Integrated audio codec with silicon audio transducer

• US 20060034472A1
• Filed: 08/11/2004
• Published: 02/16/2006
• Est. Priority Date: 08/11/2004
• Status: Active Grant

• Current Assignee: Qualcomm, Inc.
• Original Assignee: Qualcomm, Inc.
• Inventors: Oliveira, Louis D., Bazarjani, Seyfollah
• Granted Patent: US 7,929,714 B2
• Time in Patent Office: Days
• US Class Current: 381/111
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48137 the bodies being arranged next to each other, e.g. on a common substrate
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/10253 Silicon [Si]
• CPC Class Codes: H01L 2924/1461 MEMS
• CPC Class Codes: H04R 19/005 using semiconductor materials

Abstract

An integrated audio transducer with associated signal processing electronics is disclosed. A silicon audio transducer, such as a MEMS microphone or speaker, can be integrated with audio processing electronics in a single package. The audio processing electronics can be configured using control signals. The audio processing electronics can provide a single line serial data interface and a single line control interface. The audio transducers can be integrated with associated processing electronics. A silicon microphone can be integrated with an Analog to Digital Converter (ADC). The ADC output can be a single line serial interface. The ADC can be configured using a single line serial control interface. A speaker may be integrated with a Digital to Analog Converter (DAC). Audio transducers can also be integrated with more complex processing electronics. Audio processing parameters such as gain, dynamic range, and filter characteristics may be configured using the serial interface.

Claims

1. A transducer system comprising:

a transducer; and

a transducer electronics die configured to provide one or more functions and coupled to the transducer, the transducer electronics die implemented within the same package as the transducer.

2. The transducer system of claim 1, wherein the transducer comprises a semiconductor transducer implemented on a transducer die.

3. The transducer system of claim 2, wherein the transducer comprises a MEMS transducer on a silicon die separate from the transducer electronics die.

4. The transducer system of claim 1, further comprising an integrated circuit carrier having the transducer electronics die mounted thereon, and wherein the transducer comprises a semiconductor die mounted on the carrier.

5. The transducer system of claim 4, wherein at least one of the transducer electronics die and the semiconductor die is wire bonded to the carrier.

6. The transducer system of claim 4, wherein at least one of the transducer electronics die and the semiconductor die is flip chip bonded to the carrier.

7. The transducer system of claim 4, wherein the semiconductor die is stack mounted on the transducer electronics die.

8. The transducer system of claim 4, wherein the transducer electronics die is stack mounted on the semiconductor die.

9. The transducer system of claim 1, wherein the transducer electronics die comprises:

an amplifier configured to receive an audio signal from the transducer and amplify the signal; and

an Analog to Digital Converter (ADC) configured to convert an amplifier output signal to a digital representation of the signal.

10. The transducer system of claim 9, wherein the ADC is further configured to provide a one bit serial data output.

11. The transducer system of claim 9, further comprising a Digital Signal Processor (DSP) coupled to the output of the ADC and configured to process the ADC output data and provide a one bit serial data output.

12. The transducer system of claim 9, further comprising a control input configured to receive a control signal that selectively controls an amplifier gain.

13. The transducer system of claim 9, further comprising a control input configured to receive a control signal that selectively controls an ADC dynamic range.

14. A transducer system comprising:

an integrated circuit carrier;

a transducer die having at least one transducer and mounted to the carrier; and

a transducer electronics die coupled to the transducer and mounted to the carrier, the transducer electronics configured to provide a digital transducer interface.

15. The transducer system of claim 14, wherein the transducer comprises a microphone.

16. The transducer system of claim 14, wherein the transducer comprises a speaker.

17. The transducer system of claim 14, wherein the digital transducer interface comprises a one bit serial data interface.

18. The transducer system of claim 14, wherein the digital transducer interface comprises a one bit control interface configured to receive a serial control signal configured to selectively control an audio gain of the transducer electronics.

19. The transducer system of claim 14, wherein the transducer electronics comprises an Analog to Digital Converter (ADC) configured to convert a transducer output signal to a digital representation of the signal and wherein the digital transducer interface comprises a one bit control interface configured to receive a serial control signal configured to selectively control a dynamic range of the ADC.

20. The transducer system of claim 14, wherein the transducer electronics comprises an Digital to Analog Converter (DAC) configured to convert a digital signal to an analog signal coupled to the transducer and wherein the digital transducer interface comprises a one bit control interface configured to receive a serial control signal configured to selectively control a dynamic range of the DAC.

21. A transducer system comprising:

an integrated circuit carrier;

a transducer die having at least one transducer and mounted to the carrier; and

a transducer electronics die having transducer electronics coupled to at least one transducer and mounted to the carrier, the transducer electronics configured to provide a digital transducer interface comprising a one bit serial data interface, a one bit serial control interface, and a clock input.

22. The transducer system of claim 21, wherein the transducer die comprises a plurality of microphones having outputs coupled to the transducer electronics.

23. The transducer system of claim 21, wherein the transducer die comprises a plurality of speakers having inputs coupled to the transducer electronics.

24. A transducer system comprising:

an integrated circuit carrier;

a transducer die having at least one transducer and mounted to the carrier; and

a transducer electronics die comprising;

means for providing a one bit serial interface to the at least one transducer;

means for receiving a one bit control serial control signal; and

means for receiving a clock signal synchronized to the one bit control signal.

25. A method of manufacturing an integrated transducer system, the method comprising:

mounting a transducer die having at least one transducer to an integrated circuit carrier;

mounting a transducer electronics die to the carrier, the transducer electronics configured to provide a digital transducer interface; and

coupling an analog interface of the transducer electronics to the transducer.

26. The method of claim 25, wherein mounting the transducer die comprises wire bonding the transducer die to the carrier.

27. The method of claim 25, wherein mounting the transducer die comprises stack mounting the transducer die on the transducer electronics die.

28. The method of claim 25, wherein mounting the transducer die comprises flip chip mounting the transducer die to the carrier.