Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages

• US 20060035415A1
• Filed: 08/16/2004
• Published: 02/16/2006
• Est. Priority Date: 08/16/2004
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Farnworth, Warren M., Kirby, Kyle K., Wood, Alan G., Akram, Salman
• Granted Patent: US 7,645,635 B2
• Time in Patent Office: Days
• US Class Current: 438/125
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A semiconductor package such as an image sensor package, and methods for fabrication. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. Singulated image sensor dice and other components may be picked and placed into each frame of the frame structure. Alternatively, the frame structure may be configured to be aligned with and joined to a wafer bearing a plurality of image sensor dice, wherein optional, downwardly protruding skirts along peripheries of the frames may be received into kerfs cut along streets between die locations on the wafer, followed by installation of other package components. In either instance, the frame structure in combination with singulated image sensor dice or a joined wafer is singulated into individual image sensor packages. Various external connection approaches may be used for the packages.

Claims

1. A method for packaging a semiconductor die, comprising:

providing a frame structure including a plurality of frames, each frame of the plurality including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having at least an inverted step extending peripherally thereabout and at least one upper step extending peripherally thereabout;

securing a semiconductor die in the aperture of at least one frame of the plurality of frames with an active surface of the semiconductor die substantially abutting a surface of the at least an inverted step and a substantial portion of lateral sides thereof received within the aperture; and

securing a window in the aperture of the at least one frame with a surface of the window substantially abutting a surface of the at least one upper step.

2. The method of claim 1, further comprising:

cutting the frame structure between adjacent frames to singulate the at least one frame with the semiconductor die and the window secured therein and provide a skirt at a lower extent of the singulated at least one frame extending at least partially over a lateral side of the semiconductor die to form a semiconductor die package.

3. The method of claim 2, further comprising providing a plurality of conductors in association with each of the plurality of frames, the plurality of conductors including an inner end exposed for connection to a bond pad of a semiconductor die and an outer end located for exposure and communication with an external connector at least after the cutting of the frame structure.

4. The method of claim 3, further comprising operably coupling bond pads of the semiconductor die secured in the aperture of the at least one frame to inner ends of the plurality of conductors thereof.

5. The method of claim 4, further comprising operably coupling the outer ends of the plurality of conductors to at least one external connection structure.

6. The method of claim 5, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises at least one of disposing or forming conductive bumps thereon, disposing or forming conductive lands thereon, and disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements.

7. The method of claim 6, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements and further comprises wrapping a portion of the dielectric film upwardly against at least one side of the frame to effect contact between the outer ends of the plurality of conductors and the conductive elements.

8. The method of claim 3, further including exposing the outer ends of the plurality of conductors by cutting the frame structure.

9. The method of claim 8, further comprising operably coupling the exposed outer ends of the plurality of conductors to at least one external connection structure.

10. The method of claim 9, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises at least one of disposing or forming conductive lands thereon, and disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements.

11. The method of claim 10, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements and further comprises wrapping a portion of the dielectric film upwardly against at least one side of the frame to effect contact between the outer ends of the plurality of conductors and the conductive elements.

12. The method of claim 1, further comprising:

fabricating a plurality of semiconductor dice on a wafer, testing the plurality of semiconductor dice to selectively characterize at least some of the plurality of dice as known good dice;

wherein securing the semiconductor die the aperture of at least one frame of the plurality of frames comprises securing a known good die therein.

13. The method of claim 1, wherein securing the semiconductor die in the aperture of the at least one frame comprises adhesively securing the surface of the semiconductor die to the at least an inverted step.

14. The method of claim 1, further comprising forming the window in a size and configuration to fit within the aperture of the at least one frame.

15. The method of claim 1, wherein securing the window in the aperture of the at least one frame comprises adhesively securing the window to the at least one upper step.

16. The method of claim 1, further comprising substantially encapsulating a back side of the semiconductor die disposed in the aperture of the at least one frame with a dielectric material.

