Integrated cooling system for electronic devices
First Claim
1. A method for producing an electronic assembly with an integrated cooling system comprising the steps of:
- (a) fabricating a base defining an integrated cooling system; and
(b) attaching at least one electrical component on the base, and in thermal communication with the integrated cooling system, whereby heat generated from the at least one electrical component is transferable to the integrated cooling system to be dissipated.
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Accused Products
Abstract
The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.
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Citations
34 Claims
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1. A method for producing an electronic assembly with an integrated cooling system comprising the steps of:
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(a) fabricating a base defining an integrated cooling system; and
(b) attaching at least one electrical component on the base, and in thermal communication with the integrated cooling system, whereby heat generated from the at least one electrical component is transferable to the integrated cooling system to be dissipated. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. An electronic assembly comprising:
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a base; and
at least one electrical component attached to the base, the base defining an integrated cooling system in thermal communication with the at least one electrical component for dissipating heat from the at least one electrical component. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34)
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24. The electronic assembly of claim 24, wherein the plurality of thermal vias is filled with at least one of:
- silver, gold, tungsten, molybdenum, and copper.
- View Dependent Claims (23)
Specification