Textile fabric structure

• US 20060035554A1
• Filed: 08/19/2005
• Published: 02/16/2006
• Est. Priority Date: 02/21/2003
• Status: Abandoned Application

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Jung, Stefan, Lauterbach, Christl, Glaser, Rupert Hermann Josef
• Application Number:
  US11/207,599
• Publication Number:
  US 20060035554A1
• Time in Patent Office: Days
• US Class Current: 442/301
• CPC Class Codes: D02G 3/441 Yarns or threads with antistatic, conductive or radiation-shielding properties electroconductive, anti-static or radiation-shielding filaments D01F1/09, D01F1/106; anti-static fabrics D03D15/533; conducting, insulating or anti-static layers for floor coverings D06N7/0042
• CPC Class Codes: D03D 1/0088 Fabrics having an electronic function
• CPC Class Codes: D03D 15/258 Noble metal
• CPC Class Codes: D03D 15/547 with optical functions other than colour, e.g. comprising light-emitting fibres
• CPC Class Codes: D03D 15/67 Metal wires
• CPC Class Codes: D10B 2101/12 Carbon; Pitch
• CPC Class Codes: D10B 2101/20 Metallic fibres
• CPC Class Codes: D10B 2401/16 antistatic; conductive
• CPC Class Codes: D10B 2401/20 optical
• CPC Class Codes: D10B 2503/04 Floor or wall coverings; Carpets
• CPC Class Codes: H05K 1/0274 Optical details, e.g. printed circuits comprising integral optical means H05K1/0269 takes precedence; coupling light guides with opto-electronic components G02B6/42
• CPC Class Codes: H05K 1/038 Textiles used as reinforcing materials for organic insulating substrates H05K1/0366
• CPC Class Codes: H05K 2201/0281 Conductive fibers
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: Y10T 442/30 Woven fabric [i.e., woven strand or strip material]
• CPC Class Codes: Y10T 442/3976 Including strand which is stated to have specific attributes [e.g., heat or fire resistance, chemical or solvent resistance, high absorption for aqueous composition, water solubility, heat shrinkability, etc.]

Abstract

A textile fabric structure having a plurality of microelectronic components, which are arranged in the textile fabric structure, electrically conductive threads, which couple the plurality of microelectronic components to one another, conductive data transmission threads, which couple the plurality of microelectronic components to one another, and electrically nonconductive threads. The conductive threads and the conductive data transmission threads at the edge of the textile fabric structure are each provided with an electric interface and a data transmission interface.

Claims

1. A textile fabric structure comprising:

a plurality of microelectronic components, which are arranged in the textile fabric structure;

electrically conductive threads, which couple the plurality of microelectronic components to one another;

conductive data transmission threads, which couple the plurality of microelectronic components to one another; and

electrically nonconductive threads,

wherein the conductive threads and the conductive data transmission threads at the edge of the textile fabric structure are each provided with an electric interface and a data transmission interface.

2. The textile fabric structure as claimed in claim 1, wherein the electrically conductive threads are used to supply power to the plurality of microelectronic components.

3. The textile fabric structure as claimed in claim 1, wherein the conductive data transmission threads are electrically conductive.

4. The textile fabric structure as claimed in claim 1, wherein the conductive data transmission threads are optically conductive.

5. The textile fabric structure as claimed in claim 1, wherein the plurality of microelectronic components are arranged in a regular grid in the textile fabric structure.

6. The textile fabric structure as claimed in claim 1, wherein each of the plurality of microelectronic components is coupled on a plurality of sides to the conductive threads and the conductive data transmission threads.

7. The textile fabric structure as claimed in claim 1, wherein the microelectronic components are processor units.

8. The textile fabric structure as claimed in claim 7, wherein at least one sensor is coupled to the plurality of processor units.

9. The textile fabric structure as claimed in claim 1, further comprising at least one of an imaging element, a sound wave generating element, and a vibration generating element, coupled to at least some of the plurality of microelectronic components.

10. The textile fabric structure as claimed in claim 1, wherein the plurality of microelectronic components are set up such that, in order to determine a respective distance of a first microelectronic component from a reference position, electronic messages are exchanged between the first microelectronic component and a second adjacent microelectronic component of the textile fabric structure, each message containing an item of distance information which specifies a distance of a microelectronic component sending the message or a microelectronic component receiving the message from the reference position, and

wherein the plurality of microelectronic components are set up such that the individual distance from the reference position is determined or stored from the distance information of a received message.

11. A surface covering structure, wherein a surface covering is fixed on a textile fabric structure as claimed in claim 1.

12. The surface covering structure as claimed in claim 11, wherein the fixing is carried out by means of at least one of adhesive bonding, laminating, and vulcanizing.