17. The method of claim 1, further including providing peripheral bond pads on the surface of the semiconductor die and operably coupling the bond pads to inner ends of conductors carried by the at least one frame of the plurality of frames.

18. The method of claim 17, wherein operably coupling comprises one of wire bonding and direct chip attach.

19. The method of claim 1, wherein securing the semiconductor die comprises securing a semiconductor die comprising an optically active region on the surface thereof.

20. The method of claim 19, wherein securing the semiconductor die comprising the optically active region on the surface thereof comprises securing one of a CMOS imager and a CCD imager.

21. The method of claim 19, wherein securing the semiconductor die comprising the optically active region on the surface thereof comprises securing one of a die configured for sensing radiation and a die configured for emitting radiation.

22. The method of claim 1, further comprising fabricating the frame structure from a polymer by injection molding.

23. The method of claim 1, further comprising fabricating the frame structure by placing a plurality of conductors into a mold defining the plurality of frames and the apertures thereof with inner ends thereof adjacent locations of the apertures and outer ends thereof located proximate outer peripheries of the plurality of frames, injecting polymeric molding material into the mold, curing the polymeric material, and removing the frame structure from the mold.

24. The method of claim 1, further including fabricating the frame structure of one of a liquid crystal polymer and a rod type polymer.

25. The method of claim 1, further including fabricating the frame structure of a semiconductor material and forming the apertures by at least one of etching and laser ablation.

26. The method of claim 1, further comprising covering at least a portion of the frame structure or the semiconductor die with an oxide or nitride film.

27. The method of claim 1, further comprising stereolithographically fabricating the frame structure from a photopolymer.

28. The method of claim 1, further comprising fabricating the frame structure from metal or an alloy by at least one of stamping, pressing, casting and machining.

29. The method of claim 1, further comprising forming the semiconductor die with conductive vias extending from the active surface to a back side thereof;

and operably coupling the conductive vias to an external connection structure.

30. The method of claim 29, wherein operably coupling the conductive vias to an external connection structure comprises at least one of disposing or forming conductive bumps thereon, disposing or forming conductive lands thereon, and disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the conductive vias with the conductive elements.

31. The method of claim 1, wherein the frames of the plurality are each configured to retain a lens therein and further comprising securing a lens in the aperture.

32. The method of claim 31, wherein the lens includes a Helimorph actuator for focusing.

33. The method of claim 31, wherein the lens comprises a microfluidic lens of two immiscible liquids in a hydrophobic tube and is configured for adjustment of focal length responsive to selective application of a voltage.

34. The method of claim 2, further including disposing the semiconductor die package in one of a digital camera, camera (cell) phone, PDA, home security system, endocope, optical storage apparatus and scientific testing apparatus.

35. The method of claim 1, further comprising forming the plurality of frames of the frame structure to include at least the at least an inverted step and the at least one upper step.

36. The method of claim 35, further comprising forming the plurality of frames of the frame structure to include at least another upper step.

37. The method of claim 1, wherein the at least one upper step comprises at least another upper step and further comprising securing an optical component to the at least another upper step.

38. The method of claim 37, further comprising selecting the optical component from the group consisting of a lens, a filter and a pre-lens.

76. The method of claim 32, further comprising forming the plurality of semiconductor dice with conductive vias extending from the active surface to a back side thereof;

and operably coupling the conductive vias to an external connection structure.

77. The method of claim 76, wherein operably coupling the conductive vias to an external connection structure comprises at least one of disposing or forming conductive bumps thereon, disposing or forming conductive lands thereon, and disposing a dielectric film having conductive elements thereon over the back sides of the plurality of semiconductor dice and contacting the conductive vias with the conductive elements.

117. The method of claim 116, further comprising disposing or forming conductive bumps on outer ends of the conductors carried by the at least one frame exposed on the lower surface of the frame structure.

