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Integrated cooling system for electronic devices

  • US 20060034052A1
  • Filed: 08/16/2004
  • Published: 02/16/2006
  • Est. Priority Date: 08/16/2004
  • Status: Active Grant
First Claim
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1. A method for producing an electronic assembly with an integrated cooling system comprising the steps of:

  • (a) fabricating a base defining an integrated cooling system; and

    (b) attaching at least one electrical component on the base, and in thermal communication with the integrated cooling system, whereby heat generated from the at least one electrical component is transferable to the integrated cooling system to be dissipated.

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