Terahertz interconnect system and applications

• US 20060038168A1
• Filed: 10/24/2005
• Published: 02/23/2006
• Est. Priority Date: 05/21/2001
• Status: Abandoned Application

• Current Assignee: The Board of Regents of the University of Colorado (University of Colorado System)
• Original Assignee: The Board of Regents of the University of Colorado (University of Colorado System)
• Inventors: Estes, Michael J., Moddel, Garret
• Application Number:
  US11/258,297
• Publication Number:
  US 20060038168A1
• Time in Patent Office: Days
• US Class Current: 257/25
• CPC Class Codes: B82Y 10/00 Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
• CPC Class Codes: B82Y 20/00 Nanooptics, e.g. quantum optics or photonic crystals
• CPC Class Codes: G02B 2006/12123 Diode
• CPC Class Codes: G02B 2006/1213 comprising photonic band-gap structures or photonic lattices
• CPC Class Codes: G02B 2006/12142 Modulator
• CPC Class Codes: G02B 6/12004 Combinations of two or more optical elements
• CPC Class Codes: G02B 6/1226 involving surface plasmon interaction
• CPC Class Codes: G02B 6/34 utilising prism or grating G02B6/293 takes precedence
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4279 Radio frequency signal propagation aspects of the electrical connection, high frequency adaptations
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: G02B 6/43 Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
• CPC Class Codes: H01L 2225/06513 Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06534 Optical coupling
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 31/035236 Superlattices; Multiple quantum well structures
• CPC Class Codes: H01L 31/06 : characterised by potential barriers
• CPC Class Codes: H01L 31/101 : Devices sensitive to infrared, visible or ultraviolet radiation
• CPC Class Codes: Y02E 10/50 : Photovoltaic [PV] energy

Abstract

An assembly includes a first electrical circuitry for providing a first electrical signal containing data and a transmitting arrangement, connected with the first electrical circuitry, for receiving the first electrical signal and for converting the first electrical signal into an electromagnetic signal containing at least a portion of the data. The electromagnetic signal has a carrier frequency greater than 300 GHz. The assembly also includes a receiving arrangement for receiving the electromagnetic signal and for converting the electromagnetic signal into a second electrical signal containing at least some of the portion of the data, and a second electrical circuitry connected with the receiving arrangement and configured for receiving the second electrical signal.

Claims

1. An assembly comprising:

a first substrate supporting

a first electrical circuitry for providing a first electrical signal containing data, and

a transmitting arrangement connected with said first electrical circuitry configured for receiving said first electrical signal, and converting said first electrical signal into an electromagnetic signal containing at least a portion of the data, said electromagnetic signal having a carrier frequency greater than 300 GHz;

a second substrate, separate from said first substrate, supporting

a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data, and

a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal wherein said transmitting and receiving arrangements are configured to cooperate with one another such that said transmitting arrangement conveys said electromagnetic signal to said receiving arrangement by free-space transmission.

2. An assembly comprising:

a first substrate supporting

a first electrical circuitry for providing a first electrical signal containing data;

a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data, said electromagnetic signal having a carrier frequency greater than 300 GHz;

a second substrate, separate from said first substrate, supporting

a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data;

a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal; and

a directing configuration cooperating with said transmitting arrangement and said receiving arrangement such that said electromagnetic signal is guided therebetween along a predetermined path that is defined, at least in part, using a waveguide wherein said waveguide includes a first segment connected with said transmitting arrangement and a second, distinct segment connected with said receiving arrangement such that said first segment of said waveguide is supported by said first substrate and said second, distinct segment is supported by said second substrate.

3. An assembly comprising:

a first substrate configured for supporting

a first electrical circuitry for providing a first electrical signal containing data;

a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data

a second substrate, separate from said first substrate, configured for supporting

a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data, said receiving arrangement being configured to cooperate with the transmitting arrangement to convey said electromagnetic signal therebetween using free-space transmission, and

a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,

wherein at least one of said transmitting and receiving arrangements includes an electron tunneling device, said electron tunneling device including first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured such that said transport of electrons produces electron tunneling between said first and second non-insulating layers.

4. An assembly comprising:

a first substrate configured for supporting

a first electrical circuitry for providing a first electrical signal containing data,

a transmitting arrangement connected with said first electrical circuitry and configured for receiving said first electrical signal and for converting said first electrical signal into an electromagnetic signal containing at least a portion of said data;

a second substrate configured for supporting

a receiving arrangement configured for receiving said electromagnetic signal and for converting said electromagnetic signal into a second electrical signal containing at least some of said portion of said data, and

a second electrical circuitry connected with said receiving arrangement and configured for receiving said second electrical signal,

wherein at least one of said transmitting and receiving arrangements includes an electron tunneling device, said electron tunneling device including first and second non-insulating layers spaced apart from one another such that a given voltage can be provided across the first and second non-insulating layers, and an arrangement disposed between the first and second non-insulating layers and configured to serve as a transport of electrons between and to said first and second non-insulating layers, said arrangement including at least a first layer configured for producing electron tunneling between said first and second non-insulating layers; and

a directing configuration cooperating with said transmitting arrangement and said receiving arrangement such that said electromagnetic signal is conveyed therebetween along a predetermined path using a waveguide for defining at least a portion of said predetermined path, said waveguide including a first segment connected with said transmitting arrangement and a second, distinct segment connected with said receiving arrangement.

5. In a system including an integrated circuit package, which integrated circuit package includes an integrated circuit module configured for providing an output electrical signal containing output data, an assembly for receiving said integrated circuit module and extracting said output data, said assembly comprising:

an electrical interconnect having first and second ends, said first end being connected with said integrated circuit module through said integrated circuit package and configured to receive said output electrical signal at said first end such that said output electrical signal is directed through said electrical interconnect to said second end;

a transceiver package including a transceiver chip, said transceiver chip being connected with said second end of said electrical interconnect and configured for receiving said output electrical signal, converting said output electrical signal into an output electromagnetic signal containing at least a portion of said output data, and directing said output electromagnetic signal away from said transceiver package;

a substrate for supporting said electrical interconnect and said transceiver package; and

a transmission line having a first segment and a distinct, second segment, at least said first segment also being supported on said substrate, said distinct, second segment being located away from said transceiver package,

wherein said transceiver chip is further configured for directing at least a portion of said output electromagnetic signal into said first segment of said transmission line, and wherein said first segment of said transmission line is configured for receiving said portion of said output electromagnetic signal and directing said portion of said output electromagnetic signal to said second, distinct segment of said transmission line and, consequently, away from said transceiver package.