39. A method for packaging a semiconductor die, comprising:

providing a wafer bearing a plurality of semiconductor dice thereon, wherein semiconductor dice of the plurality are separated by kerfs extending downwardly into the wafer from an surface thereof along streets between the semiconductor dice of the plurality;

providing a frame structure including a plurality of frames, each frame of the plurality including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having at least an inverted step extending peripherally thereabout and at least one upper step extending peripherally thereabout, the lower surface of the frame structure further including protrusions sized and configured to be received in the kerfs;

aligning the lower surface of the frame structure with the surface of the wafer and inserting the protrusions into the kerfs until the surface of the wafer substantially abuts the inverted lower steps of the plurality of frames and the protrusions extend over lateral sides of the plurality of semiconductor dice defined by the kerfs and securing the plurality of semiconductor dice to the plurality of frames; and

securing windows in at least some of the apertures with surfaces of the windows substantially abutting surfaces of the at least one upper step.

40. The method of claim 39, further comprising:

cutting the frame structure between adjacent frames along centers of the kerfs and through a remaining thickness of the wafer to singulate the frames of the plurality with a semiconductor die secured therein and provide a skirt at a lower extent of the singulated frames of the plurality extending at least partially over a lateral side of the semiconductor die to form a semiconductor die package.

41. The method of claim 40, further comprising providing a plurality of conductors in association with each of the plurality of frames, the plurality of conductors including an inner end exposed for connection to a bond pad of a semiconductor die and an outer end located for exposure and communication with an external connector at least after the cutting of the frame structure.

42. The method of claim 41, further comprising operably coupling bond pads of the plurality of semiconductor dice secured in the plurality of frames to inner ends of the plurality of conductors thereof.

43. The method of claim 42, further comprising operably coupling the outer ends of the plurality of conductors to at least one external connection structure.

44. The method of claim 43, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises at least one of disposing or forming conductive bumps thereon, disposing or forming conductive lands thereon, and disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements.

45. The method of claim 44, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements and further comprises wrapping a portion of the dielectric film upwardly against at least one side of the frame to effect contact between the outer ends of the plurality of conductors and the conductive elements.

46. The method of claim 41, further including exposing the outer ends of the plurality of conductors by cutting the frame structure.

47. The method of claim 46, further comprising operably coupling the exposed outer ends of the plurality of conductors to at least one external connection structure.

48. The method of claim 47, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises at least one of disposing or forming conductive lands thereon, and disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements.

49. The method of claim 48, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements and further comprises wrapping a portion of the dielectric film upwardly against at least one side of the frame to effect contact between the outer ends of the plurality of conductors and the conductive elements.

50. The method of claim 39, further comprising:

fabricating the plurality of semiconductor dice on the wafer, testing the plurality of semiconductor dice to selectively characterize at least some of the plurality of dice as known good dice.

51. The method of claim 39, wherein securing the plurality of semiconductor dice to the plurality of frames comprises adhesively securing surfaces thereof to the at least an inverted step.

52. The method of claim 39, further comprising forming the windows in a size and configuration to fit within the apertures.

53. The method of claim 39, wherein securing the windows in the at least some of the apertures comprises adhesively securing the windows to the at least one upper step.

54. The method of claim 39, further comprising substantially encapsulating a back side of the wafer with a dielectric material.

55. The method of claim 39, further including providing peripheral bond pads on surfaces of the plurality of semiconductor dice and operably coupling the bond pads to inner ends of conductors carried by the frame structure.

56. The method of claim 55, wherein operably coupling comprises one of wire bonding and direct chip attach.

57. The method of claim 39, wherein securing the plurality of semiconductor dice comprises securing semiconductor dice each comprising an optically active region on a surface thereof.

58. The method of claim 57, wherein securing the semiconductor dice comprising the optically active region on the surface thereof comprises securing one of CMOS imagers and CCD imagers.

59. The method of claim 57, wherein securing the semiconductor dice comprising the optically active region on the surface thereof comprises securing one of a die configured for sensing radiation and a die configured for emitting radiation.

