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Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages

  • US 20060035415A1
  • Filed: 08/16/2004
  • Published: 02/16/2006
  • Est. Priority Date: 08/16/2004
  • Status: Active Grant
First Claim
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1. A method for packaging a semiconductor die, comprising:

  • providing a frame structure including a plurality of frames, each frame of the plurality including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having at least an inverted step extending peripherally thereabout and at least one upper step extending peripherally thereabout;

    securing a semiconductor die in the aperture of at least one frame of the plurality of frames with an active surface of the semiconductor die substantially abutting a surface of the at least an inverted step and a substantial portion of lateral sides thereof received within the aperture; and

    securing a window in the aperture of the at least one frame with a surface of the window substantially abutting a surface of the at least one upper step.

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