Fluxless solder transfer and reflow process

• US 20060035454A1
• Filed: 02/01/2005
• Published: 02/16/2006
• Est. Priority Date: 08/16/2004
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Gruber, Peter A., Tessler, Christopher L., Belanger, Luc, Oberson, Valerie
• Granted Patent: US 7,332,424 B2
• Time in Patent Office: Days
• US Class Current: 438/616
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05027 the internal layer extending out of an opening
• CPC Class Codes: H01L 2224/0508 being stacked
• CPC Class Codes: H01L 2224/05099 Material
• CPC Class Codes: H01L 2224/05572 the external layer extending out of an opening
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05647 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/11 Manufacturing methods
• CPC Class Codes: H01L 2224/11003 for holding or transferring the bump preform
• CPC Class Codes: H01L 2224/111 Manufacture and pre-treatment of the bump connector preform
• CPC Class Codes: H01L 2224/13109 Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13111 Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13113 Bismuth [Bi] as principal constituent
• CPC Class Codes: H01L 2224/13116 Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13139 Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/94 at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 24/05 of an individual bonding area
• CPC Class Codes: H01L 24/11 Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H05K 2203/0113 : Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
• CPC Class Codes: H05K 2203/0338 : Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component affixing a prefabricated conductor pattern H05K3/20
• CPC Class Codes: H05K 2203/043 : Reflowing of solder coated conductors, not during connection of components, e.g. reflowing solder paste
• CPC Class Codes: H05K 2203/087 : Using a reactive gas
• CPC Class Codes: H05K 2203/1157 : Using means for chemical reduction
• CPC Class Codes: H05K 2203/128 : Molten metals, e.g. casting thereof, or melting by heating and excluding molten solder spraying droplets of molten metal H05K2203/1344
• CPC Class Codes: H05K 3/3468 : Applying molten solder

Abstract

Disclosed is a new process that permits the transfer and reflow of solder features produced by Injection Molded Solder (IMS) from a mold plate to a solder receiving substrate without the use of flux. Several embodiments produce solder transfer and reflow separately or together and use either formic acid vapor or partial concentration of hydrogen, both in nitrogen, as the oxide reducing atmosphere. A final embodiment produces fluxless transfer and reflow in only nitrogen through the use of ultrasonic vibration between the solder filled mold plate and solder receiving substrate.

Claims

1. A process for transfer of molten solder from cavities in a mold plate to wettable pads on a substrate without the use of flux, the process comprising the steps of:

aligning the mold plate with the substrate, whereby the solder in the cavities is in contact with the wettable pads of the substrate;

placing the mold plate and the substrate into an oxide reducing atmosphere;

heating the substrate above the melting temperature of the solder, whereby an oxide which may have formed on the wettable pads is removed thereby permitting wetting of the solder to the wettable pads;

cooling the substrate to solidify solder and thereafter removing the mold plate from the substrate while leaving behind the solder on the wettable pads;

reheating said substrate in said oxide reducing atmosphere whereby the solder may reflow into a spherical shape; and

cooling the substrate to solidify the solder in the spherical shape.

2. A process according to claim 1, wherein the solder is a solder alloy having a melting temperature below about 280-300°

C. and the oxide reducing atmosphere comprises formic acid vapor.

3. A process according to claim 1, wherein the solder is a solder alloy having a melting temperature above about 280-300°

C. and the oxide reducing atmosphere comprises a partial concentration of hydrogen gas in nitrogen.

4. A process according to claim 1, wherein the solder is a solder alloy having a melting temperature above about 280-300°

C. and the oxide reducing atmosphere comprises substantially 100% hydrogen gas.

5. A process according to claim 1, wherein the mold plate and the substrate are aligned using a precision fixtured standoff which is bridged by reflowing the solder after the oxide has been removed and a metallurgical bond to the wettable pads on the substrate has occurred.

6. A process according to claim 5, wherein the precision fixtured standoff is between 20-30 microns.

7. A process according to claim 1, further comprising the steps of:

attaching the mold plate to a precision Z actuator, wherein the mold plate is initially positioned to laterally align the wettable pads of the substrate to solder filled cavities of the mold plate and the mold plate is vertically separated from said substrate by a distance greater than 200 microns; and

bringing the reflowed solder into contact with the wettable pads by moving the mold plate on the Z actuator towards the substrate whereby a metallurgical joint is produced and the solder is transferred from cavities of the mold plate to the wettable pads.

8. A process according to claim 7, wherein the reflowed solder in the mold plate cavities initially contacts center points of the wettable pads and thereafter expands radially outward on the wettable pads to exclude gas voids at an interface of the reflowed solder and the wettable pads.

9. A process according to claim 1, further comprising the steps of:

attaching the mold plate to a precision Z actuator, wherein the mold plate is first aligned to the substrate so that solder in the cavities is in abutting contact with the wettable pads;

heating the substrate in an oxide reducing atmosphere to produce wetting of the solder in the cavities to the wettable pads;

moving the mold plate away from the substrate while keeping the substrate and the mold plate above the solder melting temperature so that the solder spheridizes while molten.

10. A process for transferring molten solder from cavities in a mold plate to wettable pads on a substrate, the process comprising the steps of:

aligning the mold plate to the substrate so that said solder in the cavities is in abutting contact with the wettable pads;

placing the mold plate and substrate in a nitrogen atmosphere, wherein said mold plate is attached to an actuator capable of providing lateral motion at ultrasonic frequencies and vertical Z motion;

heating the mold plate and substrate above the melting temperature of the solder;

abrasively removing an oxide which may have formed through vibrational contact with the wettable pads thereby permitting wetting of the solder to the wettable pads;

moving the mold plate away from the substrate through the Z actuator allowing solder to reflow and spheridize; and

cooling the substrate to solidify the solder in the spherical shape.