60. The method of claim 39, further comprising fabricating the frame structure from a polymer by injection molding.

61. The method of claim 60, further comprising fabricating the frame structure by placing a plurality of conductors into a mold defining the plurality of frames and the apertures thereof with inner ends thereof adjacent locations of the apertures and outer ends thereof located proximate outer peripheries of the plurality of frames, injecting polymeric molding material into the mold, curing the polymeric material, and removing the frame structure from the mold.

62. The method of claim 39, further including fabricating the frame structure of one of a liquid crystal polymer and a rod type polymer.

63. The method of claim 39, further including fabricating the frame structure of a semiconductor material and forming the apertures by at least one of etching and laser ablation.

64. A packaging method of claim 63, further comprising covering at least a portion of the frame structure with an oxide film.

65. The method of claim 39, further comprising stereolithographically fabricating the frame structure from a photopolymer.

66. The method of claim 39, further comprising fabricating the frame structure from metal or an alloy by at least one of stamping, pressing, casting and machining.

67. The method of claim 39, wherein the frames of the plurality are each configured to retain a lens therein and further comprising securing a lens in at least some of the apertures.

68. The method of claim 67, wherein the lens includes a Helimorph actuator for focusing.

69. The method of claim 67, wherein the lens comprises a microfluidic lens of two immiscible liquids in a hydrophobic tube and is configured for adjustment of focal length responsive to selective application of a voltage.

70. The method of claim 40, further including disposing the semiconductor die package in one of a digital camera, camera (cell) phone, PDA, home security system, endocope, optical storage apparatus and scientific testing apparatus.

71. The method of claim 39, further comprising forming each of the plurality of frames of the frame structure to include the at least an inverted step and the at least one upper step.

72. The method of claim 71, further comprising forming each of the plurality of frames of the frame structure to include at least another upper step.

73. The method of claim 39, wherein the at least one upper step comprises at least another upper step and further comprising securing an optical component to the at least another upper step.

74. The method of claim 73, further comprising selecting the optical component from the group consisting of a lens, a filter and a pre-lens.

75. The method of claim 39, wherein at least one of the plurality of semiconductor dice and the windows are attached to the plurality of frames by one of anodic bonding and fusion bonding.

78. An image sensor package, comprising:

a rectangular frame having upper and lower surfaces and substantially planar outer side surfaces;

an aperture extending from the upper surface to the lower surface and having a lower inverted step and at least an upper step surrounding the aperture;

a semiconductor die having an active surface including an optically active region and bond pads disposed peripherally with respect thereto, a back side and lateral sides, the semiconductor die substantially disposed in the aperture with the active surface joined to the lower inverted step, the lateral sides substantially covered by a skirt portion of the frame; and

an optically transmissive window disposed in the aperture and secured to the at least an upper step.

79. The image sensor package of claim 78, further comprising a plurality of conductors having inner ends exposed in the aperture and outer ends exposed on an outer surface of the frame, wherein the bond pads are operably coupled to the inner ends.

80. The image sensor package of claim 79, further comprising at least one external connection structure operably coupled to the outer ends of conductors of the plurality.

81. The image sensor package of claim 80, wherein the at least one external connection structure comprises at least one of conductive bumps, conductive pads and a flex circuit bearing conductive elements in contact with the outer ends of conductors of the plurality.

82. The image sensor package of claim 78, further comprising a dielectric encapsulant covering the back side of the semiconductor die.

83. The image sensor package of claim 78, further comprising a lens fixed in an uppermost portion of the aperture.

84. The image sensor package of claim 83, wherein the lens includes a Helimorph actuator for focusing.

85. The image sensor package of claim 83, wherein the lens comprises a microfluidic lens of two immiscible liquids in a hydrophobic tube configured to change focal length responsive to a voltage variation.

86. The image sensor package of claim 83, further comprising a circuit in the semiconductor die for enabling focusing of the lens.

87. The image sensor package of claim 78, wherein at least a portion of a surface of the semiconductor die is covered with a mask material comprising one of an oxide and a nitride.

88. The image sensor package of claim 78, further comprising at least another upper step.

89. The image sensor package of claim 88, further comprising an optical component secured to the at least another upper step.

