Heat-dissipating device with heat pipe

• US 20060037738A1
• Filed: 12/29/2004
• Published: 02/23/2006
• Est. Priority Date: 08/23/2004
• Status: Abandoned Application

• Current Assignee: Inventec Corporation
• Original Assignee: Inventec Corporation
• Inventors: Lin, Mao-Ching, Li, Chin-Yuan
• Application Number:
  US11/023,500
• Publication Number:
  US 20060037738A1
• Time in Patent Office: Days
• US Class Current: 165/104.330
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat-dissipating device with heat pipe includes a base having a plurality of pipe spaces therein; a plurality of heat pipes vertically mounted on the base and connected to the pipe spaces respectively; a working fluid filled in the pipe spaces; and a plurality of heat-dissipating fins attached to the plurality of heat pipes and spaced from each other by a predetermined distance. This heat-dissipating device can achieve heat dissipation without bending the heat pipes.

Claims

1. A heat-dissipating device with heat pipe, comprising:

a base having at least one pipe space therein;

a plurality of heat pipes vertically mounted on the base and connected to the pipe space respectively;

a working fluid filled in the pipe space; and

a plurality of heat-dissipating fins attached to the plurality of heat pipes and spaced from each other by a predetermined distance.

2. The heat-dissipating device with heat pipe of claim 1, wherein the working fluid is one selected from the group consisting of liquid water, mercury, potassium, sodium, acetone, liquid nitrogen and alcohol.

3. The heat-dissipating device with heat pipe of claim 1, wherein the base is formed with a plurality of the pipe spaces arranged in parallel therein.

4. The heat-dissipating device with heat pipe of claim 1, wherein an inner wall of the pipe space has a capillary structure.

5. The heat-dissipating device with heat pipe of claim 1, wherein an inner wall of each of the heat pipes has a capillary structure.

6. The heat-dissipating device with heat pipe of claim 1, wherein the heat pipes are welded to the base.

7. The heat-dissipating device with heat pipe of claim 1, wherein the plurality of heat pipes are arranged in parallel.

8. The heat-dissipating device with heat pipe of claim 1, wherein the plurality of heat-dissipating fins are spaced from each other by a constant distance.

9. The heat-dissipating device with heat pipe of claim 1, wherein the plurality of heat-dissipating fins are arranged in parallel.

10. A heat-dissipating device with heat pipe, comprising:

a base having at least one pipe space therein;

at least one heat pipe horizontally connected to the pipe space;

a working fluid filled in the pipe space; and

a plurality of heat-dissipating fins attached to the heat pipe and spaced from each other by a predetermined distance.

11. The heat-dissipating device with heat pipe of claim 10, wherein the working fluid is one selected from the group consisting of liquid water, mercury, potassium, sodium, acetone, liquid nitrogen and alcohol.

12. The heat-dissipating device with heat pipe of claim 10, wherein the base is formed with a plurality of the pipe spaces arranged in parallel therein.

13. The heat-dissipating device with heat pipe of claim 10, wherein an inner wall of the pipe space has a capillary structure.

14. The heat-dissipating device with heat pipe of claim 10, wherein an inner wall of the heat pipe has a capillary structure.

15. The heat-dissipating device with heat pipe of claim 10, wherein the heat pipe is horizontally inserted into the pipe space of the base.

16. The heat-dissipating device with heat pipe of claim 10, wherein the heat pipe is welded to the base.

17. The heat-dissipating device with heat pipe of claim 10, wherein the plurality of heat-dissipating fins are spaced from each other by a constant distance.

18. The heat-dissipating device with heat pipe of claim 10, wherein the plurality of heat-dissipating fins are arranged in parallel.