Manufacturing method of array substrate and manufacturing method of liquid crystal display device using the same

• US 20060035391A1
• Filed: 02/10/2005
• Published: 02/16/2006
• Est. Priority Date: 08/13/2004
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Fujitsu Display Technologies Corporation (Fujitsu Limited)
• Inventors: Sugine, Mitsuaki
• Granted Patent: US 7,767,476 B2
• Time in Patent Office: Days
• US Class Current: 438/7
• CPC Class Codes: G02F 1/133553 Reflecting elements associated to illuminating devices G02F1/133605
• CPC Class Codes: G02F 1/136259 Repairing; Defects
• CPC Class Codes: H01L 22/24 Optical enhancement of defects or not directly visible states, e.g. selective electrolytic deposition, bubbles in liquids, light emission, colour change voltage contrast G01R31/311
• CPC Class Codes: H01L 27/14692 Thin film technologies, e.g. amorphous, poly, micro- or nanocrystalline silicon

Abstract

The invention relates to a manufacturing method of an array substrate used for a reflective or transflective liquid crystal display device and a manufacturing method of a liquid crystal display device using the same, and has an object to provide the manufacturing method of the array substrate in which the manufacturing cost can be reduced and excellent display quality can be obtained, and the manufacturing method of the liquid crystal display device using the same. In the manufacturing method of the array substrate, an under layer having a surface with irregular irregularities is formed on a substrate, a metal film with irregularities profiling the surface of the under layer is formed on the under layer, a colored resist layer is formed on the metal film, the colored resist layer is patterned to form a regularly arranged colored resist pattern, an optical inspection is performed to optically detect a defect of the colored resist pattern, a defect of the colored resist pattern detected by the optical inspection is repaired; and the metal film is etched while using the resist pattern as a mask.

Claims

1. A manufacturing method of an array substrate, comprising the steps of:

forming on a substrate an under layer having a surface with irregular irregularities;

forming on the under layer a thin film with irregularities profiling the surface of the under layer;

forming a resist layer on the thin film;

forming a regularly arranged resist pattern by patterning the resist layer;

performing an optical inspection to optically detect a defect of the resist pattern; and

etching the thin film while using the resist pattern as a mask.

2. A manufacturing method of an array substrate according to claim 1, wherein the resist pattern is formed so that the irregularities of the thin film are not recognized in the optical inspection.

3. A manufacturing method of an array substrate according to claim 2, wherein the resist pattern is a colored resist pattern.

4. A manufacturing method of an array substrate according to claim 2, wherein the resist pattern is a thick film resist pattern with a thick film.

5. A manufacturing method of an array substrate according to claim 4, wherein a thickness of the thick film resist pattern is from 3.0 μ

m to 4.0 μ

m.

6. A manufacturing method of an array substrate according to claim 1, further comprising the step of repairing a defect of the resist pattern detected by the optical inspection before the thin film is etched.

7. A manufacturing method of an array substrate according to claim 1, further comprising the steps of peeling off the resist pattern in which the defect is detected by the optical inspection and forming a resist layer again on the thin film before the thin film is etched.

8. A manufacturing method of a liquid crystal display device in which a pair of substrates are fabricated, the substrates are attached, and liquid crystal is sealed between the substrates,

wherein at least one of the substrates is fabricated by using a manufacturing method of an array substrate according to claim 1.