90. The image sensor package of claim 89, wherein the optical component comprises one of a lens, a pre-lens and a filter.

91. The image sensor package of claim 78, wherein the rectangular frame is formed of at least one of a polymer, a semiconductor material, a ceramic, a metal and an alloy.

92. The image sensor package of claim 78, wherein the semiconductor die is completely received in the aperture and recessed therein.

93. The image sensor package of claim 92, further including a dielectric layer extending over the back side of the semiconductor die and having an outer surface substantially flush with the lower surface of the frame.

94. The image sensor package of claim 78, wherein the semiconductor die is substantially completely received in the aperture and the back side thereof is substantially flush with the lower surface of the frame.

95. The image sensor package of claim 94, further including a dielectric layer extending over the lower surface of the frame and the back side of the semiconductor die.

96. The image sensor package of claim 78, wherein a lower portion of the semiconductor die protrudes below the lower surface of the frame.

97. The image sensor package of claim 96, further including a dielectric layer substantially encapsulating the lower portion of the semiconductor die and contiguous with the lower surface of the frame.

98. The image sensor package of claim 78, wherein the semiconductor die includes a plurality of conductive vias extending from the active surface to the back side thereof, and further including at least one external connection structure operably coupled to conductive vias of the plurality.

99. The image sensor package of claim 97, wherein the at least one external connection structure includes at least one of conductive bumps, conductive lands and a dielectric film carrying conductive elements thereon.

100. A method for packaging a semiconductor die, comprising:

providing a frame structure including a plurality of frames, each frame of the plurality including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having a first step extending peripherally thereabout and at least another, higher step extending peripherally thereabout and peripherally about the first step;

securing a semiconductor die in the aperture of at least one frame of the plurality of frames with a back side of the semiconductor die substantially abutting a surface of a first step and lateral sides thereof received within the aperture; and

securing a window in the aperture of the at least one frame with a surface of the window substantially abutting a surface of the at least another, higher step.

101. The method of claim 100, further comprising:

cutting the frame structure between adjacent frames to singulate the at least one frame with the semiconductor die and the window secured therein and provide a skirt at a lower extent of the singulated at least one frame extending at least partially over a lateral side of the semiconductor die to form a semiconductor die package.

102. The method of claim 101, further comprising providing a plurality of conductors in association with each of the plurality of frames, the plurality of conductors including an inner end exposed for connection to a semiconductor die and an outer end located for exposure and communication with an external connector at least after the cutting of the frame structure.

103. The method of claim 102, further comprising operably coupling the semiconductor die secured in the aperture of the at least one frame to inner ends of the plurality of conductors thereof.

104. The method of claim 103, further comprising operably coupling the outer ends of the plurality of conductors to at least one external connection structure.

105. The method of claim 104, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises at least one of disposing or forming conductive bumps thereon, disposing or forming conductive lands thereon, and disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements.

106. The method of claim 105, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements and further comprises wrapping a portion of the dielectric film upwardly against at least one side of the frame to effect contact between the outer ends of the plurality of conductors and the conductive elements.

107. The method of claim 102, further including exposing the outer ends of the plurality of conductors by cutting the frame structure.

108. The method of claim 107, further comprising operably coupling the outer ends of the plurality of conductors to at least one external connection structure.

109. The method of claim 108, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises at least one of disposing or forming conductive lands thereon, and disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements.

110. The method of claim 109, wherein operably coupling the outer ends of the plurality of conductors to at least one external connection structure comprises disposing a dielectric film having conductive elements thereon over the back side of the semiconductor die and contacting the outer ends of the plurality of conductors with the conductive elements and further comprises wrapping a portion of the dielectric film upwardly against at least one side of the frame to effect contact between the outer ends of the plurality of conductors and the conductive elements.

111. The method of claim 100, further comprising:

fabricating a plurality of semiconductor dice on a wafer, testing the plurality of semiconductor dice to selectively characterize at least some of the plurality of dice as known good dice; and

wherein securing the semiconductor die the aperture of at least one frame of the plurality of frames comprises securing a known good die therein.

