-controlled substrate support on one of the one or more walls, wherein the temperature-controlled substrate support is adapted to support the substrate during processing;

a gas supply adapted to provide appropriate process gases to the process region for forming a barrier layer on the substrate;

a gas distribution showerhead on the one of the one or more walls and is in fluid communication with the gas supply, wherein the gas distribution showerhead is adapted to distribute process gases uniformly into the process region; and

an RF power supply connect to the gas distribution showerhead so that the gas distribution showerhead can be adapted to control a plasma generated in the processing region.

33. The cluster tool of claim 31, wherein the gas supply is further adapted to deliver a process gas that can form a barrier layer on a surface of a substrate.

34. The cluster tool of claim 31, further comprising:

at least one processing chamber adapted to perform the IBC process on the substrate; and

at least one SRD chamber.

35. The cluster tool of claim 31, further comprising:

at least one processing chamber adapted to perform the IBC process on the substrate;

at least one brush box chamber; and

at least one vapor dryer chamber.

36. The electroless deposition system of claim 31, further comprising a plasma-enhanced dry etch chamber, comprising:

a temperature-controlled chamber body having one or more walls that form a processing region;

a temperature-controlled substrate support in the processing region;

a lid assembly containing a first and second electrode, wherein plasma is struck between the first and second electrode and the second electrode is adapted to heat the substrate; and

a fluid source in fluid communication with the lid assembly, wherein the fluid source is adapted to deliver a process gas from the lid assembly to the surface of the substrate.

37. An electroless cluster tool, comprising:

at least one plasma processing chamber adapted to form a reducing and/or a barrier layer on a substrate, comprising;

one or more walls forming a processing region;

a temperature-controlled substrate support on one of the one or more walls, wherein the temperature-controlled substrate support is adapted to support the substrate during processing;

a gas supply adapted to provide appropriate process gases to the process region for forming a reducing layer and/or a barrier layer on the substrate;

a gas distribution showerhead on one of the one or more walls and is in fluid communication with the gas supply, wherein the gas distribution showerhead is adapted to distribute process gases uniformly into the process region; and

an RF power supply connect to the gas distribution showerhead so that the gas distribution showerhead can be adapted to control a plasma generated in the processing region;

a first fluid processing chamber, adapted to form a metal-containing catalytic and/or conductive layer on the substrate via an electroless plating process; and

a second fluid processing chamber, adapted to form a conductive layer on the substrate via an electroplating process.

38. The electroless deposition system of claim 37, further comprising a plasma-enhanced dry etch chamber, comprising:

a temperature-controlled chamber body having one or more walls that form a processing region;

a temperature-controlled substrate support in the processing region;

a lid assembly containing a first and second electrode, wherein plasma is struck between the first and second electrode and the second electrode is adapted to heat the substrate; and

a fluid source in fluid communication with the lid assembly, wherein the fluid source is adapted to deliver a process gas from the lid assembly to the surface of the substrate.

39. A substrate plating cluster tool, comprising:

a plasma chamber adapted to deposit a ruthenium-containing catalytic layer on a substrate, comprising;

a ruthenium tetroxide generation system comprising;

a vessel that is adapted to retain an amount of ruthenium metal;

an oxidizing source that is adapted to deliver an ozone containing gas to the vessel to form a ruthenium tetroxide-containing gas in the vessel; and

a source vessel assembly that is in fluid communication with the vessel and is adapted to collect the ruthenium tetroxide containing gas formed in the vessel, wherein the source vessel assembly comprises;

a source vessel; and

a heat exchanging device that is in thermal communication with the source vessel and is adapted to control the temperature of the source vessel; and

a processing chamber in fluid communication with the source vessel; and

a processing chamber adapted to form a conductive layer on the substrate.

40. The cluster tool of claim 39, wherein the processing chamber adapted to form a conductive layer is an electroless plating chamber.

41. The cluster tool of claim 40, further comprising a plasma processing chamber adapted to form a reducing layer and/or a barrier layer on the substrate, comprising:

one or more walls forming a processing region;

a temperature-controlled substrate support on one of the one or more walls, wherein the temperature-controlled substrate support is adapted to support the substrate during processing;

a gas supply adapted to provide appropriate process gases to the process region for forming a reducing layer and/or a barrier layer on a surface of a substrate on the temperature-controlled substrate support;

a gas distribution showerhead on the one of the one or more walls and is in fluid communication with the gas supply, wherein the gas distribution showerhead is adapted to distribute process gases uniformly into the process region; and

an RF power supply connect to the gas distribution showerhead so that the gas distribution showerhead can be adapted to control a plasma generated in the processing region.

42. The cluster tool of claim 39, wherein the processing chamber adapted to form a conductive layer is an electroplating chamber.

43. The cluster tool of claim 42, further comprising a plasma processing chamber adapted to form a reducing layer and/or a barrier layer on the substrate, comprising:

one or more walls forming a processing region;

a temperature-controlled substrate support on one of the one or more walls, wherein the temperature-controlled substrate support is adapted to support the substrate during processing;

a gas supply adapted to provide appropriate process gases to the process region for forming a reducing layer and/or a barrier layer on a surface of a substrate on the temperature-controlled substrate support;

a gas distribution showerhead on the one of the one or more walls and is in fluid communication with the gas supply, wherein the gas distribution showerhead is adapted to distribute process gases uniformly into the process region; and

an RF power supply connect to the gas distribution showerhead so that the gas distribution showerhead can be adapted to control a plasma generated in the processing region.