13. The surface covering structure as claimed in claim 11, wherein the surface covering structure is formed as a structure selected from the group consisting of a wall covering structure, a floor covering structure, and a ceiling covering structure.

14. The surface covering structure as claimed in claim 11, wherein a textile layer interspersed uniformly with electrically conductive wires is applied at least over subregions of the textile fabric structure.

15. A method for determining the interspacing of the microelectronic components of the textile fabric structure as claimed in claim 1 and at least one reference position by exchanging electronic messages between mutually adjacent microelectronic components, the method comprising the steps of:

generating a first message by a first microelectronic component, the first message containing a first item of distance information, which contains a distance of the first microelectronic component or a distance of a second microelectronic component receiving the first message from the reference position;

sending the first message by the first microelectronic component to the second microelectronic component;

determining or storing, depending on the distance information, the distance of the second microelectronic component from the reference position;

generating a second message by the second microelectronic component, wherein the second message contains a second item of information, which contains the distance of the second microelectronic component or a distance of a third microelectronic component receiving the second message from the reference position;

sending the second message by the second microelectronic component to the third microelectronic component; and

determining or storing, depending on the second item of distance information, the distance of the third microelectronic component from the reference position,

wherein the method steps are carried out for all of the microelectronic components of the textile fabric structure.

16. The method as claimed in claim 15, further comprising the step of:

before determining the distance of the microelectronic components from the reference position, determining local positions of the microelectronic components within the textile fabric structure by, starting from a microelectronic component at an initiation point of the textile fabric structure, in each case position determining messages, which have at least one row parameter z and one column parameter s, which contain the row number and column number of the microelectronic component sending the message or the row number and column number of the microelectronic component receiving the message within the textile fabric structure, are transmitted to adjacent microelectronic components of the textile fabric structure and the following steps are carried out by the respective microelectronic component;

if the row parameter in the message received is higher than a previously stored row number of the microelectronic component, assigning the individual row number of the microelectronic component to the row parameter value z of the message received;

if the column parameter in the message received is higher than the individual column number of the microelectronic component, then the stored column number is assigned the column parameter value of the message received; and

if the individual row number and/or the individual column number has been changed on account of the method steps depicted above, then generating new position measurement messages with new row parameters and new column parameters, which in each case contain the row number and column number of the microelectronic component sending the message or the row number and column number of the microelectronic component receiving the message, and transmitting these row and column numbers an adjacent microelectronic component of the textile fabric structure.

17. The method as claimed in claim 15,

wherein, in an iterative method, an individual distance value of the microelectronic component of the textile fabric structure is changed if a previously stored distance value is greater than a distance value received in the respectively received message and increased by a predefined value, and

wherein, for a case in which a microelectronic component of the textile fabric structure changes the individual distance value, this microelectronic component generates and sends a distance measurement message to adjacent microelectronic components of the textile fabric structure, the distance measurement message in each case containing the individual distance as an item of distance information or the distance value of the receiving microelectronic component from the portal processor.

18. The method as claimed in claim 17, wherein the distance value has a value increased by a value increased by a predefined value with respect to the individual distance value.

19. A textile fabric structure comprising:

a plurality of microelectronic components arranged in the textile fabric structure;

electrically conductive thread means for coupling the plurality of microelectronic components to one another; and

conductive data transmission thread means for coupling the plurality of microelectronic components to one another,

wherein the conductive thread means and the conductive data transmission thread means at the edge of the textile fabric structure are each provided with an electric interface and a data transmission interface.

20. The textile fabric structure as claimed in claim 19, wherein each of the plurality of microelectronic components is coupled on a plurality of sides to the conductive thread means and the conductive data transmission thread means.

21. The textile fabric structure as claimed in claim 19, wherein the microelectronic components are processor means.

22. The textile fabric structure as claimed in claim 21, wherein at least one sensor is coupled to the plurality of processor means.

23. A system for determining the interspacing of the microelectronic components of the textile fabric structure as claimed in claim 19 and at least one reference position by exchanging electronic messages between mutually adjacent microelectronic components, the system comprising:

means for generating a first message by a first microelectronic component, the first message containing a first item of distance information, which contains a distance of the first microelectronic component or a distance of a second microelectronic component receiving the first message from the reference position;

means for sending the first message by the first microelectronic component to the second microelectronic component;

means for determining or storing, depending on the distance information, the distance of the second microelectronic component from the reference position;

means for generating a second message by the second microelectronic component, wherein the second message contains a second item of information, which contains the distance of the second microelectronic component or a distance of a third microelectronic component receiving the second message from the reference position;

means for sending the second message by the second microelectronic component to the third microelectronic component; and

means for determining or storing, depending on the second item of distance information, the distance of the third microelectronic component from the reference position.