112. The method of claim 100, wherein securing the semiconductor die in the aperture of the at least one frame comprises adhesively securing the back side of the semiconductor die to the first step.

113. The method of claim 100, further comprising forming the window in a size and configuration to fit within the aperture of the at least one frame.

114. The method of claim 100, wherein securing the window in the aperture of the at least one frame comprises adhesively securing the window to the at least another, higher step.

115. The method of claim 100, further comprising substantially encapsulating a back side of the semiconductor die disposed in the aperture of the at least one frame with a dielectric material.

116. The method of claim 100, further including providing conductive vias extending from an active surface to the back side of the semiconductor die and operably coupling interconnects to inner ends of conductors carried by the at least one frame of the plurality of frames.

118. The method of claim 100, further including providing conductive vias extending from an active surface to the back side of the semiconductor die within a periphery of the first step.

119. The method of claim 118, further comprising disposing or forming conductive bumps on the back side of the semiconductor die operably coupled to ends of the conductive vias.

120. The method of claim 100, wherein securing the semiconductor die comprises securing a semiconductor die comprising an optically active region on the surface thereof

121. The method of claim 120, wherein securing the semiconductor die comprising the optically active region on the surface thereof comprises securing one of a CMOS imager and a CCD imager.

122. The method of claim 120, wherein securing the semiconductor die comprising the optically active region on the surface thereof comprises securing one of a die configured for sensing radiation and a die configured for emitting radiation.

123. The method of claim 100, further comprising fabricating the frame structure from a polymer by injection molding.

124. The method of claim 123, further comprising fabricating the frame structure by placing a plurality of conductors into a mold defining the plurality of frames and the apertures thereof with inner ends thereof adjacent locations of the apertures and outer ends thereof located proximate outer peripheries of the plurality of frames, injecting polymeric molding material into the mold, curing the polymeric material, and removing the frame structure from the mold.

125. The method of claim 100, further including fabricating the frame structure of one of a liquid crystal polymer and a rod type polymer.

126. The method of claim 100, further including fabricating the frame structure of a semiconductor material and forming the apertures by at least one of etching and laser ablation.

127. The method of claim 126, further comprising covering at least a portion of the frame structure or the semiconductor die with an oxide or nitride film.

128. The method of claim 100, further comprising stereolithographically fabricating the frame structure from a photopolymer.

129. The method of claim 100, further comprising fabricating the frame structure from metal or an alloy by at least one of stamping, pressing, casting and machining.

130. The method of claim 100, wherein the frames of the plurality are each configured to retain a lens therein and further comprising securing a lens in the aperture.

131. The method of claim 130, wherein the lens includes a Helimorph actuator for focusing.

133. The method of claim 101, further including disposing the semiconductor die package in one of a digital camera, camera (cell) phone, PDA, home security system, endocope, optical storage apparatus and scientific testing apparatus.

134. The method of claim 100, further comprising forming the plurality of frames of the frame structure to include at least the first step and the at least another, higher step.

140. The image sensor package of claim 113, further comprising at least one external connection structure operably coupled to conductors of the plurality.

141. The image sensor package of claim 140, wherein the at least one external connection structure comprises at least one of conductive bumps, conductive pads and a flex circuit bearing conductive elements in contact with the conductors of the plurality.

132. The method of claim 1130, wherein the lens comprises a microfluidic lens of two immiscible liquids in a hydrophobic tube and is configured for adjustment of focal length responsive to selective application of a voltage.

135. The method of claim 135, further comprising forming the plurality of frames of the frame structure to include at least a further, higher step below the another, higher step and encompassed peripherally thereby.

136. The method of claim 135, further comprising securing an optical component to the at least a further, higher step.

137. The method of claim 136, further comprising selecting the optical component from the group consisting of a lens, a filter and a pre-lens.

138. An image sensor package, comprising:

a rectangular frame having upper and lower surfaces and substantially planar outer side surfaces;

an aperture extending from the upper surface to the lower surface and having at least a first step and at least another, higher step surrounding the aperture;

a semiconductor die having an surface including an optically active region, a back side and lateral sides, the semiconductor die substantially disposed in the aperture with the back side joined to the at least a first step, the lateral sides substantially covered by a skirt portion of the frame; and

an optically transmissive window disposed in the aperture and secured to the at least another, higher step.

139. The image sensor package of claim 138, further comprising a plurality of conductors extending through the frame and operably coupled to the semiconductor die.

142. The image sensor package of claim 138, further comprising a lens fixed in an uppermost portion of the aperture.

143. The image sensor package of claim 142, wherein the lens includes a Helimorph actuator for focusing.

144. The image sensor package of claim 142, wherein the lens comprises a microfluidic lens of two immiscible liquids in a hydrophobic tube configured to change focal length responsive to a voltage variation.

145. The image sensor package of claim 142, further comprising a circuit in the semiconductor die for enabling focusing of the lens.

146. The image sensor package of claim 138, wherein at least a portion of the semiconductor die in contact with the frame is covered with a mask material comprising one of an oxide and a nitride.

147. The image sensor package of claim 138, further comprising at least a further, higher step below the at least another, higher step.

148. The image sensor package of claim 147, further comprising an optical component secured to the at least a further, higher step.

149. The image sensor package of claim 148, wherein the optical component comprises one of a lens, a pre-lens and a filter.

150. The image sensor package of claim 138, wherein the rectangular frame is formed of at least one of a polymer, a semiconductor material, a ceramic, a metal and an alloy.

151. The image sensor package of claim 138, wherein the semiconductor die includes a plurality of conductive vias extending from the active surface to the back side thereof.

152. The image sensor package of claim 151, wherein conductive vias of the plurality are operably coupled to conductors carried by the frame and extending to an exterior surface thereof.

153. The image sensor package of claim 151, wherein the plurality of conductive vias lies within a periphery of the at least a first step, and further including at least one external connection structure operably coupled thereto.

154. The image sensor package of claim 153, wherein the at least one external connection structure comprises at least one of conductive bumps, conductive lands and a flex circuit bearing conductive elements thereon.

155. A method for packaging a semiconductor die, comprising:

providing a frame structure including a plurality of frames, each frame of the plurality including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having at least an inverted step extending peripherally thereabout;

securing a semiconductor die in the aperture of at least one frame of the plurality of frames with an active surface of the semiconductor die substantially abutting a surface of the at least an inverted step and a substantial portion of lateral sides thereof received within the aperture; and

securing a window substrate over the upper surface of the frame structure and over the apertures of the plurality of frames.

156. The method of claim 155, further comprising:

cutting the frame structure between adjacent frames to singulate the at least one frame with the semiconductor die secured therein and a window secured thereover to form a semiconductor die package.

157. A method for packaging a semiconductor die, comprising:

providing a wafer bearing a plurality of semiconductor dice thereon, wherein semiconductor dice of the plurality are separated by kerfs extending downwardly into the wafer from an surface thereof along streets between the semiconductor dice of the plurality;

providing a frame structure including a plurality of frames, each frame of the plurality including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having at least an inverted step extending peripherally thereabout, the lower surface of the frame structure further including protrusions sized and configured to be received in the kerfs;

aligning the lower surface of the frame structure with the surface of the wafer and inserting the protrusions into the kerfs until the surface of the wafer substantially abuts the inverted lower steps of the plurality of frames and the protrusions extend over lateral sides of the plurality of semiconductor dice defined by the kerfs and securing the plurality of semiconductor dice to the plurality of frames; and

securing a window substrate over the upper surface of the frame structure and over the apertures of the plurality of frames.

158. The method of claim 157, further comprising:

cutting the frame structure and window substrate between adjacent frames along centers of the kerfs and through a remaining thickness of the wafer to singulate the frames of the plurality with a semiconductor die secured therein and windows secured thereover and provide a skirt at a lower extent of the singulated frames of the plurality extending at least partially over a lateral side of the semiconductor die to form a semiconductor die package.

159. A method for packaging a semiconductor die, comprising:

providing a wafer bearing a plurality of semiconductor dice on an active surface thereof;

providing a frame structure including a plurality of frames, each frame of the plurality including an aperture extending therethrough between an upper surface and a lower surface of the frame structure;

aligning the frame structure with the active surface of the wafer and securing the lower surface of the frame structure to the active surface of the wafer, each aperture of a frame exposing a semiconductor die of the plurality; and

securing a window substrate over the upper surface of the frame structure and over the apertures of the plurality of frames.

160. The method of claim 159, further comprising:

cutting the frame structure and window substrate between adjacent frames along streets lying between semiconductor dice of the plurality and through a thickness of the wafer to singulate the frames of the plurality with a semiconductor die secured thereto and windows secured thereover to form a semiconductor die package.

161. A method for packaging a semiconductor die, comprising:

providing a wafer bearing a plurality of semiconductor dice on an active surface thereof;

providing a frame structure including a plurality of frames, each frame of the plurality including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and at least one upper step extending peripherally about the aperture;

aligning the frame structure with the active surface of the wafer and securing the lower surface of the frame structure to the active surface of the wafer, each aperture of a frame exposing a semiconductor die of the plurality; and

securing windows in at least some of the apertures with surfaces of the windows substantially abutting surfaces of the at least one upper step.

162. The method of claim 161, further comprising:

cutting the frame structure between adjacent frames along streets lying between semiconductor dice of the plurality and through a thickness of the wafer to singulate the frames of the plurality with a semiconductor die secured thereto and windows secured therein to form a semiconductor die package.

163. An image sensor package, comprising:

a rectangular frame having upper and lower surfaces and substantially planar outer side surfaces;

an aperture extending from the upper surface to the lower surface and having a lower inverted step surrounding the aperture;

a semiconductor die having an active surface including an optically active region and bond pads disposed peripherally with respect thereto, a back side and lateral sides, the semiconductor die substantially disposed in the aperture with the active surface joined to the lower inverted step, the lateral sides substantially covered by a skirt portion of the frame; and

an optically transmissive window disposed over and secured to the upper surface of the rectangular frame.

164. An image sensor package, comprising:

a rectangular frame having upper and lower surfaces and substantially planar outer side surfaces;

an aperture extending from the upper surface to the lower surface;

a semiconductor die having an active surface including an optically active region and bond pads disposed peripherally with respect thereto, a back side and lateral sides, the semiconductor die substantially disposed under the aperture with the active surface abutting and secured to the lower surface of the rectangular frame; and

an optically transmissive window disposed over and secured to the upper surface of the rectangular frame.

165. A method for packaging a semiconductor die, comprising:

providing a frame structure including a plurality of frames, each frame of the plurality including an aperture extending therethrough between an upper surface and a lower surface of the frame structure and each aperture having a first step extending peripherally thereabout;

securing a semiconductor die in the aperture of at least one frame of the plurality of frames with a back side of the semiconductor die substantially abutting a surface of a first step and lateral sides thereof received within the aperture; and

securing a window substrate over the upper surface of the frame structure over the aperture of the frames.

166. The method of claim 165, further comprising:

cutting the frame structure between adjacent frames to singulate the at least one frame with the semiconductor die secured therein and a window secured thereover and provide a skirt at a lower extent of the singulated at least one frame extending at least partially over a lateral side of the semiconductor die to form a semiconductor die package.

167. An image sensor package, comprising:

a rectangular frame having upper and lower surfaces and substantially planar outer side surfaces;

an aperture extending from the upper surface to the lower surface and having at least a first step surrounding the aperture;

a semiconductor die having an surface including an optically active region, a back side and lateral sides, the semiconductor die substantially disposed in the aperture with the back side joined to the at least a first step, the lateral sides substantially covered by a skirt portion of the frame; and

an optically transmissive window disposed over and secured to the upper surface of the rectangular frame.